• 한국생산제조학회지
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• 제22권3호
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• pp.356-363
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• 2013

Mechanical molding press which is used for transformation process during semiconductor manufacturing process has structural deformations by pressure. If these deformations have over limit range, life of the press itself can be reduced and it will be exerted on a bad effect for quality of the semiconductor. In this research, the main plates and links of a press are analyzed in relation to the structural deformations caused by pressure excluding thermal deformations. After modifying the modeling, the analysis is performed again to determine optimal design of the press, and this design is introduced to ensure that most of the stresses on the main plates are within safe allowable limits. As a result, an optimal design method for the structure is investigated to produce the desired pressure even when the size of the main structure is minimized.

• Design & Manufacturing
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• 제1권1호
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• pp.33-37
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• 2007

In recent, the demand of high-productivity injection mold increases because of the growth of international packaging market. The increase of productivity leads to the large-sized injection molding machine and peripheral devices. For solving this problem, the stack mold which is based on the existing machine and device is studied in advanced countries actively. In this study, as the preliminary research of stack mold development, the stack mold which has 2 Level ${\times}4$ Cavity is designed and manufactured. Besides, the motion and structural analysis are executed to verify the stability of developed stack mold.

• 한국산업융합학회 논문집
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• 제16권4호
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• pp.133-140
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• 2013

This paper presents an overview of the concepts of optimal feeder design in relation to the loading of bulk solids for Automatic filling system that should be control the amount of goods and packaging to seal. Feeder modular device, important parts of the package, so in order to perform a conceptual design optimization techniques are applied in two steps. First of all derive the problems through structural analysis for the conceptual model of vibrating feeder. Secondly derive reasonable design model based on the results of the structural analysis of modified boundary shape and then verify it. The proposed system has the following goal that is satisfies the dynamic stability with minimum weight and optimization of the shape. As a result, the weight reduction of feeder is 2.1% and 7% increase in the natural frequency.

• 마이크로전자및패키징학회지
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• 제16권4호
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• pp.17-22
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• 2009

Two different organic-inorganic hybrid thin film transistors (OITFTs) with the structures of glass/ITO/ZnO/PMMA/Al (staggered structure) and glass/ITO/PMMA/ZnO/Al (inverted staggered structure), were fabricated and their electrical and structural properties were compared. The ZnO thin films used as active channel layers were deposited by the atomic layer deposition (ALD) method at a temperature of $100^{\circ}C$. To investigate the effect of the substrates on their properties, the ZnO films were deposited on bare glass, PMMA/glass and ITO/glass substrates and their crystal properties and surface morphologies were analyzed. The structural properties of the ZnO films varied with the substrate conditions. The ZnO film deposited on the ITO/glass substrate showed better crystallinity and morphologies, such as a higher preferred c-axis orientation, lower FWHM value and larger particle size compared with the one deposited on the PMMA/glass substrate. The field effect mobility ($\mu$), threshold voltage ($V_T$) and $I_{on/off}$ switching ratio for the OITFT with the staggered structure were about $0.61\;cm^2/V{\cdot}s$, 5.5 V and $10^2$, whereas those of the OITFT with the inverted staggered structure were found to be $0.31\;cm^2/V{\cdot}s$, 6.8 V and 10, respectively. The improved electrical properties for the staggered OITFTs may originate from the improved crystal properties and larger particle size of the ZnO active layer.

• 마이크로전자및패키징학회지
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• 제10권2호
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• pp.55-59
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• 2003

본 연구에서는 RF-Magnetron 스퍼터링 장치를 이용하여 $Al_xTa_{1-x}$(x=0.0∼1.0) 합금박막을 성장하였고, 4탐침법, XRD, AFM, micro-Vickers 미소경도계를 사용하여 시료의 구조적, 기계적, 전기적 특성을 분석하였다. Al조성 x=0.245(Al 24.5 at.%)에서 전기저항이 가장 높게 나타났고, 결정질이 가장 우수하였다. 표면 hillock에 있어서는 낮은 Al 조성영 역에서는 x가 증가할수록 hillock이 감소하다가, x=0.245에서 hillock이 완전히 배제되었고, 이후 x 증가에 따라 hillock 밀도가 다시 급격히 증가하였다. 미소경도의 경우, Al조성 x=0.2∼0.45의 영역에서 가장 높은 경도값이 측정되었다. 본 연구의 모든 결과를 종합적으로 고려할 때, $Al_xTa_{1-x}$ 합금박막의 결정질, 전기저항, 표면형상, 미소경도는 상호 밀접한 관계를 가지고 있었으며, Al 조성 x=0.245에서 가장 우수한 물리적 특성이 나타났다.

• 한국콘텐츠학회논문지
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• 제16권1호
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• pp.42-51
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• 2016

오늘날 유통구조의 변화는 오프라인에서 온라인으로 급격하게 수요가 변화해 가고 있다. 이러한 현상은 상품을 편리하게 구입하고자 하는 소비자의 심리가 반영되어 있다고 할 수 있다. 농산물 역시 내용물을 보호하려는 안전성과 소비자들에게 신뢰를 줄 수 있는 브랜드 및 디자인이 어느때보다 중요하게 인식되어지고 있다. 특히, 딸기 과채류는 다른 과채류에 비해 껍질이 얇아서 약한 충격과 흔들림에도 상품의 품질이 떨어지기 때문에 패키지의 지기구조나 소재에 안정성 영향을 많이 받는다. 또한, 직거래 유통이 많은 과채류다보니 생산농가의 열약한 환경 때문에 패키지디자인이 다른 상품에 비해 경쟁력이 떨어지는 것이 현실이다. 즉, 딸기 수요가 날로 증가하는데 비해 딸기패키지는 생산자와 소비자 욕구에 충족하지 못한다는 점이다. 딸기판매에 경쟁력 강화를 위해서는 패키지개발의 기초연구가 시급한 실정이다. 패키지요소(형태, 소재, 디자인) 조사 분석을 통하여 패키지의 문제점을 파악하고, IPA MAP(중요도, 만족도)분석을 통하여 생산자와 소비지가 추구하는 개선점을 파악하고자 한다.

• 마이크로전자및패키징학회지
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• 제25권2호
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• pp.9-17
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• 2018

Aluminum (Al) and its alloys have been used widely in a variety of industries such as structural, electronic, aerospace, and particularly automotive industries due to their lightweight characteristic, outstanding ductility, formability, high oxidation and corrosion resistance, and high thermal and electrical conductivity. Al have different kinds of alloys according to the various additional elements system and they should be selected properly depending on their effectiveness and suitability for their particular purpose. The major elements for Al alloys are silicon (Si), magnesium (Mg), manganese (Mn), copper (Cu), and zinc (Zn). In order for Al alloys to use for each industry, it is necessary to study of Al to Al joining and/or the Al to dissimilar materials joining to combine the individual parts into one. Many studies on joining technologies about Al to Al and Al to dissimilar materials have been performed such as press joining, bolted joint, welding, soldering, riveting, adhesive bonding, and brazing. This study reviews a variety of Al alloys and their joining method including its principles and properties with recent trends.

• 마이크로전자및패키징학회지
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• 제22권2호
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• pp.41-45
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• 2015

리드프레임의 우수한 열적/전기적 특성을 유지하면서 많은 I/O수를 수용할 수 있는 구조, 그리고 라미네이트의 디자인 팬인(Fan-in) 및 팬아웃(Fan-out) 설계 유연성을 유지하면서 가격경쟁력을 향상 시킬 수 있는 몰딩기판(Molded substrate)을 기반으로 한 RtMLF(Routable Molded Lead Frame) 패키지를 개발하였다. 개발된 패키지의 구조적 특징을 이용하여, 열적 전기적 성능의 우수성을 시뮬레이션을 통해서 확인하였으며, 제조 및 신뢰성 분석을 수행하여 생산 적용 가능성을 확인하였다.

• 마이크로전자및패키징학회지
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• 제23권4호
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• pp.19-24
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• 2016

Along the few nano sizing dimensions of integrated circuit (IC) devices, acceptable interlayer material for design is inevitable. The interlayer which include dielectric, interconnect, barrier etc. needs to achieve not only electrical properties, but also mechanical properties for endure post manufacture process and prolonging life time. For developing intermetallic dielectric (IMD) the mechanical issues with post manufacturing processes were need to be solved. For analyzing specific structural problem and material properties Raman spectroscopy was performed for various researches in Si semiconductor based materials. As improve of the laser and charge-coupled device (CCD) technology the total effectiveness and reliability was enhanced. For thin film as IMD developed material could be analyzed by Raman spectroscopy, and diverse researches of developing method to analyze thin layer were comprehended. Also In-situ analysis of Raman spectroscopy is introduced for material forming research.

• 마이크로전자및패키징학회지
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• 제11권4호
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• pp.61-67
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• 2004

알루미늄 유전체의 표면적 증가에 의한 정전용량 값을 증가시키기 위하여, 1 M의 염산 에칭용액에 첨가제를 사용했을 때 나타나는 알루미늄 표면의 에칭특성의 변화를 조사하였다. 에칭액으로서 염산을 사용한 경우 알루미늄 표면에서 생성되는 에치피트의 형상과 단위 면적당 생성밀도가 균일하지 못하였다. 염산용액에 에틸렌글리콜이 첨가된 혼합용액에서 에칭을 실시했을 경우, 알루미늄 기지 표면에 미세하고 균일한 에치피트가 형성되어 표면적 증가의 효과가 크게 나타났다. 에틸렌글리콜이 첨가된 에칭액에서 제조된 유전체는 표면적 증가에 의한 효과로 높은 정전용량 값을 나타냈다.