• 한국태양에너지학회:학술대회논문집
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• 한국태양에너지학회 2008년도 춘계학술발표대회 논문집
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• pp.241-246
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• 2008

In this paper, we analyze the I-V curve and hot-spot phenomenon caused by solar cells' serial and parallel connected circuit. The mis-match loss of parallel interconnection with low Isc string decrease lower than serially interconnected one and temperature caused by hot-spot does. Also, mis-match loss of parallel interconnection with low Voc string increase more than serially interconnected one. The string having low Voc happened hot-spot phenomenon when open circuit. The bad solar cell in string gives revere bias to good solar cell and make hot-spot phenomenon. If we consider the mis-match loss, when designing PV module and array. the efficiency of PV system might increase.

• 한국전기전자재료학회논문지
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• 제34권6호
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• pp.449-453
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• 2021

Interest and investment in renewable energy have increased worldwide, highlighting the need for renewable energy. Solar energy was the most promising energy of all renewable energy sources, and it has the highest investment value. Because photovoltaics require a certain amount of area for installation, high density and high output performance are required. Shingled module is a promising technology in that they are featured by higher density and higher output compared to the conventional modules. Shingled technology uses a laser scribing to divide solar cells that are to be bonded with electrically conductive adhesive (ECA) to produce and connect strings, which has a higher output in the same area than the conventional modules. In the process of producing solar modules, metal ribbons are used to interconnect cells, but they are also needed for string connections in shingled solar cells. Accordingly, in this study, we researched the interconnection that best suits the connector that joins the string to the string. The module outputs produced under the conditions of the string interconnection were compared and analyzed.

• Journal of Power Electronics
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• 제9권4호
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• pp.544-552
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• 2009

This paper presents a novel spring pressure contact interconnect technique for medium power integrated power electronics modules (IPEMs). The key technology of this interconnection is a spring which is made from Be-Cu alloy. By means of the string pressure contact, sufficient press-contact force and good electrical interconnection can be achieved. Another important advantage is that the spring exhibits excellent performance in enduring thermo-mechanical stress. In terms of manufacture procedure, it is also comparatively simple. A 4 kW half-bridge power inverter module is fabricated to demonstrate the performance of the proposed pressure contact technique. Electrical, thermal and mechanical test results of the packaged device are reported. The results of both the simulation and experiment have proven that a good performance can be achieved by the proposed pressure contact technique for the medium power IPEMs.

• 한국정보처리학회논문지
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• 제6권7호
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• pp.1756-1769
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• 1999

상호 연결 망에서 병렬 경로는 전송할 메시지를 패킷으로 분할하여 여러 개의 경로를 통하여 동시에 전송할 수 있어서 메시지 전송 시간을 줄일 수 있으며, 라우팅 경로상의 노트나 에지가 고장이 발생했을 때 메시지 전송을 위한 대체 경로를 설정할 수 있으므로 중요한 의미를 갖는다. 2n개의 이진수로 노드를 표현하는 Folded 하이퍼-스타 그래프 FHS(2n,n)은 하이퍼-큐브와 그의 변형된 그래프보다 망 비용이 개선된 상호 연결 망이다. 본 논문에서는 병렬 컴퓨터의 위상으로 제안된 Folded 하이퍼-스타 그래프 FHS(2n,n)에서 노드 중복하지 않는 병렬 경로를 분석하고, 그 결과를 이용하여 Folded 하이퍼-스타 그래프 FHS(2n,n)의 고장 지름이 2n-1임을 분석한다.

• Current Photovoltaic Research
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• 제9권2호
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• pp.31-35
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• 2021

Shingled module shows high ratio active area per total area due to more efficient packing without inactive space between cells. The module is fabricated by connecting the pre-cut cells into the string using electrically conductive adhesives (ECA). ECAs are used for electric and structural connections to fabricate the shingled modules. In this work, we investigated a correlation between ECA peel strength and the efficiency of pre-cut 5 cells module which are fabricated according to ECA interconnection conditions. The curing conditions are varied to determine whether ECA interconnection properties can affect module properties. As a result of the peel test, the highest peel strength was 1.27 N/mm in the condition of 170℃, the lowest peel strength was 0.89 N/mm in the condition of 130℃. The efficiency was almost constant regardless of the curing conditions at an average of 20%. However, the standard deviation of the fill factor increased as the adhesive strength decreased.