• Geomechanics and Engineering
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• v.24 no.3
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• pp.215-226
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• 2021

To study the evolution mechanism of cracks in rocks with multiple defects, rock-like samples with multiple defects, such as strip-shaped through-going cracks and cavity groups, are used, and the crack propagation law and changes in AE (acoustic emission) and strain of cavity groups under different inclination angles are studied. According to the test results, an increase in the cavity group inclination angle can facilitate the initial damage degree of the rock and weaken the crack initiation stress; the initial crack initiation direction is approximately 90°, and the extension angle is approximately 75~90° from the strip-shaped through-going cracks; thus, the relationship between crack development and cavity group initiation strengthens. The specific performance is as follows: when the initiation angle is 30°, the cracks between the cavities in the cavity group develop relatively independently along the parallel direction of the external load; when the angle is 75°, the cracks between the cavities in the cavity group can interpenetrate, and slip can occur along the inclination of the cavity group under the action of the shear mechanism rupture. With the increase in the inclination angle of the cavity group, the AE energy fluctuation frequency at the peak stress increases, and the stress drop is obvious. The larger the cavity group inclination angle is, the more obvious the energy accumulation and the more severe the rock damage; when the cavity group angle is 30° or 75°, the peak strain of the local area below the strip-shaped through-going fracture plane is approximately three times that when the cavity group angle is 45° and 60°, indicating that cracks are easily generated in the local area monitored by the strain gauge at this angle, and the further development of the cracks weakens the strength of the rock, thereby increasing the probability of major engineering quality damage. The research results will have important reference value for hazard prevention in underground engineering projects through rock with natural and artificial defects, including tunnels and air-raid shelters.

• Korean Journal of Fisheries and Aquatic Sciences
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• v.34 no.2
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• pp.91-97
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• 2001

The effects of sudden changes of water temperature (WT) on the stress response and physiological change of the cultured olive flounder in large (FL) and small (FS) size, and fat cod (FC) were examined by manipulating WT (2 types) in a flow through seawater culture system with 6 tanks (water vol. 270 L/tank). The WT was decreased from $20^{\circ}C$ to $10^{\circ}C$ within 5 hours ($2^{\circ}C/hour$) and maintained at $10^{\circ}C$ for 21 hours (Exp. I), and it was raised from $20^{\circ}C$ to $30^{\circ}C$ within 5 hours and maintained at $30^{\circ}C$ for 21 hours (Exp.II). In Exp. I, the levels of blood hematocrit at 5 hours ($10^{\circ}C$) in FS was significantly decreased from $13.5\pm2.0\%\;to\;11.3\pm2.3\%$, but FC at 2.5 hours ($15^{\circ}C$) ($19.0\pm0.3\%\;to\;23.2\pm3.8\%$) was increased, The blood hemoglobin concentration of all fish in Exp, II was significantly increased until 8 hours after raising WT from $20^{\circ}C$ to $30^{\circ}C$. In Exp. I and II , the levels of plasma cortisol in FL, FS and FC was changed from $5.2\pm8.5ng/mL,\;4.4\pm4.5ng/mL\;and\;2.7\pm0.4ng/mL$, respectively, before sudden drop and rise of WT. The levels of plasma cortisol of in FL ($164.0\pm53.1ng/mL$) and FC ($207.9\pm25.4ng/mL$) were significantly increased by the lowering WT sharply during whole experiment. The FL ($12.6\pm2.0ng/mL$) and FS ($4.0\pm3.9ng/mL$) showed no significant differences in cortisol level according to sudden rise of WT (5 hours). But it in FC ($44.7\pm18.2ng/mL$) was increased. In Exp. I, the plasma glucose levels of all fish groups were decreased after 5 hours ($10^{\circ}C$), The plasma lactic acid concentration of FL and FS showed no significant differences until 5 hours after raising WT from $20^{\circ}C$ to $30^{\circ}C$, But it in FC was significantly increased with WT raise.

• Korean Journal of Environmental Agriculture
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• v.17 no.3
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• pp.215-219
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• 1998

This experiment was conducted to investigate effects of NaCl concentration on photosynthetic rate, free proline content and ion content in tobacco. As NaCl concentration was increased growth was retarded. The decrease growth characteristics(shoot/root ratio was 2.0) at 90mM NaCl indicated that this concentration could be a limiting level. As NaCl concentration was increased photosynthetic rate, transpiration rate, and water use efficiency were decreased. Photosynthetic rate was highly decreased at 60mM NaCl. There was no significant difference between transpiration rate and water use efficiency. Leaf water potential was decreased as NaCl concentration was increased, in that twice lower at 30mM than that of control and drop largely at 120mM NaCl. Free proline content was increased as NaCl increased until 120mM NaCl and drop at 150mM NaCl. The $Ca^{2+}$, $Mg^{2+}$, and $K^+$ contents were increased until NaCl concentration was 120mM. The $Na^{2+}$ content was slowly increased as NaCl concentration increased until 120mM NaCl, and largely increased at 150mM NaCl. There was no significant difference between $Cl^-$ and NaCl treatments except 30 mM NaCl in which $Cl^-$ content was higher than that of control. As NaCl concentration was increased $K^+/Na^+$ ratio was decreased. The negative correlation between $K^+$ and $Na^+$, and positive correlation between $K^+/Na^+$ and protein content were found.

• Journal of the Korean Society for Nondestructive Testing
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• v.27 no.4
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• pp.299-304
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• 2007

There are to be some cracks on the material degradation part or the stress concentration parts of the main members, which carry on over-loads, of structures. Because these cracks can be used to evaluate the structural health status, it is important to monitor the crack growth for maintaining the structural safety. In this study, the fiber Bragg grating sensor with a drop ball was developed as a sensor for crack growth detection of an existing crack. The crack growth detection sensor was constructed with three parts: a probe part, a wavelength controling light source and receiver part, and an impact part. The probe part was just formed with a fiber Bragg grating optical fiber The wavelength controling light source part was composed of a current supplying circuit, a DFB laser diode, and a TEC controling circuit for wavelength control. Also, the impact part was just implemented by dropping a steel ball. The performance of this sensor was confirmed by the experiments of the crack detection with an aluminum plate having one existing crack. According to these experiments, the difference of the sensor signal outputs was correlated with the crack length. So, it was confirmed that this sensor could be applied to monitor the crack growth.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.35 no.4
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• pp.215-226
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• 2022

Significant efforts have been devoted to developing high-performance composite materials by emulating the structure of biological creatures with superior mechanical characteristics. Nacre has been one of the most sought-after natural structures due to its exceptional fracture toughness compared with the constituent materials. However, the effect of manipulating the nacre-like geometry on the impact performance has not been fully investigated thus far. In this study, composites of randomly manipulated nacreous geometry are numerically developed and the impact performance is analyzed. We develop an algorithm by which the planar area of platelets in the nacre-like design is randomly resized. Thereafter, the numerical models of nonuniform nacre-patterned multi-layer structures are developed and the drop-weight impact simulation is performed. The impact behaviors of the model are evaluated by using the ratio of absorbed energy, the von Mises stress distribution, and the impact force-time curve. Therefore, the effect of the geometric irregularity on the nacre-patterned design is elucidated. This insight can be efficiently utilized in establishing the optimum design of the nacre-patterned structure.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.39 no.7
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• pp.659-663
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• 2015

In the present study, electroplastic tensile behaviors of aluminum 5052-H32 alloy specimens with different gage dimensions are investigated under a constant electric energy density (electric energy per unit volume). The experimental results show that equivalent electric energy densities induce nearly identical electroplastic behaviors even with different gage dimensions (length, width, or volume). Additionally, the experimental results demonstrate that the electroplastic behavior of the selected aluminum alloy is best described by the electric energy density, which is a function of current density and current duration, rather than individual current density or current duration. The results of the present study suggest that the electric energy density may replace current density and current duration as a design parameter in electrically assisted forming processes.

• Journal of the Earthquake Engineering Society of Korea
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• v.5 no.4
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• pp.17-26
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• 2001

In order to estimate peak ground motions and frequency characteristics of strong ground motions in southern korea, we employed the stochastic simulation method with the moment magnitude(M$_{w}$) and the hypocentral distance(R). We estimated same input parameters that account for specific properties of source and propagation processes, and applied them to the stochastic simulation method. The stress drop($\Delta$$\sigma$) of 100-bar was estimated considering results of research in ENA, China, and southern korea. The attenuation parameter x was calculated by analyzing 57 seismograms recorded from September 1996 to October 1997 and the estimation result of the attenuation parameter x is 0.00112+0.000224 R where R is hypocenter distance. We estimated strong ground motion relations using the stochastic simulation method with suitable input parameters(e.g. $\Delta$$\sigma$, x, and so on). At last, we derived relations between hypocentral distances and ground motions(seismic attenuation equation) using results of the stochastic prediction.esults of the stochastic prediction.n.

• Journal of the Earthquake Engineering Society of Korea
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• v.13 no.5
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• pp.23-29
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• 2009

On December 13, 1996, an earthquake with local magnitude (M$_L$) 4.5 occurred in the Yeongwol area of South Korea. The epicenter was 37.2545$^{\circ}$N and 128.7277$^{\circ}$E, which is located inside the Okcheon Fold Belt. The waveform inversion analysis was carried out to estimate source parameters of the event according to the filtering bandwidth of seismic data. Using 0.02$\sim$0.2 Hz filtering bandwidth, focal depth and seismic moment were estimated to be 6 km and 1.3$\times$10$^{16}$ N$\cdot$m, respectively. This seismic moment corresponds to the moment magnitude (M$_W$) 4.7. The focal mechanism by the waveform inversion and P wave first motion polarity analysis is a strike slip faulting including a small thrust component, and the direction of P-axis is ENE-WSW. The moment magnitude estimated by spectral analysis was 4.8, which is similar to that estimated by waveform inversion. Average stress drop was estimated to be 14.3 MPa.