• Journal of the Korean Institute of Telematics and Electronics
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• v.21 no.4
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• pp.17-23
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• 1984

A model analysis of pattern shift in the epitaxial growth of silicon on (111) substrates was performed. The growth rate anisotropy was considered as the most important affecting factor of pattern shift, and for the model establishment the off angle of the substrate and the process temperature were taken as the variables. We derived a theoretical equation of pattern shift by assuming the growth rate anisotropy as the trigonometric sine function of the off angle of the substrate and defining the growth rate anisotropy factor related to the process temperature. The pattern shift ratio calculated by this model had the same tendency with the experimental ones, which, however, were about twice greater than those. It was supposed that this discrepailcy was due to the second order affecting factor such as facetting and step broadening which had been exluded in model establishment.

• 한국전산유체공학회:학술대회논문집
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• 2010.05a
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• pp.548-550
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• 2010

The droplet motion on a flat substrate with contact angle hysteresis is studied by solving the equations governing the conservation of mass and momentum. The liquid- gas interface is determined by an level-set method which is based on a sharp-interface representation for accurately imposing the matching or coupling conditions at the interface. The method is modified to treat the dynamic contact angle at the liquid-gas-solid interface. The computations are performed to investigate a droplet impact and merging pattern on a flat substrate to find a optimal condition in a micro-line patterning process. The effects of dynamic contact angles on droplet motion are quantified.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.395-398
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• 2000

Reactive radio frequency (RF)magnetron sputter with incident angle has been used to deposit AlN thin film on a crystalline Si substrate. (002)Preferred orientation of AlN thin film has been obtained at low sputtering pressure. Also it has been shown that depostion rate of AIN thin film is affected by fraction Ar and $N_2$ partial pressure. But substrate temperature didn't affect depostion rate of AIN thin film . As sputtering pressure increased preferred orientation degraded. The internal stress changed from tensile stress to compressive stress as fraction of $N_2$ partial pressure increased. At low nitrogen partial pressure cermet$^{[1]}$ AIN thin film is obtained.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.208-211
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• 2000

We prepared Co-Cr-Ta and Co-Cr-Ta/Ti thin film for perpendicular magnetic recording media by facing targets sputtering system (FTS system). Ti underlayer effects on crystallographic and magnetic characteristics of Co-Cr-Ta perpendicular magnetic recording media have been investigated. Crystallgraphic and magnetic characteristic of prepared thin films were evaluated by x-ray diffractometry(XRD), vibrating sample magnetometer(VSM) and kerr hysteresis loop measurement. The coercivity and anisotropy field increase by introduced Ti underlayer when substrate temperature is higher than 150$^{\circ}C$. The c-axis dispersion angle and grain size of Co-Cr-Ta/Ti thin film is decrease than Co-Cr-Ta when substrate temperature is higher than 100$^{\circ}C$. Consequently, the use of a Ti underlayer highly orientated can be improved crystallographic and magnetic characteristics of Co-Cr -Ta perpendicular media layer.

• Journal of the Korean Society for Nondestructive Testing
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• v.37 no.2
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• pp.75-83
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• 2017

In this paper, we investigate the capacity of the lock-in infrared thermography technique for the evaluation of non-uniform top layers of a silicon carbide coating with a nickel based superalloy sample. The method utilized a multilayer heat transfer model to analyze the surface temperature response. The modelling of the sample was done in ANSYS. The sample consists of three layers, namely, the metal substrate, bond coat and top coat. A sinusoidal heating at different excitation frequencies was imposed upon the top layer of the sample according to the experimental procedures. The thermal response of the excited surface was recorded, and the phase angle image was computed by Fourier transform using the image processing software, MATLAB and Thermofit Pro. The correlation between the coating thickness and phase angle was established for each excitation frequency. The most appropriate excitation frequency was found to be 0.05 Hz. The method demonstrated potential in the evaluation of coating thickness and it was successfully applied to measure the non-uniform top layers ranging from 0.05 mm to 1 mm with an accuracy of 0.000002 mm to 0.045 mm.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.4
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• pp.215-217
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• 2016

For the improvement of the anti-pollution properties of porcelain electrical insulators, in this study, we have applied the functional film to the surface of insulator. The functional films were coated on the ceramic substrates which components were like the porcelain electrical insulator. The coating material was applied to ceramic substrate by spray coating method and then the film was cured at around $300^{\circ}C$ for 10 minutes with different gas ambient, such as $O_2$, $N_2$, and only vacuum. We have measured the contact angle of the coated surface, and obtained the lowest angle ($8.9^{\circ}$) and a strong hydrophilic property at vacuum condition. The anti-pollution properties were measured, revealing that as the contact angle decreased, the anti-pollution properties improved. The mechanical hardness and adhesion were both excellent regardless of the annealing ambient.

• Korean Journal of Metals and Materials
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• v.47 no.6
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• pp.383-390
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• 2009

The effects that processing atmospheres and alloy composition have on the wetting characteristics of Al-Mg alloys on the $SiO_{2}$ substrate were investigated by measuring the wetting angles. It was observed that the wetting behavior of the Al-Mg alloys on the $SiO_{2}$ substrate vary depending on the Mg content of the alloys and atmospheres. The results showed that the contact angle decreases with increasing Mg content, angle is generally larger in the $N_{2}$ atmosphere than in the Ar atmosphere. We discussed the validity of the results obtained from the wetting test on the basis of recent theories and the results observed from the actual penetration tests.

• Proceedings of the Optical Society of Korea Conference
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• 1996.09a
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• pp.3-3
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• 1996

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.173-173
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• 2010

We proposed viewing angle switchable liquid crystal display(LCD) associated with fringe-field switching (FFS) mode with high aperture ratio characteristic. In the device, single pixel is separated into two regions, named as main pixel for displaying images and sub pixel for viewing angle control. In sub pixel region, add the common electrode on the top substrate and the initial alignment of liquid crystal is Hybrid Alignment Nematic (HAN) state. In conclusion, we suggested that the device has high aperture ratio characteristic because the LC directors are rotated in which viewing angle control region are generated fringe electric field.

• Journal of Welding and Joining
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• v.16 no.2
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• pp.122-128
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• 1998

This investigation was performed to collect fundamental informations concerning the behavior of glass solders on ceramic joining process. The wettability of glasses on two types of alumina was evaluated by sessile drop method. SiO$_2$-CaO-Al$_2$O$_3$system glasses were selected as solder glasses, and alumina that have different purities were used for substrate materials. It is indicated that contact angles of glasses on 99% purity of alumina substrate do not change as increasing time at elevated temperature, however the contact angles on the 92% purity of alumina substrate exhibit the strong time dependency. The time-dependent property on 92% alumina was due to the interlayer reactions occurred between the glass solder and impurities on the substrate.