• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.1290-1294
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• 2004

Exposure System is used for printing a prescribed pattern on a printed board, a liquid crystal substrate or the like. In this paper we are trying to develop projection Optics Exposure System for manufacturing Color Filter of LCD Display. This paper explain the Projection Optics Design and Illumination Optics Design of Color Filter Exposure system.

• Journal of the Institute of Electronics and Information Engineers
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• v.53 no.8
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• pp.119-126
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• 2016

In this paper, we proposed the planar textile resonator for constructing wearable MR-WPT system and analyzed the characteristic of textile substrates used in resonators. The planar textile resonators were designed to resonate at 1-10 MHz. The loop and coil were fabricated planar structure on textile substrate using conductive materials. Polyester fiber and cotton widely used in real life were chosen as textile resonators for wearable applications and copper tape and silver paste were used for fabricating planar loop and coil on textile substrate. For comparison analysis on transfer efficiency according to the types of textile, transmitter and receiver parts were symmetric. According to the result, for the highest transfer efficiency of wearable WPT system, the planar resonators have specifications of relative thick textile substrate with low permittivity and low surface resistance of conductive pattern. The performed experiments show that the planar textile resonator is possible to be used for resonator in wearable MR-WPT system.

• Microbiology and Biotechnology Letters
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• v.20 no.1
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• pp.73-78
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• 1992

- Enzymatic synthesis of L-tryptophan(Trp) using E. coli tryptophanase has been investigated. In order to reduce the substrate inhibition by indole and to increase the product yield of L-tryptophan three different approaches have been made in this work. First, indole was intermittently fed to the reaction mixture in order to control the indole concentration at lower level. When 15 mM of indole was used as a total amount of substrate, conversion yield of 80% has been obtained with intermittent feeding while only 20% of indole was converted into L-tryptophan by conventional batch operation, The second method employed in this work was the use of cyclohexane-phosphate buffer organic two-phase system. In this system, indole was mainly partitioned into the organic-solvent phase and therefore substrate inhibition was expected to be reduced. L-Tryptophan production in organic two-phase system was, however, unexpectedly lower than that obtained in aqueous buffer solution. As a third method cyclodextrins have been added to the aqueous reaction mixture. It was found that the addition of $\beta$-cyclodextrin enhanced the tryptophan synthesis noticeably while $\alpha$-cycfodextrin showed little effect on tryptophan production.

• Journal of the Korean Society for Heat Treatment
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• v.18 no.5
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• pp.281-287
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• 2005

Titanium aluminium nitride((TiAl)N) film is anticipated as an advanced coating film with wear resistance used for drills, bites etc. and with corrosion resistance at a high temperature. In this study, (TiAl)N thin films were deposited both at room temperature and at elevated substrate temperatures of 573 to 773 K by using a two-facing-targets type DC sputtering system in a mixture Ar and $N_2$ gases. Atomic compositions of the binary Ti-Al alloy target is Al-rich (25Ti-75Al (atm%)). Process parameters such as precursor volume %, substrate temperature and Ar/$N_2$ gas ratio were optimized. The crystallization processes and phase transformations of (TiAl)N thin films were investigated by X-ray diffraction, field-emission scanning electron microscopy. The microhardness of (TiAl)N thin films were measured by a dynamic hardness tester. The films obtained with Ar/$N_2$ gas ratio of 1:3 and at 673 K substrate temperature showed the highest microhardness of $H_v$ 810. The crystallized and phase transformations of (TiAl)N thin films were $Ti_2AlN+AlN{\rightarrow}TiN+AlN$ for Ar/$N_2$ gas ratio of 1:3, $Ti_2AlN+AlN{\rightarrow}TiN+AlN{\rightarrow}Ti_2AlN+TiN+AlN$ for Ar/$N_2$ gas ratio of 1:1 and $TiN+AlN{\rightarrow}Ti_2AlN+TiN+AlN{\rightarrow}Ti_2AlN+AlN{\rightarrow}Ti_2AlN+TiN+AlN$ for Ar/$N_2$ gas ratio of 3:1. The above results are discussed in terms of crystallized phases and microhardness.

• Journal of Sensor Science and Technology
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• v.29 no.4
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• pp.255-260
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• 2020

In this study, we developed a method of improving the surface-enhanced Raman spectroscopy (SERS) response characteristics by depositing a nanoporous Ag metal thin film through cluster source sputtering after forming a pyramidal texture structure on the Si substrate surface. A reactive ion etching (RIE) system with a metal mesh inside the system was used to form a pyramidal texture structure on the Si surface without following a complicated photolithography process, unlike in case of the conventional RIE system. The size of the texture structure increased with the RIE process time. However, after a process time of 60 min, the size of the structure did not increase but tended to saturate. When the RF power increased from 200 to 250 W, the size of the pyramidal texture structure increased from 0.45 to 0.8 ㎛. The SERS response characteristics were measured by depositing approximately 1.5 ㎛ of nanoporous Ag metal thin film through cluster sputtering on the formed texture structure by varying the RIE process conditions. The Raman signal strength of the nanoporous Ag metal thin film deposited on the Si substrate with the texture structure was higher than that deposited on the general silicon substrate by up to 19%. The Raman response characteristics were influenced by the pyramid size and the number of pyramids per unit area but appeared to be influenced more by the number of pyramids per unit area. Therefore, further studies are required in this regard.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.22 no.4
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• pp.470-480
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• 2011

Analog ferrite phase shifters based on rectangular waveguides which are used as component of passive phased array system have high power handling capability, but it is heavy and has high cost to fabricate. In this paper, we propose an analog ferrite phase shifter using substrate integrated waveguide(SIW), which has low cost and is easy to fabricate because it uses printed circuit board(PCB) process. The proposed structure is fabricated by using centeral dielectric material removal for inserting a ferrite bar. The measured results show that the proposed structure has not only $5.1^{\circ}$/mm phase variation but also return loss variation under 12.9 dB. Therefore, it is expected that the proposed phase shifter can plays an role to reduce weight and to has low cost on the phased array system.

• Korean Journal of Materials Research
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• v.24 no.8
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• pp.429-433
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• 2014

As the fabrication technology used in FPDs(flat-panel displays) advances, the size of these panels is increasing and the pattern size is decreasing to the um range. Accordingly, a cleaning process during the FPD fabrication process is becoming more important to prevent yield reductions. The purpose of this study is to develop a FPD cleaning system and a cleaning process using a two-phase flow. The FPD cleaning system consists of two parts, one being a cleaning part which includes a two-phase flow nozzle, and the other being a drying part which includes an air-knife and a halogen lamp. To evaluate the particle removal efficiency by means of two-phase flow cleaning, silica particles $1.5{\mu}m$ in size were contaminated onto a six-inch silicon wafer and a four-inch glass wafer. We conducted cleaning processes under various conditions, i.e., DI water and nitrogen gas at different pressures, using a two-phase-flow nozzle with a gap distance between the nozzle and the substrate. The drying efficiency was also tested using the air-knife with a change in the gap distance between the air-knife and the substrate to remove the DI water which remained on the substrate after the two-phase-flow cleaning process. We obtained high efficiency in terms of particle removal as well as good drying efficiency through the optimized conditions of the two-phase-flow cleaning and air-knife processes.

• Journal of the Korean Society of Environmental Restoration Technology
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• v.19 no.3
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• pp.1-9
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• 2016

The objective of this study was to exam early stages of plant growth of Euonymus fortunei 'Emerald and Gold' and Hedera japonica grown in fabric felt bag attached on vertical greenery system with the ratio of hydrophilic polymer to substrate, 0(referred as Control), 0.1, 0.2, or 0.4% (v/v), in order to effectively utilize rainfall for low maintenance. After rainfall, the increase in volumetric water content of substrate amended with the hydrophilic polymer was between 13% and 87%, compared to that in Control. During drought period, higher ratio of hydrophilic polymer to substrate slowly decreased the volumetric water content, and increased plant height, leaf length, leaf width, number of leaves, branch number, and stem diameter of both Euonymus fortunei 'Emerald and Gold' and Hedera japonica with the highest fresh and dry weights of shoots or roots under the 0.1% ratio of hydrophilic polymer.

• Journal of radiological science and technology
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• v.40 no.4
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• pp.533-542
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• 2017

In diagnostic radiology, the imaging system has been changed from film/screen to digital system. However, the method for removing scatter radiation such as anti-scatter grid has not kept pace with this change. Therefore, authors have devised the indirect flat panel detector (FPD) system with net-like lead in substrate layer which can remove the scattered radiation. In clinical context, there are many radiographic examinations with angulated incident X-ray. However, our proposed FPD has net-like lead foil so the vertical lead foil to the angulate incident X-ray would have bad effect on its performance. In this study, we identified the effect of vertical/horizontal lead foil component on the novel system's performance and improved the structure of novel system for clinical usage with angulated incident X-ray. Grid exposure factor and image contrast were calculated to investigate various structure of novel system using Monte Carlo simulation software when the incident X-ray was tilted ($0^{\circ}$, $15^{\circ}$, and $30^{\circ}$ from the detector plane). More photons were needed to obtain same image quality in the novel system with vertical lead foil only then the system with horizontal lead foil only. An optimal structure of novel system having different heights of its vertical and horizontal lead foil component showed improved performance compared with the novel system in a previous study. Therefore, the novel system will be useful in a clinical context with the angulated incident X-ray if the height and direction of lead foil in the substrate layer are optimized as the condition of conventional radiography.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.2
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• pp.79-84
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• 2016

A flexible electronic device deformed by external force causes the failure of a semiconductor die. Even without failure, the repeated elastic deformation changes carrier mobility in the channel and increases resistivity in the interconnection, which causes malfunction of the integrated circuits. Therefore it is desirable that a semiconductor die be placed on a neutral line where the mechanical stress is zero. In the present study, we investigated the effects of design factors on the position of neutral line by finite element analysis (FEA), and expected the possible failure behavior in a flexible face-down packaging system assuming flip-chip bonding of a silicon die. The thickness and material of the flexible substrate and the thickness of a silicon die were considered as design factors. The thickness of a flexible substrate was the most important factor for controlling the position of the neutral line. A three-dimensional FEA result showed that the von Mises stress higher than yield stress would be applied to copper bumps between a silicon die and a flexible substrate. Finally, we suggested a designing strategy for reducing the stress of a silicon die and copper bumps of a flexible face-down packaging system.