The effect of metal composition on the structure and properties of Ti-Cu-N superhard nanocomposite coatings

  • Myung, Hyun S. (Center for Advanced Plasma Surface Technology(CAPST), Sungkyunkwan University) ;
  • Lee, Hyuk M. (Center for Advanced Plasma Surface Technology(CAPST), Sungkyunkwan University) ;
  • Han, Jeon G. (Center for Advanced Plasma Surface Technology(CAPST), Sungkyunkwan University)
  • Published : 2001.10.01

Abstract

Ti-Cu-N nanocomposite films deposited by arc ion plating and magnetron sputter hybrid system with various copper contents. The microstructure and mechanical properties of Ti-Cu-N superhard nanocomposite films depend on the Cu concentration. In X-ray diffraction (XRD) analysis, intensity of TiN (111) and TiN (220) peak decreased and peak broadness increased with increasing the copper contents and Cu peak was not detected. The grain size of films decreased with increasing at%Cu and Transmission Electron Microscopy (TEM) analysis also showed that Ti-Cu-N film containing 1.5at%Cu was composed of very fine (<10nm) nanocrystalline grains. The maximum hardness of Ti-Cu-N (1.5at%Cu) film reached to 45GPa and friction coefficient was measured 0.3.

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