• Title/Summary/Keyword: Stress-strain-strength behavior

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Effect of Microstructure on the Environmentally Induced Cracking Behavior of Al-Zn-Mg-Cu-Zr Aluminum Alloy

  • Ghosh, Rahul;Venugopal, A.;Pradeep, PI;krishna, L. Rama;Narayanan, P. Ramesh;Pant, Bhanu;Cherian, Roy M
    • Corrosion Science and Technology
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    • v.17 no.3
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    • pp.101-108
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    • 2018
  • AA7010 is an Al-Zn-Mg-Cu alloy containing Zr, developed as an alternate to traditional AA7075 alloy owing to their high strength combined with better fracture toughness. It is necessary to improve the corrosion resistance and surface properties of the alloy by incorporating plasma electrolytic oxidation (PEO) method. AA7010-T7452 aluminum alloy has been processed through the forging route with multi-stage working operations, and was coated with $10{\mu}m$ thick $Al_2O_3$ ceramic aluminina coating using the plasma electrolytic oxidation (PEO) method. The corrosion, stress corrosion cracking (SCC) and nano-mechanical behaviours were examined by means of potentiodynamic polarization, slow strain rate test (SSRT) and nano-indentation tests. The results indicated that the additional thermomechanical treatment during the forging process caused a fully recrystallized microstructure, which lead to the poor environmental cracking resistance of the alloy in 3.5% NaCl solution, despite the overaging treatment. Although the fabricated PEO coating improved general corrosion resistance, the brittle nature of the coating did not provide any improvement in SCC resistance of the alloy. However, the hardness and elastic modulus of the coating were significantly higher than the base alloy.

A Concrete Model for Analysis of Concrete Structure with Confinement (구속응력을 받는 콘크리트 구조물 해석을 위한 콘크리트 구성모델)

  • Kwon, Min-Ho;Cho, Chang-Geun
    • Journal of the Korea Concrete Institute
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    • v.15 no.3
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    • pp.433-442
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    • 2003
  • This paper presents a hypoplastic model for three-dimensional analysis of concrete structures under monotonic, cyclic, proportional and non-proportional loading. The constitutive model is based on the concept of equivalent uniaxial strains that allows the assumed orthotropic model to be described via three equivalent uniaxial stress-strain curves. The characteristics of these curves are obtained from the ultimate strength surface in the principal stress space based on the Willam-Warnke curve. A cap model is added to consider loading along or near the hydrostatic axis. The equivalent uniaxial curve is based on the Popovics and Saenz models. The post-peak behavior is adjusted to account for the effects of confinement and to describe the change in response from brittle to ductile as the lateral confinement increases. Correlation studies with available experimental tests are presented to demonstrate the model performance. Tests with monotonic loading on specimens under constant lateral confinement are considered first, followed by biaxial and triaxial tests with cyclic loads. The triaxial test example considers non-proportional loading.

Mechanical property of Diglycldyl ether of bisphenol A-Methylene dianiline System with Succinonitrile (Diglycidyl ether of bisphenol A-Methylene dianiline-Succinonitrile계의 역학적 성질)

  • Cho, Sung-Woo;Shim, Mi-Ja;Kim, Sang-Wook
    • Korean Journal of Materials Research
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    • v.2 no.3
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    • pp.191-196
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    • 1992
  • The new epoxy resin, diglycidyl ether of bisphenol A(DGEBA)/4, 4'-methylene dianiline (MDA)/succinonitrile system, containing the reactive additive succionitrile was investigated through the impact test and the stress-strain test on the basis of the behavior of cure reaction and the cure mechanism. The new epoxy resin system, having the different succinonitrile contents, were cured at $80^{\circ}C$for 1.5 hour and then in order to cure completely at $150^{\circ}C$ for 1 hour. It was shown that as the succinonitrile content increased, impact strength was gradually increased, tensile strength was decreased, almost constantly Young's modulus was sustained and elongation was increased until the succinonitrile content was increased to 10phr, and then decreased. From the experimental results, it can be concluded that the chemical bonding length between the main chains was extended by adding the reactive additive succinonitrile. It was also found that the flexibility of epoxy resin was improved by adding the succinonitrile.

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Mechanical properties of expanded polystyrene beads stabilized lightweight soil

  • Li, Mingdong;Wen, Kejun;Li, Lin;Tian, Anguo
    • Geomechanics and Engineering
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    • v.13 no.3
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    • pp.459-474
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    • 2017
  • To investigate the mechanical properties of Expanded Polystyrene (EPS) Beads Stabilized Lightweight Soil (EBSLS), Laboratory studies were conducted. Totally 20 sets of specimens according to the complete test design were prepared and tested with unconfined compressive test and consolidated drained triaxial test. Results showed that dry density of EBSLS ($0.67-1.62g/cm^3$) decreases dramatically with the increase of EPS beads volumetric content, while increase slightly with the increase of cement content. Unconfined compressive strength (10-2580 kPa) increases dramatically in parabolic relationship with the increase of cement content, while decreases with the increase of EPS beads volumetric content in hyperbolic relationship. Cohesion (31.1-257.5 kPa) increases with the increase of cement content because it is mainly caused by the bonding function of hydration products of cement. The more EPS beads volumetric content is, the less dramatically the increase is, which is a result of the cohesion between hydration products of cement and EPS beads is less than that between hydration products of cement and sand particles. Friction angle ($14.92-47.42^{\circ}$) decreases with the increase of EPS beads volumetric content, which is caused by the smoother surfaces of EPS beads than sand grains. The stress strain curves of EBSLS tend to be more softening with the increase of EPS beads content or the decrease of cement content. The shear contraction of EBSLS increases with the increase of $c_e$ or the decrease of $c_c$. The results provided quantitative relationships between physico-mechanical properties of EBSLS and material proportion, and design process for engineering application of EBSLS.

Numerical simulation and analytical assessment of STCC columns filled with UHPC and UHPFRC

  • Nguyen, Chau V.;Le, An H.;Thai, Duc-Kien
    • Structural Engineering and Mechanics
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    • v.70 no.1
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    • pp.13-31
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    • 2019
  • A nonlinear finite element model (FEM) using ATENA-3D software to simulate the axially compressive behavior of circular steel tube confined concrete (CSTCC) columns infilled with ultra high performance concrete (UHPC) was presented in this paper. Some modifications to the material type "CC3DNonlinCementitious2User" of UHPC without and with the incorporation of steel fibers (UHPFRC) in compression and tension were adopted in FEM. The predictions of utimate strength and axial load versus axial strain curves obtained from FEM were in a good agreement with the test results of eighteen tested columns. Based on the results of FEM, the load distribution on the steel tube and the concrete core was derived for each modeled column. Furthermore, the effect of bonding between the steel tube and the concrete core was clarified by the change of friction coefficient in the material type "CC3DInterface" in FEM. The numerical results revealed that the increase in the friction coefficient leads to a greater contribution from the steel tube, a decrease in the ultimate load and an increase in the magnitude of the loss of load capacity. By comparing the results of FEM with experimental results, the appropriate friction coefficient between the steel tube and the concrete core was defined as 0.3 to 0.6. In addition to the numerical evaluation, eighteen analytical models for confined concrete in the literature were used to predict the peak confined strength to assess their suitability. To cope with CSTCC stub and intermediate columns, the equations for estimating the lateral confining stress and the equations for considering the slenderness in the selected models were proposed. It was found that all selected models except for EC2 (2004) gave a very good prediction. Among them, the model of Bing et al. (2001) was the best predictor.

Study on the stress distribution depending on the bone type and implant abutment connection by finite element analysis (지대주 연결 형태와 골질에 따른 저작압이 임프란트 주위골내 응력분포에 미치는 영향)

  • Park, Hyun-Soo;Lim, Sung-Bin;Chung, Chin-Hyung;Hong, Ki-Seok
    • Journal of Periodontal and Implant Science
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    • v.36 no.2
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    • pp.531-554
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    • 2006
  • Oral implants must fulfill certain criteria arising from special demands of function, which include biocompatibility, adequate mechanical strength, optimum soft and hard tissue integration, and transmission of functional forces to bone within physiological limits. And one of the critical elements influencing the long-term uncompromise functioning of oral implants is load distribution at the implant- bone interface, Factors that affect the load transfer at the bone-implant interface include the type of loading, material properties of the implant and prosthesis, implant geometry, surface structure, quality and quantity of the surrounding bone, and nature of the bone-implant interface. To understand the biomechanical behavior of dental implants, validation of stress and strain measurements is required. The finite element analysis (FEA) has been applied to the dental implant field to predict stress distribution patterns in the implant-bone interface by comparison of various implant designs. This method offers the advantage of solving complex structural problems by dividing them into smaller and simpler interrelated sections by using mathematical techniques. The purpose of this study was to evaluate the stresses induced around the implants in bone using FEA, A 3D FEA computer software (SOLIDWORKS 2004, DASSO SYSTEM, France) was used for the analysis of clinical simulations. Two types (external and internal) of implants of 4.1 mm diameter, 12.0 mm length were buried in 4 types of bone modeled. Vertical and oblique forces of lOON were applied on the center of the abutment, and the values of von Mises equivalent stress at the implant-bone interface were computed. The results showed that von Mises stresses at the marginal. bone were higher under oblique load than under vertical load, and the stresses were higher at the lingual marginal bone than at the buccal marginal bone under oblique load. Under vertical and oblique load, the stress in type I, II, III bone was found to be the highest at the marginal bone and the lowest at the bone around apical portions of implant. Higher stresses occurred at the top of the crestal region and lower stresses occurred near the tip of the implant with greater thickness of the cortical shell while high stresses surrounded the fixture apex for type N. The stresses in the crestal region were higher in Model 2 than in Model 1, the stresses near the tip of the implant were higher in Model 1 than Model 2, and Model 2 showed more effective stress distribution than Model.

New Generation of Lead Free Paste Development

  • Albrecht Hans Juergen;Trodler K. G.
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2004.09a
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    • pp.233-241
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    • 2004
  • A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

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New Generation of Lead Free Solder Spheres 'Landal - Seal'

  • Walter H.;Trodler K. G.
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2004.09a
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    • pp.211-219
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    • 2004
  • A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

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Composite action of concrete-filled double circular steel tubular stub columns

  • Wang, Liping;Cao, Xing-xing;Ding, Fa-xing;Luo, Liang;Sun, Yi;Liu, Xue-mei;Su, Hui-lin
    • Steel and Composite Structures
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    • v.29 no.1
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    • pp.77-90
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    • 2018
  • This paper presents a combined numerical, experimental, and theoretical study on the behavior of the concrete-filled double circular steel tubular (CFDT) stub columns under axial compressive loading. Four groups of stub column specimens were tested in this study to find out the effects of the concrete strength, steel ratio and diameter ratio on the mechanical behavior of CFDT stub columns. Nonlinear finite element (FE) models were also established to study the stresses of different components in the CFDT stub columns. The change of axial and transverse stresses in the internal and external steel tubes, as well as the change of axial stress in the concrete sandwich and concrete core, respectively, was thoroughly investigated for different CFDT stub columns with the same steel ratio. The influence of inner-to-outer diameter ratio and steel ratio on the ultimate bearing capacity of CFDT stub columns was identified, and a reasonable section configuration with proper inner-to-outer diameter ratio and steel ratio was proposed. Furthermore, a practical formula for predicting the ultimate bearing capacity was proposed based on the ultimate equilibrium principle. The predicted results showed satisfactory agreement with both experimental and numerical results, indicating that the proposed formula is applicable for design purposes.

Vibration behavior of functionally graded sandwich beam with porous core and nanocomposite layers

  • Si, Hua;Shen, Daoming;Xia, Jinhong;Tahouneh, Vahid
    • Steel and Composite Structures
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    • v.36 no.1
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    • pp.1-16
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    • 2020
  • In steel-concrete composite beams, to improve the cracking resistance of the concrete slab in the hogging moment region, a new type of connector in the interface, named uplift-restricted and slip-permitted screw-type (URSP-S) connector has been proposed. This paper focuses on the behavior of steel-concrete composite beams with URSP-S connectors. A total of three beam specimens including a simply supported beam with URSP-S connectors and two continuous composite beams with different connectors arrangements were designed and tested. More specifically, one continuous composite beam was equipped with URSP-S connectors in negative moment region and traditional shear studs in other regions. For comparison, the other one was designed with only traditional shear studs. The failure modes, crack evolution process, ultimate capacities, strain responses at different locations as well as the interface slip of the three tested specimens were measured and evaluated in-depth. Based on the experimental study, the research findings indicate that the larger slip deformation is allowed while using URSP-S connectors. Meanwhile, the tensile stress reduces and the cracking resistance of the concrete slab improves accordingly. In addition, the overall stiffness and strength of the composite beam become slightly lower than those of the composite beam using traditional shear studs. Moreover, the arrangement suggestion of URSP-S connectors in the composite beam is discussed in this paper for its practical design and application.