• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.9
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• pp.1602-1608
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• 2007

The composites were fabricated, respectively, using 61[vol.%] SiC-39[vol.%] $TiB_2$ and using 61[vol.%] SiC-39[vol.%] $ZrB_2$ powders with the liquid forming additives of 12[wt%] $Al_2O_3+Y_2O_3$ by hot pressing annealing at $1650[^{\circ}C]$ for 4 hours. Reactions between SiC and transition metal $TiB_2$, $ZrB_2$ were not observed in this microstructure. The result of phase analysis of composites by XRD revealed SiC(6H, 3C), $TiB_2$, $ZrB_2$ and $YAG(Al_5Y_3O_{12})$ crystal phase on the Liquid-Phase-Sintered(LPS) $SiC-TiB_2$, and $SiC-ZrB_2$ composite. $\beta\rightarrow\alpha-SiC$ phase transformation was occurred on the $SiC-TiB_2$ and $SiC-ZrB_2$ composite. The relative density, the flexural strength and Young's modulus showed the highest value of 98.57[%], 249.42[MPa] and 91.64[GPa] in $SiC-ZrB_2$ composite at room temperature respectively. The electrical resistivity showed the lowest value of $7.96{\times}10^{-4}[\Omega{\cdot}cm]$ for $SiC-ZrB_2$ composite at $25[^{\circ}C]$. The electrical resistivity of the $SiC-TiB_2$ and $SiC-ZrB_2$ composite was all positive temperature coefficient resistance (PTCR) in the temperature ranges from $25[^{\circ}C]$ to $700[^{\circ}C]$. The resistance temperature coefficient of composite showed the lowest value of $1.319\times10^{-3}/[^{\circ}C]$ for $SiC-ZrB_2$ composite in the temperature ranges from $100[^{\circ}C]$ to $300[^{\circ}C]$ Compositional design and optimization of processing parameters are key factors for controlling and improving the properties of SiC-based electroconductive ceramic composites.

• Food Science and Preservation
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• v.12 no.3
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• pp.216-222
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• 2005

This study was carried out to establish the preparation condition of muskmelon jam. A central composite design was applied to investigate effects of muskmelon paste content(40, 45, 50, 55, 60 g), fructose ratio of sugar(20, 35, 50, 65, $80\%$) and pectin addition(l, 2, 3, 4, 5 g). The maximum sugar content was 61.48 $^{\circ}$Brix in 41.04 g of muskmelon paste content, $48.10\%$ of fructose ratio of sugar and 2.12 g of pectin content. The maximum value of softness was 2.71 g in 45.06 g of muskmelon paste content, $79.46\%$ of fructose ratio of sugar and 2.71 g of pectin addition. The minimum value of jelly strength was $0.04\;g{\cdot}cm$ in 47.80 g of muskmelon paste content, $63.0\%$ of fructose ratio of sugar and 1.99 g of pectin addition. The maximum value of organoleptic overall palatability was 5.89 in 55.65 g of muskmelon paste content, $73.19\%$ of fructose ratio of sugar and 2.42 g of pectin addition. The optimum conditions predicted for each corresponding physicochemical and organoleptic properties of muskmelon jam were 55.2 g(muskmelon paste content), $76.3\%$(fructose ratio of sugar) and 2.5 g(pectin addition).

• The Transactions of The Korean Institute of Electrical Engineers
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• v.57 no.11
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• pp.2015-2022
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• 2008

The effect of content of $Al_2O_3+Y_2O_3$ sintering additives on the densification behavior, mechanical and electrical properties of the pressureless-sintered $SiC-ZrB_2$ electroconductive ceramic composites was investigated. The $SiC-ZrB_2$ electroconductive ceramic composites were pressurless-sintered for 2 hours at 1,700[$^{\circ}C$] temperatures with an addition of $Al_2O_3+Y_2O_3$(6 : 4 mixture of $Al_2O_3$ and $Y_2O_3$) as a sintering aid in the range of $8\;{\sim}\;20$[wt%]. Phase analysis of $SiC-ZrB_2$ composites by XRD revealed mostly of $\alpha$-SiC(6H), $ZrB_2$ and In Situ YAG($Al_5Y_3O_{12}$). The relative density, flexural strength, Young's modulus and vicker's hardness showed the highest value of 89.02[%], 81.58[MPa], 31.44[GPa] and 1.34[GPa] for $SiC-ZrB_2$ composites added with 16[wt%] $Al_2O_3+Y_2O_3$ additives at room temperature respectively. Abnormal grain growth takes place during phase transformation from $\beta$-SiC into $\alpha$-SiC was correlated with In Situ YAG phase by reaction between $Al_2O_3$ and $Y_2O_3$ additive during sintering. The electrical resistivity showed the lowest value of $3.l4{\times}10^{-2}{\Omega}{\cdot}cm$ for $SiC-ZrB_2$ composite added with 16[wt%] $Al_2O_3+Y_2O_3$ additives at 700[$^{\circ}C$]. The electrical resistivity of the $SiC-TiB_2$ and $SiC-ZrB_2$ composite was all negative temperature coefficient resistance (NTCR) in the temperature ranges from room temperature to 700[$^{\circ}C$]. Compositional design and optimization of processing parameters are key factors for controlling and improving the properties of SiC-based electroconductive ceramic composites.

• Journal of the Korean Society of Clothing and Textiles
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• v.33 no.12
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• pp.1971-1978
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• 2009

This study investigated the adsorption of safflower yellow dye on wool protein fiber and the optimum dyeing conditions to test color reproducibility. In addition, the effects of mordants on dye adsorption, color, fastness, and photofading rate were also studied. The prepared dye in powder form was characterized with UV-vis spectroscopy and FT-IR spectrometric analysis. The color of dyed fabrics was characterized by CIE $L^*a^*b^*$ coordinates, H V/C, and K/S values. The color reproducibility of the dyed wool fabrics was examined. The amount of dye adsorption increased and also, the shade of the dyed wool fabrics became deeper and more saturated with increasing temperature, time, and dye concentration. The maximum color strength was obtained at pH 3.0. The shade of dyed wool fabrics ranged from light yellow to dark mustard yellow as the pH of the dye bath shifted from alkaline to acidic. Color reproducibility was reliable with color differences in the range of 0.53~1.75. Fastness to dry cleaning was relatively good at 4/5 rating irrespective of mordanting. Fe and Cu mordants showed the least color change of the dyed wool fabrics after exposure to light. Mordants did not contribute to improve dye uptake and color fastness, although they made variations in color tone. Safflower yellow dye can be used satisfactorily without mordants and will not cause damage to the environment.

• Journal of Korean Society for Atmospheric Environment
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• v.25 no.6
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• pp.523-538
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• 2009

Recently, there has been a keen demand for real-time automatic monitoring of VOCs not only in Korea but other developed countries. We carried out this study to evaluate and to optimize the performance of a continuous automatic monitoring system for hazardous VOCs (HVOCs) in the ambient atmosphere, using an on-line GC system. The online system normally consisted of a Nafion dryer prior to a cold trap of an automatic thermal desorption apparatus and a GC system equipped with two detectors, i.e. PID and ECD. Preliminary tests conducted to check out any contamination of the system revealed an evidence of significant artifact formation of benzene, and it was found that the Nafion dryer (even brand new one) is the source of the benzene artifact. Thus, all the subsequent experiments in this study was carried out inevitably by removing the Nafion dryer. The on-line GC method was investigated with a variety of QC/QA performance criteria such as repeatability, linearity, lower detection limits, and accuracy. In order to find out the best operating condition for the on-line GC system, three different types (in terms of adsorption strength) of cold trap combinations were tested, i.e. (i) Tenax-TA and Carbopack-B combination (weak and hydrophobic); (ii) Tenax-TA, Carbopack-X and Carboxen-1000 combination (strong and hydrophilic); and (iii) Tenax-TA and Carbopack-X combination (medium and hydrophobic/hydrophilic). The USEPA TO-17 manual method was selected as a reference method to evaluate the performance of the on-line method. A series of experiments revealed that the system performance was superior to others when a cold trap packed with hydrophilic adsorbents (Tenax-TA/Carbopack-X/Carboxen-1000 combination) was used and operated at $25^{\circ}C$. However, the system with a cold trap packed with a combination of Tenax-TA and Carbopack-X is more recommended for field applications since the carboxen-1000 adsorbent is too sensitive to water vapor, and hence the performance of the system might be very unstable to humid samples or during rainy days. Furthermore, the precision and accuracy criteria of the Tenax-TA/ Carbopack-X combination were generally compatible with the triple adsorbents cold trap. The continuous automatic monitoring method is, thus, considered very useful to real-time monitoring to understand the variations of VOCs concentrations in ambient air, as it adopts much simpler procedures in sampling, analysis, and data integration steps than manual monitoring methods. However, it should be noted that there is a high possibility of benzene artifacts formation through the Nafion dryer, which is often installed to remove water vapor in air samples before being adsorbed onto the cold trap. Therefore, if a Nafion dryer is used in any studies of monitoring VOCs, the benzene contamination should be carefully examined before carrying out obtaining the data.

• Journal of the Institute of Electronics and Information Engineers
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• v.51 no.10
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• pp.96-106
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• 2014

Previous academic research on FPGA tools has relied on simple imaginary models for the targeting architecture. As the first step to overcome such restriction, the issues on analytic placement and legalization which are applied to commercial FPGAs have been brought up, and several techniques to remedy them are presented, and evaluated. First of all, the center of gravity of the placed cells may be far displaced from the center of the chip during analytic placement. A function is proposed to be added to the objective function for minimizing this displacement. And then, the density map is expanded into multiple layers to accurately calculate the density distribution for each of the cell types. Early fixation is also proposed for the memory blocks which can be placed at limited sites in small numbers. Since two flip-flops share control pins in a slice, a compatibility constraint is introduced during legalization. Pre-packing compatible flip-flops is proposed as a proactive step. The proposed techniques are implemented on the K-FPGA fabric evaluation framework in which commercial architectures can be precisely modeled, and modified for enhancement, and validated on twelve industrial strength examples. The placement results show that the proposed techniques have reduced the wire length by 22%, and the slice usage by 5% on average. This research is expected to be a development basis of the optimization CAD tools for new as well as the state-of-the-art FPGA architectures.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.3 s.36
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• pp.197-205
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• 2005

Development of the packaging is one of the critical issues for commercialization of the RF-MEMS devices. RF MEMS package should be designed to have small size, hermetic protection, good RF performance and high reliability. In addition, packaging should be conducted at sufficiently low temperature. In this paper, a low temperature hermetic wafer level packaging scheme for the RF-MEMS devices is presented. For hermetic sealing, Au-Sn eutectic bonding technology at the temperature below $300{\times}C$ is used. Au-Sn multilayer metallization with a square loop of $70{\mu}m$ in width is performed. The electrical feed-through is achieved by the vertical through-hole via filled with electroplated Cu. The size of the MEMS Package is $1mm\times1mm\times700{\mu}m$. By applying $O_2$ plasma ashing and fabrication process optimization, we can achieve the void-free structure within the bonding interface as well as via hole. The shear strength and hermeticity of the package satisfy the requirements of MIL-STD-883F. Any organic gases or contamination are not observed inside the package. The total insertion loss for the packaging is 0.075 dB at 2 GHz. Furthermore, the robustness of the package is demonstrated by observing no performance degradation and physical damage of the package after several reliability tests.

• Journal of the Korean Solar Energy Society
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• v.37 no.2
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• pp.77-85
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• 2017

Thin crystalline silicon (C-Si) solar cell is expected to be a low price energy source by decreasing the consumption of Si. However, thin c-Si solar cell entails the bowing and crack issues in high temperature manufacturing process. Thus, the conventional tabbing process, based on high temperature soldering (> $250^{\circ}C$), has difficulties for applying to thin c-Si solar cell modules. In this paper, a conductive paste (CP) based interconnection process has been proposed to fabricate thin c-Si solar cell modules with high production yield, instead of existing soldering materials. To optimize the process condition for CP based interconnection, we compared the performance and stability of modules fabricated under various lamination temperature (120, 150, and $175^{\circ}C$). The power from CP based module is similar to that with conventional tabbing process, as modules are fabricated. However, the output of CP based module laminated at $120^{\circ}C$ decreases significantly (14.1% for Damp heat and 6.1% for thermal cycle) in harsh condition, while the output drops only in 3% in the samples process at $150^{\circ}C$, $175^{\circ}C$. The peel test indicates that the unstable performance of sample laminated at $120^{\circ}C$ is attributed to weak adhesion strength (1.7 N) between cell and ribbon compared to other cases (2.7 N). As a result, optimized lamination temperature for CP based module process is $150^{\circ}C$, considering stability and energy consumption during the fabrication.

• Journal of the Korean Institute of Telematics and Electronics S
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• v.36S no.2
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• pp.69-80
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• 1999

Recently, social requirements of personal identification techniques are rapidly expanding in a number of new application ares. Especially fingerprint recognition is the most important technology. Fingerprint recognition technologies are well established, proven, cost and legally accepted. Therefore, it has more spot lighted among the any other biometrics technologies. In this paper we propose a new on-line fingerprint recognition algorithm for non-inked type live scanner to fit their increasing of security level under the computing environment. Fingerprint recognition system consists of two distinct structural blocks: feature extraction and feature matching. The main topic in this paper focuses on the feature matching using the fingerprint minutiae (ridge ending and bifurcation). Minutiae matching is composed in the alignment stage and matching stage. Success of optimizing the alignment stage is the key of real-time (on-line) fingerprint recognition. Proposed alignment algorithm using clique shows the strength in the search space optimization and partially incomplete image. We make our own database to get the generality. Using the traditional statistical discriminant analysis, 0.05% false acceptance rate (FAR) at 8.83% false rejection rate (FRR) in 1.55 second average matching speed on a Pentium system have been achieved. This makes it possible to construct high performance fingerprint recognition system.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.12
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• pp.27-36
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• 2019

The demand for a low dispersion lens with a small refractive index and a high refractive index is increasing, and accordingly, there is an increasing need for a releasable protective film with high heat resistance and abrasion resistance. On the other hand, the optical industry has not yet established a clear standard for the manufacturing process and quality standards for mold-releasing protective films used in aspheric glass lens molding. Optical lens manufacturers treat this technology as proprietary information. In this study, an experiment was conducted regarding the optimization of ion etching, magnetron, and arc current at each source and filter part, and bias voltage in FCVA (filtered cathode vacuum arc)-based Ta-C thin film coatings. This study found that compared to iridium-rhenium alloy thin film sputtering products, the coating conditions were improved by approximately 50%, 20%, and 40% in terms of thickness, hardness, and adhesive strength of the film, respectively. The thin-film coating process proposed in this study is expected to contribute significantly to the development and utilization of glass lenses, which will help enhance the minimum mechanical properties and quality of the mold-release thin film layer required for glass mold surface forming technology.