• 제목/요약/키워드: Super Barrier Rectifier(SBR)

검색결과 3건 처리시간 0.016초

낮은 순방향 전압 강하를 갖는 4H-SiC Trench-type Accumulation Super Barrier Rectifier(TASBR) (4H-SiC Trench-type Accumulation Super Barrier Rectifier(TASBR) for Low Forward Voltage drop)

  • 배동우;김광수
    • 전기전자학회논문지
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    • 제21권1호
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    • pp.73-76
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    • 2017
  • 실리콘카바이드 소자는 넓은 밴드갭을 갖는 물질로서 많은 주목을 받아왔다. 특히 4H-SiC 쇼트키 배리어 다이오드는 빠른 스위칭 속도와 낮은 순방향 전압강하의 특성으로 인해 널리 사용되고 있다. 그러나 쇼트키 배리어 다이오드의 낮은 신뢰성으로 인한 문제로 대안인 Super Barrier Rectifier(SBR)가 연구되었다. 본 논문은 4H-SiC trench-type accumulation super barrier rectifier(TASBR)를 분석하고 제안한다. 2D 시뮬레이션을 통해 본 구조는 심각한 역방향 저지전압의 감소와 누설전류의 증가가 없는 동시에 순방향 전압 강하는 21.06% 향상됨을 확인 할 수 있었다. 이러한 새로운 정류기 구조를 이용하면 전력손실이 적은 애플리케이션을 기대할 수 있다.

BCD Platform과의 집적화에 적합한 고성능 Lateral Super Barrier Rectifier의 연구 (A Study on High Performance Lateral Super Barrier Rectifier for Integration in BCD (Bipolar CMOS DMOS) Platform)

  • 김덕수;이희덕
    • 한국전기전자재료학회논문지
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    • 제28권6호
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    • pp.371-374
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    • 2015
  • This paper suggests a high performance lateral super barrier rectifier (Lateral SBR) device which has the advantages of both Schottky diode and pn junction, that is, low forward voltage and low leakage current, respectively. Advantage of the proposed lateral SBR is that it can be easily implemented and integrated in current BCD platform. As a result of simulation using TCAD, BVdss = 48 V, $V_F=0.38V$ @ $I_F=35mA$, T_j = $150^{\circ}C$ were obtained with very low leakage current characteristic of 3.25 uA.

Diode and MOSFET Properties of Trench-Gate-Type Super-Barrier Rectifier with P-Body Implantation Condition for Power System Application

  • Won, Jong Il;Park, Kun Sik;Cho, Doo Hyung;Koo, Jin Gun;Kim, Sang Gi;Lee, Jin Ho
    • ETRI Journal
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    • 제38권2호
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    • pp.244-251
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    • 2016
  • In this paper, we investigate the electrical characteristics of two trench-gate-type super-barrier rectifiers (TSBRs) under different p-body implantation conditions (low and high). Also, design considerations for the TSBRs are discussed in this paper. The TSBRs' electrical properties depend strongly on their respective p-body implantation conditions. In the case of the TSBR with a low p-body implantation condition, it exhibits MOSFET-like properties, such as a low forward voltage ($V_F$) drop, high reverse leakage current, and a low peak reverse recovery current owing to a majority carrier operation. However, in the case of the TSBR with a high p-body implantation condition, it exhibits pn junction diode.like properties, such as a high $V_F$, low reverse leakage current, and high peak reverse recovery current owing to a minority carrier operation. As a result, the TSBR with a low p-body implantation condition is capable of operating as a MOSFET, and the TSBR with a high p-body implantation condition is capable of operating as either a pn junction diode or a MOSFET, but not both at the same time.