• The Korean Journal of Ceramics
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• v.3 no.1
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• pp.18-20
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• 1997

The fabrication process of silicon-diamond(SOD) structure wafer were studied. Microwave plasma chemical vapor deposition (MWPCVD) and annealing technology were used to synthesize diamond film with high resistivity and thermal conductivity. Bonding and etchback silicon-on-diamond (BESOD) were utilized to form supporting substrate and single silicon thin layer of SOD wafer. At last, a SOD structure wafer with 0.3~1$\mu\textrm{m}$ silicon film and 2$\mu\textrm{m}$ diamond film was prepared. The characteristics of radiation for a CMOS integrated circuit (IC) fabricated by SOD wafer were studied.

• Current Applied Physics
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• v.18 no.11
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• pp.1410-1414
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• 2018

Magnetic nanoparticles (MNP) have attracted considerable interest in many fields of research and applied science due to their impressive properties. In the past, especially biomedical problems have promoted the development of MNPs. For technical applications e.g. wastewater treatment and absorption of electromagnetic waves, the existing synthesis approaches are too expensive and/or the producible quantities are too low. In this work we present a method for simple preparation of size-controlled magnetic iron oxide nanoparticles by electroerosion dispersion (EED) of carbon steel in water. We describe the synthesis method, the laboratory installation and discuss the structural, chemical and electromagnetic properties of the synthetized EED powders as well as their applicability for microwave absorption compared to other available ferrite powders.

• Journal of the Korean institute of surface engineering
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• v.46 no.2
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• pp.55-60
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• 2013

Superhard TiN coatings were fabricated by DC and ICP (inductively coupled plasma) assisted magnetron sputtering techniques. The effect of ICP power, ranging from 0 to 300 W, on coating microstructure, preferred orientation mechanical properties were systematically investigated with HR-XRD, SEM, AFM and nanoindentation. The results show that ICP power has a significant influence on coating microstructure and mechanical properties of TiN coatings. With the increasing of ICP power, coating microstructure evolves from the columnar structure of DC process to a highly dense one. Grain sizes of TiN coatings were decreased from 12.6 nm to 8.7 nm with increase of ICP power. The maximum nanohardness of 67.6 GPa was obtained for the coatings deposited at ICP power of 300 W. Preferred orientation in TiN coatings also vary with ICP power, exerting an effective influence on film nanohardness.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2009.10a
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• pp.163-164
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• 2009

dc unbalanced magnetron sputtering 방법으로 superhard quarternary Ti-B-C-N films을 합성하였다. XPS, XRD 분석 결과 Ti-B-C-N films은 solid-solution (Ti,C,N)$B_2$와 Ti(C,N) 결정이 amorphous BN에 분포된 나노 복합체를 형성하였다. 여기에서는 film내 N의 양에 따라 강도가 증가하다가 그 후 감소하는 경향을 보였다.

• Journal of the Korean institute of surface engineering
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• v.36 no.1
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• pp.22-26
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• 2003

This short communication reports on the experiment which demonstrates that superhard nanostructured films with hardness of about 40 GPa and greater can be composed not only of two or more nanocrystalline and/or amorphous phases of different materials, as it is in the case of nanocomposite coatings, but also that can be formed by a mixture of small (<10 nm) nanocrystalline grains of the same material with different crystallographic orientation and/or lattice structures. This finding opens new possibilities to develop advanced nanostructured materials with enhanced physical and functional properties.

• Journal of the Korean institute of surface engineering
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• v.34 no.5
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• pp.429-434
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• 2001

Ti-Cu-N nanocomposite films deposited by arc ion plating and magnetron sputter hybrid system with various copper contents. The microstructure and mechanical properties of Ti-Cu-N superhard nanocomposite films depend on the Cu concentration. In X-ray diffraction (XRD) analysis, intensity of TiN (111) and TiN (220) peak decreased and peak broadness increased with increasing the copper contents and Cu peak was not detected. The grain size of films decreased with increasing at%Cu and Transmission Electron Microscopy (TEM) analysis also showed that Ti-Cu-N film containing 1.5at%Cu was composed of very fine (<10nm) nanocrystalline grains. The maximum hardness of Ti-Cu-N (1.5at%Cu) film reached to 45GPa and friction coefficient was measured 0.3.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2006.10a
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• pp.55-55
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• 2006

• Journal of the Korea Academia-Industrial cooperation Society
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• v.9 no.2
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• pp.298-302
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• 2008

This study was carried out to evaluate brazing characteristics of the braze joint between superhard alloy particles and carbon steel. Two types of insert metals that made by mechanical alloying process were selected for this study. One is composed of Cu, Zn and Ag(MIM-1) and the other one is composed of Cu, Zn, Ag and Cd.(MIM-2) The chemical compositions of these insert metals were similar to AWS BAg-20 and BAg-2a system. And the commercial insert metals(CIM-1, CIM-2) were also evaluated for the comparative study. The characterization of the insert metals were conducted by wettability tests, shear tensile test and microstructural analyses. The results indicated that wettability tests displayed that MIM-1 and CIM-1 insert metals had the larger wetting angle than MIM-2 and CIM-2 and the wetting angle of the MIM-1 showed higher value than that of CIM-1. However these values are less than $25^{\circ}$ that is recommended for standard value for usual insert metals. The highest value of shear tensile tests was obtained from the brazed joint that made by MIN-1 and the value was $2.29{\times}10^2MPa$. This value is appeared to be higher or same as the commercial insert metals. The microstructures of the inserts metals were composed of Cu-rich proeutectic structure for matrix and Ag-rich eutectic structure. The braze joint between superhard alloy particles and carbon steel produced by the MIM-1(Ag-Cu-Zn) system showed sound joint showing stable microstructures. However there was also some porosities at the interface.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2005.11a
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• pp.115-115
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• 2005

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.1321-1321
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• 2006