• 한국태양에너지학회:학술대회논문집
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• 2008.04a
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• pp.241-246
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• 2008

In this paper, we analyze the I-V curve and hot-spot phenomenon caused by solar cells' serial and parallel connected circuit. The mis-match loss of parallel interconnection with low Isc string decrease lower than serially interconnected one and temperature caused by hot-spot does. Also, mis-match loss of parallel interconnection with low Voc string increase more than serially interconnected one. The string having low Voc happened hot-spot phenomenon when open circuit. The bad solar cell in string gives revere bias to good solar cell and make hot-spot phenomenon. If we consider the mis-match loss, when designing PV module and array. the efficiency of PV system might increase.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.34 no.6
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• pp.449-453
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• 2021

Interest and investment in renewable energy have increased worldwide, highlighting the need for renewable energy. Solar energy was the most promising energy of all renewable energy sources, and it has the highest investment value. Because photovoltaics require a certain amount of area for installation, high density and high output performance are required. Shingled module is a promising technology in that they are featured by higher density and higher output compared to the conventional modules. Shingled technology uses a laser scribing to divide solar cells that are to be bonded with electrically conductive adhesive (ECA) to produce and connect strings, which has a higher output in the same area than the conventional modules. In the process of producing solar modules, metal ribbons are used to interconnect cells, but they are also needed for string connections in shingled solar cells. Accordingly, in this study, we researched the interconnection that best suits the connector that joins the string to the string. The module outputs produced under the conditions of the string interconnection were compared and analyzed.

• Journal of Power Electronics
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• v.9 no.4
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• pp.544-552
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• 2009

This paper presents a novel spring pressure contact interconnect technique for medium power integrated power electronics modules (IPEMs). The key technology of this interconnection is a spring which is made from Be-Cu alloy. By means of the string pressure contact, sufficient press-contact force and good electrical interconnection can be achieved. Another important advantage is that the spring exhibits excellent performance in enduring thermo-mechanical stress. In terms of manufacture procedure, it is also comparatively simple. A 4 kW half-bridge power inverter module is fabricated to demonstrate the performance of the proposed pressure contact technique. Electrical, thermal and mechanical test results of the packaged device are reported. The results of both the simulation and experiment have proven that a good performance can be achieved by the proposed pressure contact technique for the medium power IPEMs.

• The Transactions of the Korea Information Processing Society
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• v.6 no.7
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• pp.1756-1769
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• 1999

Parallel paths in an interconnection network have some significance in that message transmission time can be reduced because message is divided into packets and transmitted in parallel through several paths, and also an whose nodes has 2n binary bit string, is an interconnection network which has a lower network cost than hypercube and its variation. In this paper, we analyze node disjoint parallel path in Folded Hyper-Star graph FHS(2n,n) proposed as the topology of parallel computers and, using the result, prove that the fault diameter of a Folded Hyper-Star graph FHS(2n,n) is 2n-1.

• Current Photovoltaic Research
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• v.9 no.2
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• pp.31-35
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• 2021

Shingled module shows high ratio active area per total area due to more efficient packing without inactive space between cells. The module is fabricated by connecting the pre-cut cells into the string using electrically conductive adhesives (ECA). ECAs are used for electric and structural connections to fabricate the shingled modules. In this work, we investigated a correlation between ECA peel strength and the efficiency of pre-cut 5 cells module which are fabricated according to ECA interconnection conditions. The curing conditions are varied to determine whether ECA interconnection properties can affect module properties. As a result of the peel test, the highest peel strength was 1.27 N/mm in the condition of 170℃, the lowest peel strength was 0.89 N/mm in the condition of 130℃. The efficiency was almost constant regardless of the curing conditions at an average of 20%. However, the standard deviation of the fill factor increased as the adhesive strength decreased.