• Proceedings of the KIEE Conference
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• 2005.07c
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• pp.1856-1858
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• 2005

In this study, Indium Tin Oxide(ITO) thin films were prepared at $O_2$ gas 0.2 sccm, no heating to substrate and working pressure 1mTorr with varying deposition time. We estimated structural, optical, electrical characteristics of ITO thin films as function of ITO thin films thickness. As a result, XRD peaks increased with increasing the thickness. The ITO thin film was fabricated with resistivity $4.23{\times}10^{-4}[{\Omega}{\cdot}cm]$, carrier mobility $52.9[cm^2/V{\cdot}sec]$, carrier concentration $2.79{\times}10^{20}[cm^{-3}]$. And we also observed that the SEM images of ITO thin films surface.

• Journal of the Semiconductor & Display Technology
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• v.16 no.4
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• pp.68-74
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• 2017

Nanoimprint lithography (NIL) is a next generation technology for fabrication of micrometer and nanometer scale patterns. There have been considerable attentions on NIL due to its potential abilities that enable cost-effective and high-throughput nanofabrication to the display device and semiconductor industry. Up to now there have been a lot of researches on thermal NIL, but most of them have been focused on polymer deformation in the molding process and there are very few studies on the cooling and demolding process. In this paper a cooling process of the polymer resist in thermal NIL is analyzed with finite element method. The modeling of cooling process for mold, polymer resist and substrate is developed. And the cooling process is numerically investigated with the effects of imprinting temperature and residual layer thickness of polymer resist on stress distribution of the polymer resist. The results show that the lower imprinting temperature, the higher the maximum von Mises stress and that the thicker the residual layer, the greater maximum von Mises stress.

• Journal of the Semiconductor & Display Technology
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• v.22 no.4
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• pp.19-25
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• 2023

With an attempt to investigate the correlation between the internal pressure distribution of slit nozzle and the thickness uniformity of slot-coated thin films, we have performed computational fluid dynamics (CFD) simulations of slit nozzles and slot coating of high-viscosity (4,800 cPs) polydimethylsiloxane (PDMS) using a gantry slot-die coater. We have calculated the coefficient of variation (CV) to quantify the pressure and velocity distributions inside the slit nozzle and the thickness non-uniformity of slot-coated PDMS films. The pressure distribution inside the cavity and the velocity distribution at the outlet are analyzed by varying the shim thickness and flow rate. We have shown that the cavity pressure uniformity and film thickness uniformity are enhanced by reducing the shim thickness. It is addressed that the CV value of the cavity pressure that can ensure the thickness non-uniformity of less than 5% is equal to and less than 1%, which is achievable with the shim thickness of 150 ㎛. It is also found that as the flow rate increases, the average cavity pressure is increased with the CV value of the pressure unchanged and the maximum coating speed is increased. As the shim thickness is reduced, however, the maximum coating speed and flow rate decrease. The highly uniform PDMS films shows the tensile strain as high as 180%, which can be used as a stretchable substrate.

• Corrosion Science and Technology
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• v.15 no.3
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• pp.120-124
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• 2016

The effect of alloying element Ca (0, 1, and 2 wt%) on corrosion resistance and bioactivity of the as-received and anodized surface of rolled plate AM60 alloys was investigated. A plasma electrolytic oxidation (PEO) was carried out to form anodic oxide film in $0.5mol\;dm^{-3}\;Na_3PO_4$ solution. The corrosion behavior was studied by polarization measurements while the in vitro bioactivity was tested by soaking the specimens in Simulated Body Fluid (1.5xSBF). Optical micrograph and elemental analysis of the substrate surfaces indicated that the number of intermetallic particles increased with Ca content in the alloys owing to the formation of a new phase $Al_2Ca$. The corrosion resistance of AM60 specimens improved only slightly by alloying with 2 wt% Ca which was attributed to the reticular distribution of $Al_2Ca$ phase existed in the alloy that might became barrier for corrosion propagation across grain boundaries. Corrosion resistance of the three alloys was significantly improved by coating the substrates with anodic oxide film formed by PEO. The film mainly composed of magnesium phosphate with thickness in the range $30-40{\mu}m$. The heat resistant phase of $Al_2Ca$ was believed to retard the plasma discharge during anodization and, hence, decreased the film thickness of Ca-containing alloys. The highest apatite forming ability in 1.5xSBF was observed for AM60-1Ca specimens (both substrate and anodized) that exhibited more degradation than the other two alloys as indicated by surface observation. The increase of surface roughness and the degree of supersaturation of 1.5xSBF due to dissolution of Mg ions from the substrate surface or the release of film compounds from the anodized surface are important factors to enhance deposition of Ca-P compound on the specimen surfaces.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.12
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• pp.1001-1007
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• 2001

In this study, high dielectric materials, (Pb,La)Ti $O_3$ thin films were fabricated by PLD (Pulsed Laser Deposition) method and investigated in terms of structural and electrical characteristics in order to develope the dielectric materials for the use of new capacitor layers of Giga bit-level DRAM. The deposition conditions were examined in order to fabricate uniform thin films through systematic changes of oxygen pressures and substrate temperature. The uniform thickness and smooth morphology of (P $b_{0.72}$L $a_{0.28}$)Ti $O_3$ thin films were obtained at the conditions of substrate-target distance 5.5[cm], laser energy density 2.1[J/$\textrm{cm}^2$], oxygen pressure 200[mTorr] and substrate temperature 500[$^{\circ}C$]. After the (P $b_{0.72}$L $a_{0.28}$)Ti $O_3$ thin films were fabricated under the above conditions, they were post-annealed by RTA process in order to increase the dielectric constant. The film thickness of 1200 [$\AA$] had dielectric constant 821. Assuming that operating voltage is 2V, leakage current density of (P $b_{0.72}$L $a_{0.28}$)Ti $O_3$ thin films would result into 10$^{-7}$ [A/$\textrm{cm}^2$] and satisfied the specification of 256M DRAM planar capacitor, 4$\times$10$^{-7}$ [A/$\textrm{cm}^2$]m}^2$]

• Proceedings of the KIEE Conference
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• 2006.10a
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• pp.202-203
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• 2006

In the AC PDP, the MgO film is used as electrode protective film. This film must provide excellent ion bombardment protection, high secondary electron emission, and should be high transparent to visible radiation. In this study, we investigated the relations between the crystal orientation and e-beam evaporation process parameters. The crystal orientation of the MgO layer depends on the conditions of deposition. The parameters are the thickness of the MgO film $1000{\AA}-6500{\AA}$, the deposition rate $200{\AA}/min{\sim}440{\AA}/min$, the temperature $150^{\circ}C{\sim}250^{\circ}C$, and the distance between crucible and substrate 11cm ${\sim}$ 14cm. The temperature of substrate and evaporation rate of source material, or deposition rate of the film, are definitely related to the crystal orientation of the MgO thin film. The crystal orientation can be changed by the distance between the target(MgO tablet) and the substrate. However, the crystal orientation is not much affected by the thickness of MgO thin film.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.75-80
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• 2010

Electroless nickel plating on porous carbon substrate was investigated. The pore sizes of carbon substrates were 16-20 ${\mu}m$ and over 20 ${\mu}m$. The carbon surface was changed from hydrophobic to hydrophilic after immersing the substrate in an ammonia solution for 40 min at $60^{\circ}C$. The contact angle of water was decreased from $85^{\circ}$ to less than $20^{\circ}$ after ammonia pretreatment. The content of phosphorous in nickel deposit was decreased with increasing pH and then deposits became crystallized. The thickness of nickel deposit was increased with increasing pH. The minimum concentration of $PdCl_2$ for the electroless nickel plating was 5 ppm and the thickness of nickel was not significantly affected by the concentration of $PdCl_2$.

• Membrane Journal
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• v.33 no.6
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• pp.377-382
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• 2023

In this study, a PEBAX/PVDF composite membrane was fabricated, and its pervaporation performance was tested in an ethanol/water mixture. In addition, we attempted to improve the pervaporation performance of the composite membrane by forming a ZIF-8 layer on the surface of the PVDF substrate. The thickness of selective layer was optimized by comparing the pervaporation performance depending on the PEBAX thickness. A pervaporation test was performed on the Ethanol/Water mixture. As a result, the composite membrane using PVDF substrate with ZIF-8 layer had a flux of 1.98 kg/m²h and separation factor of 3.88, showing higher values of both permeation flux and selectivity than the composite membrane using bare PVDF substrate.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.1
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• pp.23-28
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• 2024

Electronic products utilizing flexible devices experience harsh mechanical deformations in real-use environments. As a result, researches on the mechanical reliability of these flexible devices have attracted considerable interest among researchers. This study employed previous bending strain models and finite element analysis to predict the maximum bending strain of metal films deposited on flexible substrates. Bending experiments were simulated using finite element analysis with variations in the material and thickness of the thin films, and the substrate thickness. The results were compared with the strains predicted by existing models. The distribution of strain on the surface of film was observed, and the error rate of the existing model was analyzed during bending. Additionally, a modified model was proposed, providing mathematical constants for each case.

• Journal of the Korean Vacuum Society
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• v.18 no.5
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• pp.337-345
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• 2009

When the drill hole diameter for the package substrate is under $100{\mu}m$, the smear in the drill hole cannot be eliminated by wet desmear process only. We intended to change the substrate's hydrophobic characteristics to hydrophilic characteristics by adapting the atmospheric pressure plasma prior to the wet desmear process. Atmospheric pressure plasma process was made as the inline type equipment which is adequate for the package substrate's manufacturing process and remote DBD type electrodes were used for the equipment. As the result of atmospheric pressure plasma processing, the contact angle of the substrate was enhanced from 71 degree to 30 degree. Dielectric film thickness, drill hole diameter and surface roughness were measured to evaluated the characteristics of the wet desmear process in case of plasma processing and in case of none. By the measurement, it was analyzed that the process uniformity within the whole panel was largely enhanced. Also, it was verified that the smear in the drill hole was eliminated efficiently which was analyzed by the SEM image of the drill hole.