• Journal of applied mathematics & informatics
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• v.38 no.5_6
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• pp.439-461
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• 2020

A step-up option is a newly developed financial instrument that simultaneously provides higher security and profitability. This paper introduces two step-up options: step-up type1 and step-up type2 options, and derives the option pricing formulas using the Laplace transform. We assume that the underlying equity price follows a regime-switching model that reflects the long-term maturity of these options. The option prices are calculated for the two types of funds, a pure stock fund composed of risky assets only and a mixed fund composed of stocks and bonds, to reflect possible variety in the fund underlying asset mix. The impact of changes in the model parameters on the option prices is analyzed. This paper provides information crucial to product developments.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2012.10a
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• pp.44-46
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• 2012

Leading companies has led to the victimization being leaked to accept personal information by the cyber attack. Also planned hacking cases on purpose such as acquiring monetary gain or social distracting is constantly increasing. In this paper, we identify examples of the project step-by-step leading IT services companies to perform security activities. Real-world projects step-by-step through security measures that can be applied are presented.

• Transactions of Materials Processing
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• v.16 no.4 s.94
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• pp.239-243
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• 2007

Superplastic forming/diffusion bonding(SPF/DB) has been widely used in the automotive and aerospace industry since it has great advantages to produce very light and strong components. Finite element method(FEM) is used to model the SPF/DB process of 3-sheet sandwich panel to predict the pressure-time curve and to analyze the process parameters. In order to eliminate defects of the part, a new pressurization scheme is proposed. Contrary to the conventional one-step pressurization, which causes the folding at the DB joint, two-step pressurization can eliminate the folding. Effect of pressurization cycle was investigated by using FE analysis and proper pressurization cycle is proposed.

• Proceedings of the SAREK Conference
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• 2005.11a
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• pp.526-532
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• 2005

Representation of product data for exchanging and sharing a plant information was established the International Standard by ISO 10303 (STEP) and ISO 15926, but is not used widely in industrial circles by massiveness of standard and complexity of plant itself Specially, they are embodied to STEP data file(ISO 10303 Parts 21), but STEP file is uncomfortable that a person recognizes, and needs specification creation tool. In this paper, we made the integration schema for control valve through related standards, Also, we suggest the practical use framework for electronic commerce to utilize the XML schema that can represents integrate schema of control valve to use XML that is becoming the latest issue.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 2001.10a
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• pp.93-100
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• 2001

The three dimensional(3D) reconstruction from two dimensional(2D) image data is using in many fields such as RPD(Rapid Product Development) and reverse engineering. In this paper, the main step of 3D reconstruction is comprised of two steps : image processing step and B-spline surface approximation step. In the image processing step, feature points of each cross-section are obtained by means of several image processing technologies. In the B-spline surface approximation step, using the data of feature points obtained in the image processing step, the control points of B-spline surface are obtained, which are used for IGES file of 3D CAD model.

• Korean Journal of Computational Design and Engineering
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• v.13 no.2
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• pp.109-120
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• 2008

ISO 10303-112 is an integrated application resource of ISO 10303, commonly known as STEP, and specifies the procedural_sketch schema. The ISO 10303-112 provides general resources for the representation of modeling commands for the exchange of procedurally represented 2D CAD models. Procedural models have the advantage of being easy to edit, simply by changing values of parameters of their constructional operations. Such models are said to embody design intent, in the sense that modifications to them conform to the method of creation used by their original creator, and they also comply with any constraints implied by the particular constructional operations used. This paper introduces the development and standardization process of the ISO 10303-112, and describes the concept of procedural 2D CAD modeling, the way to represent the procedural 2D CAD models in STEP and the harmonization with other STEP resources.

• Proceedings of the IEEK Conference
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• 2006.06a
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• pp.555-556
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• 2006

In this paper, we have proposed a novel process using two-step electron beam lithography to fabricate 20 nm T-gates for high performance MODFETs. Two-step lithography reduces electron forward scattering by defining the foot on a thin (100 nm) bottom-layer of polymethyl methacrylate (PMMA) at the second step, the T-gate head having been developed at the first step. Adopting a low temperature development technique for the second step reduces the detrimental effect of head exposure on foot definition. We have shown that 20 nm T-gate can be patterned with this process.

• Korean Journal of Computational Design and Engineering
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• v.10 no.6
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• pp.412-420
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• 2005

The integration of CAD and CAM is critical for computer aided process planning. Recently, STEP has been emerged and utilized as a product data exchange standard format in CAD/CAM areas. The assembly information consists of assembly component relations, assembly features, assembly directions and mating conditions. The purpose of this study is to develop an efficient algorithm to extract assembly information directly from the STEP based files and to generate automatically assembly process plan from the extracted assembly features. The developed algorithms will generate assembly information codes for STEP(AICS). The results from this study can be a reasonable link between design and manufacturing for developing better CAAPP(Computer-Aided Assembly Process Planning) systems.

• Proceedings of the IEEK Conference
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• 2002.07c
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• pp.1701-1704
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• 2002

In this paper, we investigate the effect of power control step size on the performance of the SIC scheme in DS/CDMA systems. We investigate the average power control iteration and its standard deviation and evaluate the outage performance for several different values of power control step size. Because the SIC scheme requires fine control in the received signal power, the better outage performance is obtained fer the smaller power control step size. However, the smaller power control step size requires larger amount of power control iteration in order to make the power control converge to the steady state. Under the simulated environment, the proper power control step size is about 0.3-0.4dB from both convergence speed of power control algorithm and outage performance points of view.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2002.05a
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• pp.518-522
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• 2002

This paper proposes a new application of Fuzzy logic to Variable Step Size Least Mean Square (VS-LMS) adaptive beamforming algorithm in CDMA systems. The proposed algorithm adjusts the step size of the Least Mean Square (LMS) by using the application of Fuzzy logic in which the increase or decrease of step size depends on the fuzzy inference results of the Mean Square Error (MSE). Computer simulation results show that the proposed algorithm has a better capacity of tracking compared with the conventional LMS algorithms and other variable step size LMS algorithms.