• Title/Summary/Keyword: Step pattern

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Customer Characteristics Modeling for Each Load Pattern using the Database (데이터베이스를 이용한 부하패턴별 수용가 특징 모델링)

  • Lee, Young-Suk;Kim, Jae-Chul;Oh, Jung-Hwan;Yun, Sang-Yun;Park, Chang-Ho
    • Proceedings of the KIEE Conference
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    • 2001.07a
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    • pp.416-418
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    • 2001
  • This Paper presents the 2-step load cycle of daily load curve for representative load pattern of power distribution transformer. We decide the representative load pattern of distribution transformer in domestic using the pattern classification algorithm. The K-mean method is used for the pattern classification algorithm. The acquisition equipment of field load data is utilized for 96-sample distribution transformers and the field data is used in the construction of the database for the creation of daily load pattern.

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Movement Patterns from Supine to Standing Position of Hemiplegic patients (편마비 환자의 누운자세에서 일어서기 운동형태)

  • Kwon Mi-Ji;Chung Hyung-Kuk;Bae Sung-Soo
    • The Journal of Korean Physical Therapy
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    • v.12 no.1
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    • pp.15-21
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    • 2000
  • Rising from a supine position to erect stance is an important milestone in treatment of patients with neurologic dysfunction. The purposes of this study wed to describe the movement patterns that hemiplegic patients use when rising to a standing. position and to investigate whether movement patterns that an proposed to treat of functional activity, Seventeen patients were videotaped performing three trials of rising. Movement patterns were described with three body components : upper extremities, head-trunk, lower extremities. Subjects rose most commonly using a push and reach pattern of the upper extremities-symmetrical interrupted by rotation pattern in the head-trunk-an asymmetrical squat pattern in the lower extremities and a push and reach pattern of the upper extremities-symmetrical interrupted by rotation pattern in the head-trunk-an symmetrical squat with balance step pattern in the lower extremities.

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Technical Issues in Pattern Machining (패턴 가공에서의 기술적인 고려사항)

  • 김보현;최병규
    • Korean Journal of Computational Design and Engineering
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    • v.6 no.4
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    • pp.263-270
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    • 2001
  • In stamping-die manufacturing, the first step is to build die patterns for lost wax casting process. A recent industry trend is to manufacture the die pattern using 3-axis NC machining. This study identifies technical considerations of the pattern machining caused by the characteristics of Styrofoam material, and proposes technical methods related to establishing a process plan and generating tool paths for optimizing the pattern machining. In this paper, the process plan includes the fellowing three items: 1) deter-mining a global machining sequence-a sequence of profile, top, bottom machining and two set-ups, 2) extracting machining features from a pattern model and merging them, and 3) determining a machining sequence of machining features. To each machining feature, this study determines the machining start point, generates the approach tool path, and proposes a tool path linking method fur reducing the distance of the cutter rapid motion. Finally, a smooth tool path generation and an automatic feedrate adjustment (AFA) method are introduced far raising the machining efficiency.

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The Faulty Detection of COG Using Image Registration (이미지 정합을 이용한 COG 불량 검출)

  • JOO KISEE;Jeong Jong-Myeon
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.10 no.2
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    • pp.308-314
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    • 2006
  • A line scan camera is applied to enhance COG(Chip On Glass) inspection accuracy to be measured a few micro unit. The foreign substance detection among various faulty factors has been the most difficult technology in the faulty automatic inspection step since COG pattern is very miniature and complexity. In this paper, we proposed two step area segmentation template matching method to increase matching speed. Futhermore to detect foreign substance(such as dust, scratch) with a few micro unit, the new method using gradient mask and AND operation was proposed. The proposed 2 step template matching method increased 0.3 - 0.4 second matching speed compared with conventional correlation coefficient. Also, the proposed foreign substance applied masks enhanced $5-8\%$ faulty detection rate compared with conventional no mask application method.

A Study on the Two-Step CMP for Prevention of Over-polishing (과다연마 방지를 위한 두 단계 CMP에 관한 연구)

  • Shin, Woon-Ki;Kim, Hyoung-Jae;Park, Boum-Young;Park, Ki-Hyun;Joo, Suk-Bae;Kim, Young-Jin;Jeong, Hae-Do
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.11a
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    • pp.525-526
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    • 2007
  • Over-polishing is required to completely remove the material of top surface across whole wafer, in spite of a local dishing problem. This paper introduces the two-step CMP process using protective layer and high selectivity slurry, to reduce dishing amount and variation. The 30nm thick protective oxide layer was deposited on the pattern, and then polished with low selectivity slurry to partially remove the projected area while suppressing the removal rate of the recessed area. After the first step CMP process, high selectivity slurry was used to minimize the dishing amount and variation in pattern structure. Experimental result shows that two-step CMP process can be successfully applicable to reduce the dishing defect generated in over-polishing.

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Fast Motion Estimation Based on Motion Speed and Multiple Initial Center Point Prediction (모션 속도와 다양한 초기의 중앙점 예측에 기반한 빠른 비디오 모션 추정)

  • Peng, Shao-Hu;Saipullah, Khairul Muzzammil;Yun, Byung-Choon;Kim, Deok-Hwan
    • Proceedings of the Korean Information Science Society Conference
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    • 2010.06a
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    • pp.246-247
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    • 2010
  • This paper proposes a fast motion estimation algorithm based on motion speed and multiple initial center points. The proposed method predicts initial search points by means of the spatio-temporal neighboring motion vectors. A dynamic search pattern based on motion speed and the predicted initial center points is proposed to quickly obtain the motion vector. Due to the usage of the spatio-temporal information and the dynamic search pattern, the proposed method greatly accelerates the search speed while maintaining a good predicted image quality. Experimental results show that the proposed method has a good predicted image quality in terms of PSNR with less search time as compared to the Full Search, New Three-Step Search, and Four-Step Search.

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Pattern Optimization of Intentional Blade Mistuning for the Reduction of the Forced Response Using Genetic Algorithm

  • Park, Byeong-Keun
    • Journal of Mechanical Science and Technology
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    • v.17 no.7
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    • pp.966-977
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    • 2003
  • This paper investigates how intentional mistuning of bladed disks reduces their sensitivity to unintentional random mistuning. The class of intentionally mistuned disks considered here is limited, for cost reasons, to arrangements of two types of blades (A and B, say). A two-step procedure is then described to optimize the arrangement of these blades around the disk to reduce the effects of unintentional random mistuning. First, a pure optimization effort is undertaken to obtain the pattern (s) of the A and B blades that yields small/the smallest value of the largest amplitude of response to a given excitation in the absence of unintentional random mistuning using Genetic Algorithm. Then, in the second step, a qualitative/quantitative estimate of the sensitivity for the optimized intentionally mistuned bladed disks with respect to unintentional random mistuning is performed by analyzing their amplification factor, probability density function and passband/stopband structures. Examples of application with simple bladed disk models demonstrate the significant benefits of using this class of intentionally mistuned disks.

A Study on a Wet etching of ILD (Interlayer Dielectric) Film Wafer (습식 에칭에 의한 웨이퍼의 층간 절연막 가공 특성에 관한 연구)

  • 김도윤;김형재;정해도;이은상
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1997.10a
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    • pp.935-938
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    • 1997
  • Recently, the minimum line width shows a tendency to decrease and the multi-level increase in semiconductor. Therefore, a planarization technique is needed and chemical mechanical polishing(CMP) is considered as one of the most suitable process. CMP accomplishes a high polishing performance and a global planarization of high quality. But there are several defects in CMP such as micro-scratches, abrasive contaminations, and non-uniformity of polished wafer edges. Wet etching include of Spin-etching can improve he defects of CMP. It uses abrasive-free chemical solution instead of slurry. On this study, ILD(INterlayer-Dielectric) was removed by CMP and wet-etching methods in order to investigate the superiority of wet etching mechanism. In the thin film wafer, the results were evaluated at a viewpoint of material removal rate(MRR) and within wafer non-uniformity(WIWNU). And pattern step height was also compared for planarization characteristics of the patterned wafer.

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Bayesian Analysis for Neural Network Models

  • Chung, Younshik;Jung, Jinhyouk;Kim, Chansoo
    • Communications for Statistical Applications and Methods
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    • v.9 no.1
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    • pp.155-166
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    • 2002
  • Neural networks have been studied as a popular tool for classification and they are very flexible. Also, they are used for many applications of pattern classification and pattern recognition. This paper focuses on Bayesian approach to feed-forward neural networks with single hidden layer of units with logistic activation. In this model, we are interested in deciding the number of nodes of neural network model with p input units, one hidden layer with m hidden nodes and one output unit in Bayesian setup for fixed m. Here, we use the latent variable into the prior of the coefficient regression, and we introduce the 'sequential step' which is based on the idea of the data augmentation by Tanner and Wong(1787). The MCMC method(Gibbs sampler and Metropolish algorithm) can be used to overcome the complicated Bayesian computation. Finally, a proposed method is applied to a simulated data.

Development of PC Controled Automatic Cutting System (PC를 이용한 철판 자동절단시스템 개발)

  • Kim, Sang-Hun;Chung, Kyung-Ryul
    • Journal of the Korean Society for Precision Engineering
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    • v.13 no.1
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    • pp.29-37
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    • 1996
  • In this study, PC controlled CNC automatic cutting system is developed. Technological introduction of the control process and the computer programming has made possible not only the automatic control for cutting processing unit but also the easy-to-use graphic software that enables the cutting process. This program involves shape part drawing and amendment, pattern reading and saving, reading Autocad file, nesting process, kerf compensation, automatic cutting path generation, NC file conversion and motor control. Software is devided into 3 modules for easy work. First step enables drawing, amendment and pattern making, followed by automatic nesting and cutting path generation with kerf compensation. In the final step, drawing data is transmitted for the resulting automatic cutting processes. This software would be applicated in gas cutting and textile cutting so that it improves the productivity of cutting process.

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