• Journal of the Korea Concrete Institute
• /
• v.23 no.2
• /
• pp.135-144
• /
• 2011

Recently, researches about fiber reinforced polymer (FRP) which has excellent durability, corrosion resistance, and tensile strength as a substitution material to steel tendon have been actively pursued. This study is performed to examine FRP tendon used prestressed beam's safety under service load. The specimen was a prestressed concrete beam with internal bonded FRP tendon. In order to compare the member fatigue capacity, a control specimen of a prestressed concrete beam with ordinary steel tendon was tested. A fatigue load was applied at a load range of 60%, 70%, and 80% of the 40% ultimate load, which was obtained though a static test. The fatigue load was applied as a 1~3 Hz sine wave with 4 point loading setup. Fatigue load with maximum 1 million cycles was applied. The specimen applied with a load ranging between 40~60% did not show a fatigue failure until 1 million cycles. However, it was found that horizontal cracks in the direction of tendons were found and bond force between the tendon and concrete was degraded as the load cycles increased. This fatigue study showed that the prestressed concrete beam using FRP tendon was safe under a fatigue load within a service load range. Fatigue strength of the specimen with FRP and steel tendon after 1 million cycles was 69.2% and 59.8% of the prestressed concrete beam's static strength, respectively.

• KSCE Journal of Civil and Environmental Engineering Research
• /
• v.7 no.1
• /
• pp.93-101
• /
• 1987

Residual stresses have remained around welding areas of a steel structure member after welding operation. The major causes to occur these residual stresses are the local heat due to a welding, the heat stresses due to a irregular and rapid cooling condition, the material and rigidity of a steel structure. Ultimatly, these residual stresses have been known to decrease a brittle fracture strength, a fatigue strength, a buckling strength, dynamic properties, and the corrosion resistance of the material. This paper deals with the residual stresses on a steel structure member through experimental studies. SWS 58 plates were welded by the method of X-groove type. These plates were layed on the heat treatment at four different temperatures; $350^{\circ}C$, $500^{\circ}C$, $650^{\circ}C$ and $800^{\circ}C$. The resulting residual Stresses were measured by hole drilling method, and the followings were obtained. The residual stresses on the vicinity of a welding point were relieved most effectively at the temperature of $650^{\circ}C$, and these stresses relieved completly when the ratio of a hole diamerter to a hole depth became unity. Hardness test shows that the higher value of hardness at the heat affected zone dropped to belower as the temperature went up from $350^{\circ}C$ to $800^{\circ}C$. The Welding input heats have not influenced the magnitude of residual stresses at the input heat range between above and below one forth than standard.

• Journal of Korean Tunnelling and Underground Space Association
• /
• v.19 no.4
• /
• pp.651-668
• /
• 2017

For initial stability of the tunnel, the primary support, Shotcrete and rockbolt shall be placed in the most appropriate time. This is because the role of such support plays a vital role in long-term and short-term tunnel stability. In this study, the rock bolt is an important supporting system that receives the external pressure generated by the stress relaxation during tunnel excavation as axial force and transmits it to the shotcrete on the tunnel excavation surface. Until now, most of the materials of rock bolts have been used in the field, but there have been many problems such as uncertain quality of Chinese materials entering the market, poor packing due to falling down of rock bolts when filled with mortar, and corrosion due to water. Therefore, in this study, we have developed a high strength steel pipe rock bolt using Autobeam material to solve and improve various problems of existing rock bolts. In order to evaluate the performance of the developed bolt, field tests were carried out and the existing mortar filler in order to improve the performance of the rock bolt, the design and construction criteria were studied and the results were included in this paper.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2004.09a
• /
• pp.233-241
• /
• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2004.09a
• /
• pp.211-219
• /
• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Structural Engineering and Mechanics
• /
• v.63 no.6
• /
• pp.735-742
• /
• 2017

Steel cables as the most important components are widely used in the certain types of structures such as cable-supported bridges, but the long-span structures may result in an increase in fatigue under high stress and corrosion of steel cables. The traditional steel cable is becoming a more evident hindrance. Fiber Reinforced Polymer (FRP) cables with lightweight, high-strength are widely used in civil engineering, but there is little research in vibrational characteristics of FRP cables, especially on the damping characteristic. This article studied the two methods to evaluate dynamical damping characteristic of basalt FRP(BFRP) and glass FRP(GFRP) cables. First, the vibration tests of the B/G FRP cables with different diameter and different cable force were executed. Second, the cables forces were calculated using dynamic strain, static strain and dynamic acceleration respectively, which were further compared with the measured force. Third, experimental modal damping of each cables was calculated by the half power point method, and was compared with the calculation by Rayleigh damping theory and energy dissipation damping theory. The results indicate that (1) The experimental damping of FRP cables decreases with the increase of cable force, and the trend of experimental damping changes is roughly similar with the theoretical damping. (2) The distribution of modal damping calculated by Rayleigh damping theory is closer to the experimental results, and the damping performance of GFRP cables is better than BFRP cables.

• Journal of the Korean Society for Advanced Composite Structures
• /
• v.5 no.1
• /
• pp.1-8
• /
• 2014

Pultruded glass fiber reinforced polymeric plastic (PFRP) and FRP member manufactured by sheet molding compound (SMC) have superior mechanical and physical properties compared with those of conventional structural materials. Since FRP has an excellent corrosion-resistance and high specific strength and stiffness, the FRP material may be highly appreciated for the development of floating-type photovoltaic (PV) power generation system. In this paper, advanced floating PV generation system made of PFRP and SMC is designed. In the design, it includes tracking solar altitude by tilting photovoltaic arrays and tracking solar azimuth by spinning structures. Moreover, the results of the finite element analysis (FEA) are presented to confirm stability of entire structure under the external loads. Additionally, installation procedure and mooring systems in the Hap-Cheon Dam are discussed and the measurement of strain under the actual circumstances is conducted for assuring stability of actually installed structures. Finally, by comparison with allowable stress, appropriate safety of structure is confirmed to operate the system.

• Journal of the Korean Ceramic Society
• /
• v.42 no.8 s.279
• /
• pp.554-560
• /
• 2005

The engineering ceramic needs the properties of high strength, hardness, corrosion-resistance and heat-resistance in order to withstand thermal shock or applied nonuniform stresses without failure. The densely coated porous ceramics can be used for machine component, electromagnetic component, bio-system component and energy-system component by their high-performances from superior coating properties and light-weight characteristics due to the structure including pore by itself. In this study we controlled the porosity of silica and alumina, $8.2\~25.4\%$ and $23.4\~36.0\%$, respectively, by the control of sintering temperature and starting powder size. We made bilayer structures, consisting of a transparent glass coating layer bonded to a thick substrate of different porous ceramics by a thin layer of epoxy adhesive, facilitated observations of crack initiation and propagation. The elastic modulus mismatch could be controlled using different porous ceramics as the substrate layer. Then we applied 150 N force using WC sphere with a radius of 3.18 mm by Hertzian indentation. As a result, the crack initiation in the coating layer was delayed at lower porosity in the substrate layer, and the damage in the coating layer was relatively smaller at the bilayer structure coated on higher elastic substrate.

• Korean Journal of Materials Research
• /
• v.27 no.10
• /
• pp.524-529
• /
• 2017

The effect of strain aging on the tensile properties of API X70 linepipe steel was investigated in this study. The API X70 linepipe steel was fabricated by controlled rolling and accelerated cooling processes, and the microstructure was analyzed using optical and scanning electron microscopes and electron backscatter diffraction. Strain aging tests consisting of 1 % pre-strain and thermal aging at $200^{\circ}C$ and $250^{\circ}C$ were conducted to simulate U-forming, O-forming, Expansion(UOE) pipe forming and anti-corrosion coating processes. The API X70 linepipe steel was composed of polygonal ferrite, acicular ferrite, granular bainite, and bainitic ferrite whose volume fraction was dependent on the chemical composition and process conditions. As the thermal aging temperature increased, the steel specimens showed more clearly discontinuous type yielding behavior in the tensile stress-strain curve due to the formation of a Cottrell atmosphere. After pre-strain and thermal aging, the yield and tensile strengths increased and the yield-to-tensile strength ratio decreased because yielding and aging behaviors significantly affected work hardening. On the other hand, uniform and total elongations decreased after pre-strain and thermal aging since dislocation gliding was restricted by increased dislocation density after a 1 % pre-strain.

• Journal of the Korean institute of surface engineering
• /
• v.32 no.2
• /
• pp.144-156
• /
• 1999

Thermal Barrier Coating with Functional Gradient Materials (FGM-TBC) can play an important role to protect the parts from harmful environments in high temperatures such as oxidation, corrosion, and wear and to improve the efficiency of aircraft engine by lowering the surface temperature on turbine blade. FGM-TBC can increase the life spans of product and improve the operating properties. Therfore, in this study the evaluations of mechanical and thermal properties of FGM-TBC such as fatigue, oxidation and wear-resistance at high temperatures have been conducted. The samples of both the TBC with 2, 3, 5 layers (YSZ/NiCrAlY) to be produced by Air Plasma Spray method (APS) and the bulk TBC with 6 layers to be produced by Plasma Assisted Sintering method (PAS) were used. Furthermore, residual stress, bond strength, and thermal conductivity were evaluated. The average thickness of the APS was 500$\mu\textrm{m}$ to 600$\mu\textrm{m}$ and the average thickness of the PAS was 3mm. The hardness number of the top layer of APS was 750 Hv to 810Hv and that of PAS was 950 Hv to 1440Hv. The $ZrO_2$ coating layer of APS was composed of tetragonal structure after spraying as the result of XRD analysis. As shown in the results of the high temperature wear test, the 3 layer coating of APS had the best wear resistance at $800^{\circ}C$ and the 5 layer coating of APS had the best wear resistance at $600^{\circ}C$. But, these coatings had the tendency of the low-temperature softening at $300^{\circ}C$. The main mechanism of wear was the adhesive wear and the friction coefficient of coatings was increased as increasing the test temperatures. A s results of thermal conductivity test, the ${\Delta}T$ of the APS coating was increased as number of layer and the range of thermal conductivity of the PAS was $800^{\circ}C$ to $1000^{\circ}C$.