• Journal of the Korean Electrochemical Society
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• v.5 no.1
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• pp.17-20
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• 2002

Various compositions of CoFeNi alloys have been electrodeposited in chloride bath and in sulfate bath, and evaluated for electrodeposition characteristics and magnetic properties. For electrodeposited CoFeNi thin film alloys, the increase of Fe content in the deposits from sulfate bath was considerably faster than those from chloride bath. The current efficiencies in sulfate bath showed observable decrease from $75\%\;to\;50\%$ while those in chloride bath showed no significant decrease. From the low coercivity of 3 Oe in the minimum and the higher squarenesses of the alloys from sulfate bath than those from chloride bath, the alloy at Co, Fe, and Ni contents of $80wt.\%,\;10wt.\%,\;and\;10wt.\%$ can be considered to be the best CoFeNi alloy in this research for the soft magnetic material.

• Journal of Surface Science and Engineering
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• v.37 no.1
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• pp.13-21
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• 2004

The deposition rate, the current efficiency and surface morphology of trivalent Cr deposits were investigated according to additives in sulfate bath and current density. The deposition rate of the Cr deposits plated from the formic acid complexed bath was noticeably higher than that of the glycine complexed bath. The current efficiency of the deposition from formic acid bath was higher than that of the glycine bath and increased with current density in the range of 20-50 A/d$\m^2$. The current efficiency of the deposition from the formic acid bath with boric acid buffer was higher than that of the bath with aluminum sulfate or boric acid-aluminum sulfate buffers. The nodular crystallite size of the Cr deposits increased with current density and the uniform and crack-free growth of the deposits for the aluminum sulfate was observed compared to the other buffers.

• Journal of Power System Engineering
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• v.5 no.1
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• pp.89-96
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• 2001

Decorative property of chromium deposition from oxalic acid bath containing chromium oxide and ammonium sulfate, has been examined over a wide range of bath compositions and plating conditions. The followings were determined as optimum bath composition, $CrO_3\;200{\sim}250g/{\ell},\;H_2C_2O_4{\cdot}2H_2O\;500{\sim}700g/{\ell},\;(NH_4){_2}SO_4\;40{\sim}120g/{\ell}$, and operation conditions; pH $2.0{\sim}2.5$, current density of $15{\sim}250Adm^2 $ at the bath temperatures of $30{\sim}80^{\circ}C$. Bright chromium deposits were obtained over a wide range of ammonium sulfate concentration, bath temperature, and current density. The current efficiency decreased with increasing current density and bath pH, and increased with Increasing bath temperature. The highest current efficiency was obtained in the bath containing $80g/{\ell}$ of ammonium sulfate. Bright chromium deposits were not obtained at conditions of all the highest current efficiencies.

• Journal of Surface Science and Engineering
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• v.33 no.5
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• pp.356-364
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• 2000

Factors that affect the hardness of the zinc electrodeposits in the sulfate electrolyte were investigated. The hardness of zinc deposit was enhanced by increasing the concentration of impurities such as iron and nickel in the bath that changed the crystallographic orientation of the zinc deposit from the strong basal plane to the random orientation. The increase of the concentration of sodium sulfate and current density in iron contained bath improved the hardness of zinc deposit because those were easily codeposited in zinc layer. However the increase of the concentration of sodium sulfate up to 80g/$\ell$ in the bath darkened the surface of zinc electrodeposits due to change of morphology by the codeposition of iron.

• Journal of Surface Science and Engineering
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• v.19 no.4
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• pp.140-148
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• 1986

Using sodium pyrophoshate as complexing agent, the characteristics and the magnetic properties of the films deposited from electroless cobalt plating bath have been studied. The result obtained are as following; 1. It was found that the optimum bath compositions consisted of 0.1M cobalt sulfate, 0.2M sodium hypophosphite as reducing agent, 0.4M sodium pyrophosphate as complexing agent and 0.5M ammonium sulfate as buffer agent, whereas good operating conditions were the bath of pH 10.5 adjusted with ammonia and 70$^{\circ}C$ of bath temperature, respectively. 2. The coercive force and the squareness of magnetic films were increased with deposition from the low temperature bath. 3. The phosphorous content in Co-P films deposited from these bath was relatively higher than that from Brenner bath. It was assumed to be due to codeposition of phosphorous from the pyrophosphate anion in the solution.

• Journal of Surface Science and Engineering
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• v.37 no.2
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• pp.92-98
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• 2004

The current efficiency and the microstructure of the trivalent Cr deposits plated in flow cell system were investigated according to additives in sulfate bath and current density. The current efficiency of the deposits plated in the formic acid complexed bath was noticeably higher than that of the deposits from glycine complexed bath. The current efficiency of the deposits from the complexed baths with boric acid buffer increased linearly with current density in the range of 60-100 A/dm$^2$, while that of the deposits from the baths with both Al sulfate and mixed buffers increased parabolically with current density. The nodular crystallite size of the deposits increased with current density, and the deposits plated in low current density region had relatively smooth surface appearance with fine grains. The structure of the deposits from the complexed baths with boric acid buffer changed from amorphous structure to crystalline one with strong (110)peak with increasing current density. The deposits from the baths with both Al sulfate and mixed buffers had generally amorphous structure.

• Journal of Surface Science and Engineering
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• v.31 no.1
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• pp.24-33
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• 1998

Effects of pH and supporting salts on the characteristics of electrogalvanzied coating in sulfate bath are investigated. The fine grain size is obtained and the whiteness with the amount of supporting salts or pH increased at more than current density of 100A/$dm^2$<\TEX>, With supporting salts increased, the electro-conductivity of the bulk solution increases and the cell voltage decreases, while the width of the cathode burned edge gets wider because it seems that the increased overpotential the vicinity of cathode causes the decreases, of limiting current density. When the amount of supporting salts or pH of sulfate bath decreases, the zinc crystals have preferred orientation (001) planes. However when the amount of supporting salts or pH increase, the crystal texture has less (001) planes and gets to have random crystal planes.

• Journal of Power System Engineering
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• v.5 no.3
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• pp.80-87
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• 2001

Decorative properties of chromium depositions from oxalic acid bath containing chromium oxide and ammonium sulfate have been examined over a wide range of bath compositions and plating conditions. The obtained results from this experiment are summarized as follow: The followings were determined as a optimum conditions, bath compositions; $CrO_3\;200{\sim}250\;g/{\ell},\;H_2C_2O_4{\cdot}2H_2O\;500{\sim}700\;g/{\ell},\;(NH_4)_2SO_4\;40{\sim}120\;g/{\ell}$, and operation conditions; pH $2.0{\sim}2.5$, current density $15{\sim}250\;A/dm^2$ at bath temperature range of $30{\sim}80^{\circ}C$. Bright chromium deposits were obtained over a wide range of ammonium sulfate concentration and bath temperature. Decorative property for chromium deposition was adopted to apply stoichiometric ratio of $CrO_3$ concentration and $H_2C_2O_4{\cdot}2H_2O$.

• Journal of Surface Science and Engineering
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• v.33 no.2
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• pp.126-134
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• 2000

This study investigated the bath compositions and plating conditions and crystal structure used for achieving nickel-thallium-phosphorus deposits by means electroless plating. The electroless nickel-thallium-phosphorus deposits were achieved with a bath using sodium hypophosphite as the reducing agent and sodium citrate as the complexing agent. The depositing rate was 10.5mg.$cm^{2-1}$ .$hr^{-1 }$ from the optimistic bath composition, 0.1M nickel sulfate, 0.005M thallium sulfate, 0.2M sodium hypophosphite, and 0.05M sodium citrat and the recommended plating conditions, pH 5.5 and $90^{\circ}C$. The composition of alloy deposits determined by X-ray analysis (EDS) that the Thallium was increased with major increasing concentration of complexing agent and thallium ion in bath solution, it decreased according to the increasing concentrations of reduction agent in the bath solution, Bit Phosphorus showed a contrary to the thallium. It was observed from X-ray diffraction analysis, Scanning Electron Microscopy and Transmission Electron Microscopy. The crystalline structure of deposits was amorphous at the first deposited state but it was changed $Ni-T1-Ni_{5}$ $P_2$ polycrystalline when subjected to 1 hour heat treatment of more than $350^{\circ}C$. TEM observation demonstrated that the microstructure was identical to the result of the XRD at as deposited but it became $Ni-Tl-Ni_{5}$ $P_2$ polycrystalline when heated. And grain size was 10-50nm.

• Korean Journal of Materials Research
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• v.11 no.10
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• pp.820-832
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• 2001

In order to obtain the basic data on the optimum conditions of electroforming process for fabricating the micro wiring pattern for plate type micro- motor core, characteristics of plating bath and properties of deposits were studied with various copper plating baths which contain sulfate, fluoborate, pyrophosphate and cyanide salt, respectively. Cathodic polarization, throwing power, internal stress, texture and surface morphology of deposits were observed. Throwing power of plating solution is deeply related to the polarization curves and the values are in the range of +20∼20%. The order of values ate as follows- pyrophosphate, cyanide, sulfate and fluoborate bath. Internal stresses of deposits are tensile in all of the copper plating bath. Thickness of the deposits plated at the center of holes has the highest value in the pyrophosphate bath and K factor, ratio of height and width of deposit, is 1.44. It was confirmed that the pyrophosphate bath was the best one for the electroforming of wire pattern.