• 한국분말재료학회지
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• 제11권3호
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• pp.224-232
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• 2004

Ni-diamond composite powders with nickel layer of round-top type on the surface of synthetic diamond (140/170 mesh) were prepared by the electroless plating method (EN) with semi-batch reactor. The effects of nickel concentration, feeding rates of reductant, temperature, reaction time and stirring speeds on the weight percentage and morphology of deposited Ni, mean particle size and specific surface area of the composite powders were investigated by Atomic Adsortion Spectrometer, SEM-EDX, PSA and BET. It was found that nucleated Ni-P islands, acted as catalytic sites for further deposition and grown into these relatively thick layers with nodule-type on the surface of diamond by a lateral growth mechanism. The weight percentage of Ni in the composite powder increased with reaction time, feeding rate of reductant and temperature, but decreased with stirring speed. The weight percentage of Ni in Ni-diamond composite powder was 55% at 150 min., 200 rpm and 7$0^{\circ}C$ .

• 한국산업융합학회 논문집
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• 제23권4_1호
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• pp.541-547
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• 2020

This paper relates a rheo die casting using electromagnetic force, which is one of the representative semi-solid methods for aluminum. The most important factors in electromagnetic stirring would be the melt temperature, sleeve temperature, electromagnetic force, and input time. The effect of the temperature of molten alloy on the direct rheo-casting is assessed in this study. The temperature of the molten alloy is set to 590 ℃ with a solidification of 40%, 600 ℃ with 30%, and 610℃ with less than 20%. Under the condition of 590 ℃ with a solidification of 40%, the whole molten alloy is solidified, causing non-forming during forming process. Meanwhile, under the condition of 600 ℃, where the solidification was 30%, appropriate amount of molten alloy is solidified, filled well into the mold, resulting in good forming, while at 610 ℃ with the solidification of 20%, the molten alloy is not sufficiently solidified and scattered away. The investigation of the defects inside the product with the help of the X-ray equipment shows that the electromagnetic stirring at 590 ℃ with a solidification of 30% produces many air-pores inside the product.

• 마이크로전자및패키징학회지
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• 제20권2호
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• pp.29-32
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• 2013

본 연구에서는 LED 리드프레임 상에 Sn-3.5wt%Ag를 무전해도금하여 표면 거칠기와 반사율을 측정하였다. Sn-3.5wt%Ag를 도금하기에 앞서 Sn-3.5wt%Ag 도금층의 반사율을 향상시키기 위하여 Cu 전해도금을 실시하였다. 도금 후 도금액의 교반속도와 온도가 도금층의 표면 거칠기와 반사율에 어떠한 영향을 미치는지 알아보기 위하여 각각의 도금인자에 대해서 표면 거칠기와 반사율을 측정하고자 하였다. 교반속도가 100~300 rpm으로 증가함에 따라 표면 거칠기는 0.513 ${\mu}m$에서 0.266 ${\mu}m$으로 감소하였으며, 반사율은 1.67 GAM에서 1.86 GAM으로 증가하였다. 또한 온도가 $25{\sim}45^{\circ}C$로 증가함에 따라 표면 거칠기는 0.507 ${\mu}m$에서 0.350 ${\mu}m$으로 감소하였으며, 반사율은 1.68 GAM에서 1.84 GAM으로 증가하였다.

• Elastomers and Composites
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• 제48권4호
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• pp.294-299
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• 2013

수용성 단량체인 메타크릴산 (MAA)을 단량체로 potassium persulfate (KPS)를 개시제로 이용하여 $70^{\circ}C$에서 $90^{\circ}C$ 사이의 선택된 온도에서 용액중합을 진행하였다. 물에 대한 메타크릴산의 농도가 감소하거나 개시제의 농도가 증가하면 분자량은 감소하였다. 중합반응온도는 폴리메타크릴산 (PMAA)의 분자량에 크게 영향을 미치지 않았다. Weissenberg 효과는 대부분의 반응온도에서 나타났으며, $90^{\circ}C$에서는 약하게 관찰되었다. 대부분의 중합반응에서 분산성지수는 1.5 이하로 관찰되었다. 교반속도가 증가하면서 분자량은 점진적으로 증가하다, 교반속도가 800 rpm에 이르면서 수평균 및 중량평균분자량이 동일하게 791,000 g/mol의 분자량을 갖는 단분산성의 PMAA가 구하여졌다. 유리전이온도는 $162^{\circ}C$로 측정되었다.

• Elastomers and Composites
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• 제49권3호
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• pp.232-238
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• 2014

수용성 단량체인 아크릴산 (AA)을 단량체로 potassium persulfate (KPS)를 개시제로 이용하여 $60^{\circ}C$에서 $90^{\circ}C$ 사이의 선택된 온도에서 물을 반응매체로 하여 용액중합을 진행하였다. 아크릴산의 농도가 감소하거나 개시제의 농도가 증가하면 분자량은 감소하였다. 중합반응온도를 상승하면 폴리아크릴산 (PAA)의 분자량은 감소하였다. 대부분의 중합반응에서 분산성지수는 1.5 에 근접하는 것으로 관찰되었다. 교반속도가 증가하면서 400 rpm에서 분자량은 최고값을 나타낸 후, 교반속도가 800 rpm에 이르면서 수평균 및 중량평균분자량은 감소하였다. 유리전이온도는 분자량에 따라 크게 변하지 않았으며 $113^{\circ}C$에서 $116^{\circ}C$ 사이의 값을 나타내었다.

• 자원리싸이클링
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• 제30권1호
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• pp.35-43
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• 2021

본 연구에서는 제철 및 시멘트 제조공정에서 발생하는 부산물을 재활용하기 위한 기초 연구로 시약급 Na2SO4와 KCl을 사용하여 K2SO4를 제조하였다. K2SO4 제조 시 최적조건을 도출하기 위해 Na2SO4와 KCl의 몰 비율, 용액의 포화도 및 교반 온도를 제어하였으며, 주사전자현미경, X-선 회절분석기 등을 사용하여 수득시료의 미세구조 관찰 및 결정성을 분석·평가하였다. 순수 K2SO4를 수득할 수 있는 구간은 Na2SO4와 KCl의 몰 비율 1:6-18, 용액의 포화도 160% 이하, 교반 온도 20℃, 50℃이었다. 또한 K2SO4의 높은 결정성 확보 및 최종 수득량 증대, 에너지 소모 최소화를 고려한 최적 조건은 Na2SO4와 KCl의 몰 비율 1:6, 용액의 포화도 140%, 교반 온도 20℃이었다.

• 한국주조공학회지
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• 제14권5호
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• pp.438-446
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• 1994

The effect of various thermomechanical treatments on the structure and rheological behaviour of Al-6.2wt%Si alloy in its solidification range were investigated using a Searle type high temperature viscometer. During continuous cooling, the viscosity increases gradually with increasing fraction of solidified alloy, until a critical fraction of solidified alloy is reached above which the viscosity sharply increases. The viscosity of the slurry, at a given volume fraction wolid, decreased with increasing shear rate. The size and morphology of primary solid particles during stirring is influenced strongly by shear rates, cooling rates, volume fraction and stirring time of solid. Morphological changes during stirring as a function of solid volume fractions, shear rate and processing time were also reported. In this study, the size of primary solid particles in these alloys consistently increases and the it`s aspect ratio decrease with the increase in fraction solid and decrease in shear rate. Crystal morphology changes from rosette type to spheroid type with the increase in shear rate and solid fraction.

• 한국표면공학회지
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• 제27권2호
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• pp.109-117
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• 1994

Effect of ultrasonic agitation on the contact properties was studied in Ni electroless plating and Pd activation. P-type Si bare wafers were used as substrate and DMAB was used as reducing agent due to its good electrical properties, solderability and compatibility to substrate. In activation, high density Pd nuclei of small size were formed during ultra-sonic agitation compared to that of no stirring. In electroless plating, the plating rate was enhanced by 30∼90% by using ultrasonic agitation. In elecrtoless plating, inhibitor is the most effective additives in ultrasonic agitation. In this experi-ment, thiourea was used as inhibitor. The less the amount of the inhibitor, the more ultrasonic agitation efficiency. It is confirmed by SEM that Ni-B films formed by ultrasonic were coarser, less porous, and denser than those of no stirring. In ultrasonic agitation, boron content of the films was more than those of no stirring. In this case, the more DMAB concentration, the higher the temperature, the less pH, the more boron content. Resistivity of the films formed by ultrasonic agitation was higher than that of no strirring. As the content of boron was increased, the resistivity of the films was increased exponentially.

• 한국표면공학회지
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• 제53권1호
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• pp.15-21
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• 2020

In this study, growth and burning behavior of 6061 aluminum alloy was studied under constant anodic voltages at various temperatures and magnetic stirring rates in 20% sulfuric acid solution by analysing I-t curves, measuring thickness and hardness of aluminum anodic oxide (AAO) films, observations of surface and cross-sectional images of AAO films. AAO films were grown continuously at lower voltages than 18.5V but burning occurred when a voltage more than 19V was applied in 20% H₂SO₄ solution at 20±0.5℃ and 200 rpm of magnetic stirring. The burning was always related with an extremely large increase of anodic current density with anodizing time, suggesting that high heat generation during anodizing causes deteriorations of AAO films by chemical reaction with acidic solutions. The burning resulted in decreases of film thickness and hardness, surface color brightened and formation of porous defects in the AAO films. The burning voltage was found to decrease with increasing solution temperature and decreasing magnetic stirring rate. The decreased burning voltages seem to be closely related with increased chemical reactions between AAO films and hydrogen ions.

• 대한화학회지
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• 제55권5호
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• pp.805-807
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• 2011

The synthesis of different derivatives of isoxazolo[5,4-b]quinoline by the cyclization reaction of various substituted oximes of quinoline using mild base at ambient temperature. The formation of isoxazolo[5,4-b]quinoline, as a consequence of cheaper and more readily available $K_2CO_3$ and DMF participating in the reaction, is documented.