• 한국재료학회:학술대회논문집
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• 한국재료학회 1992년도 춘계학술발표회
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• pp.155-155
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• 1992

• Design & Manufacturing
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• 제2권5호
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• pp.30-33
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• 2008

Injection Molding is the most effective process for mass production of plastic parts. The injection molding process is composed with several steps such as Filling, Packing, Holding, Cooling, Ejecting. Among them, filling and packing process should be considered carefully to improve accuracy of dimension, surface quality of plastic parts. Usually the quality above-mentioned is managed with weight of part after molding on the field. In this paper, a series of experiment for molding automotive front bumper was conducted with cavitity temperature sensor to optimize switch-over time(V-P switching), hot runner vale gate sequence time during filling and packing step for the purpose of uniform quality, weight at every molding. As a result, it was found that it is effective method to use temperature sensor in injection molding for quality control of plastic molding.

• Journal of Information Processing Systems
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• 제19권4호
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• pp.540-553
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• 2023

The hollow letter CAPTCHA (Completely Automated Public Turing test to tell Computers and Humans Apart) is an optimized version of solid CAPTCHA, specifically designed to weaken characteristic information and increase the difficulty of machine recognition. Although convolutional neural networks can solve CAPTCHA in a single step, a good attack result heavily relies on sufficient training data. To address this challenge, we propose a seed filling algorithm that converts hollow characters to solid ones after contour line restoration and applies three rounds of detection to remove noise background by eliminating noise blocks. Subsequently, we utilize a support vector machine to construct a feature vector for recognition. Security analysis and experiments show the effectiveness of this algorithm during the pre-processing stage, providing favorable conditions for subsequent recognition tasks and enhancing the accuracy of recognition for hollow CAPTCHA.

• Restorative Dentistry and Endodontics
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• 제15권2호
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• pp.104-114
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• 1990

The purpose of this study was to evaluate the adaptation of root canal filling material to the dentinal wall of root canal and to compare the sealing ability of the root canal filling materials using ultrasonic endodontic instrument with injection-molded thermoplasticized gutta-percha filling method and lateral condensation method. Fifty fresh human single root exlracted for orthodontic treatment, were randomly selected, and instrumented by step-back technique. And then, the teeth were divided into 5 groups according to each root canal filling methods. In the experimental group 1 and group 2, the root canals were filled with gutta perdia cases using ultrasonic instrument with and without sealer. In the experimental group 3 and 4, using jection-moldeed thermoplasticized gutta-percha method by obtul$^{(R)}$ canals were filled with and without sealer. In the control group, the canals were filled with sealer by lateral candensation. And then, 5 teeth of each group were immersed in black Indian ink, decalcified and cleared. The depth of dye penetration into the root canal were evaluated with stereoscope (Reichert Ltd., USA). Among the 5 teeth remaining in each group, the single longituding grooves were made on the labial and lingual root surfaces and then immersed in the liquid nitrogen to fracture the teeth spontaneously without any distortions of gutta-percha. Each specimens were examined with X-650 Scanning Electron Microscope(Hitachi ltd, Japan) to show the adaptation to the canal wall, void, homogenicity of filling material and location of gutta-percha or sealer in the dentinal tubules of the root canal. The observations were as follows : 1. The experimental group 1 showed smaller mean dye penetration than control group, and showed the penetraton of sealer in the dentinal tubules of apical third of the root canal. 2. The experimental group 2 and group 4 showed the penetration of gutta-percha in the dentinal tubules of root canals. 3. The experimental group 1 and group 3 showed less mean dye penetration than the experimental group 2 and group 4. 4. The experimental group 1 and group 2 showed better adaptation of filling materials than control group.

• 한국정밀공학회지
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• 제23권8호
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• pp.195-202
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• 2006

High-speed machining (HSM) with excellent quality and dimensional accuracy has been widely used to create 3D structures of metal and plastics. However, the high-speed machining process is not suitable for the rapid realization of 3D thin-walled product because it consumes considerably long time in fixturing process of a work piece. In this paper, an effective rapid manufacturing process is proposed to fabricate 3D thin-walled products directly using HSM, phase change filling and ultrasonic welding. The filling process is useful to hold the thin-walled product during the machining step. The ultrasonic welding process is introduced to make one piece product from two piece parts that are machined by HSM and filling process. The proposed rapid manufacturing (RM) process has been shown that the RM process enables to fabricate the 3D thin-walled products using ABS plastics and aluminum metals from 3D CAD data to functional parts.

• 소성∙가공
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• 제6권3호
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• pp.239-249
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• 1997

The behaviour of alloys in the semi-solid state strongly depends on the imposed stress state and on the morphology of the phase which can vary from dendritic to globular. To optimal net shape forging of semi-solid materials, it is important to investigate for filling phenomena in forging process of arbitrarily shaped dies. To produce a automotive part which has good mechanical property, the filling pattern according to die velocity and solid fraction distribution has to be estimated for arbitrarily shaped dies. Therefore, the estimation of filling characteristic in the forging simulation with arbitrarily shaped dies of semi-solid materials are calculated by finite element method with proposed algorithm. The proposed theoretical model and a various boundary conditions for arbitrarily shaped dies is investigated with the coupling calculation between the liquid phase flow and the solid phase deformation. The simulation process with arbitrarily shaped dies is performed to the isothermal conditions of two dimensional problems. To analysis of forging process by using semi-solid materials, a new stress-strain relationship is described, and forging analysis is performed by viscoelastic model for the solid phase and the Darcy's law for the liquid flow. The calculated results for forging force and filling limitations will be compared to experimental data. The filling simulation of simple products performed with the uniform billet temperature(584$^{\circ}C$) from the induction heating by the commercial package MAGMAsoft. The initial step of computation is the touching of semi-solid material with the end of die gate and the initial concept of proposed system just fit with the capability of MAGMAsoft.

• 한국표면공학회지
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• 제47권2호
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• pp.68-74
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• 2014

The seed step-coverage enhancement process (SSEP) using Pd/Cu/PVP colloids was investigated for the filling of through silicon via (TSV) without void. TEM analysis showed that the Pd/Cu nano-particles were well dispersed in aqueous solution with the average diameter of 6.18 nm. This Pd/Cu nano-particles were uniformly deposited on the substrate of Si/$SiO_2$/Ti wafer using electrophoresis with the high frequency Alternating Current (AC). After electroless Cu deposition on the substrate treated with Pd/Cu/PVP colloids, the adhesive property between deposited Cu layer and substrate was evaluated. The Cu deposit obtained by SSEP with Pd/Cu/PVP colloids showed superior adhesion property to that on Pd ion catalyst-treated substrate. Finally, by implementing the SSEP using Pd/Cu/PVP colloids, we achieved 700% improvement of step coverage of Cu seed layer compared to PVD process, resulting in void-free filling in high aspect ratio TSV.

• Journal of Electrochemical Science and Technology
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• 제8권2호
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• pp.146-154
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• 2017

In this study, copper (II) oxide was prepared for use in a copper electroplating solution. Copper chloride powder and copper (II) oxide are widely used as raw materials for electroplating. Copper (II) oxide was synthesized in this study using a two-step chemical reaction. Herein, we developed a method for the preparation of copper (II) oxide without the use of sintering. In the first step, copper carbonate was prepared without sintering, and then copper (II) oxide was synthesized without sintering using sodium hydroxide. The optimum amount of sodium hydroxide used for this process was 120 g and the optimum reaction temperature was $120^{\circ}C$ regardless of the starting material.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2008년도 추계학술대회 논문집
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• pp.741-742
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• 2008

• 한국지반공학회논문집
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• 제26권3호
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• pp.35-45
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• 2010

말뚝으로 지지된 성토지반 내에 발달되는 펀칭전단현상에 의하여 성토하중이 말뚝에 전이되는 메커니즘을 규명하였다. 성토지반 속에 발달하는 펀칭전단파괴의 기하학적형상에 근거하여 이론해석을 실시하였고 말뚝으로 전이되는 성토하중의 크기를 예측할 수 있는 이론식을 제안하였다. 이 이론식에는 말뚝캡보로의 하중전이 메커니즘에 영향을 주는 여러 매개변수가 포함되어 있다. 이 이론식의 신뢰성을 검증하기 위해 일련의 모형실험을 실시하였다. 모형실험은 말뚝캡보폭이 좁은 경우와 넓은 경우의 두 종류의 캡보에 대하여 실시하였다. 모래성토는 7단계로 나누어 단계적으로 실시하였으며 매 성토단계에서의 재하시간은 장기재하방식과 단기재하방식의 두 가지 방식으로 실시하였다. 장기재하방식은 매 성토단계에서의 히중재하시간을 24시간으로 하였고 단기재하방식은 하중재하시간을 2시간으로 하였다. 이들 모든 모형 실험에서 측정된 연직하중의 측정값은 제안된 이론식에 의거 산정된 예측치와 잘 일치하였다. 또한 이 이론식의 현장 적용성을 검증하기 위하여 성토지지말뚝이 시공된 한 현장의 계측결과와 이론치를 비교 검토하여 보았다. 이 현장에서는 캡보 사이의 간격을 너무 넓게 설치하였기 때문에 성토지반 내에 지반아칭이 발달하기가 어려워 펀칭파괴가 발달하였을 것이 예상되는 현장이었다. 결국 이 이론식으로 예측된 연직하중은 이 현장에서 측정된 현장계측 결과와도 잘 일치하였다.