• 한국전기전자재료학회논문지
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• 제22권7호
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• pp.595-601
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• 2009

For the silicon oxide $(SiO_x)$ films prepared by using the facing target sputtering (FTS) apparatus that was manufactured to enhance the preciseness of the fabricated thin-film and sputtering yield rate by forming a higher-density plasma in the electrical discharge space for using it as a thin-film passivation system for flexible organic light emitting devices (FOLEDs). The deposition characteristics were investigated under various process conditions, such as array of the cathode magnets, oxygen concentration$(O_2/Ar+O_2)$ introduced during deposition, and variations of distance between two targets and working pressure. We report that the optimum conditions for our FTS apparatus for the deposition of the $SiO_x$ films are as follows: $d_{TS}\;and\;d_{TT}$ are 90mm and 120mm, respectively and the maximum deposition rate is obtained under a gas pressure of 2 mTorr with an oxygen concentration of 3.3%. Under this optimum conditions, it was found that the $SiO_x$ film was grown with a very high deposition rate of $250{\AA}$/min by rf-power of $4.4W/cm^2$, which was significantly enhanced as compared with a deposition rate (${\sim}55{\AA})$/min) of the conventional sputtering system. We also reported that the FTS system is a suitable method for the high speed and the low temperature deposition, the plasma free deposition, and the mass-production.

• 한국재료학회지
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• 제5권4호
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• pp.476-482
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• 1995

TbFeCo 박막의 Facing Targets Sputtering System 조건, 조성 및 시효 처리에 따른 광자기적 특성과 산화 특성을 조사하였다. XPS와 AES를 통하여 보호막 없이 제조된 TbFeCo 박막의 표면에는 Co에 우선하여 Tb과 Fe가 안정한 산화물의 형태로 존재하며, 표면에서 3.2nm 깊이부터는 산화되지 않은 TbFeCo 박막이 존재함을 확인하였다. TbFeCo 박막을 시효 시킴에 따라 Fe 산화층의 두께는 거의 변화가 없었으며, Tb Oxide 층만이 증가하였다. TbFeCo 박막은 사용된 기판의 종류나 제조조건에 따라 열적 안정성에 큰 차이를 보였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2010년도 하계학술대회 논문집
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• pp.165-165
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• 2010

AZO:H films were prepared by RF magnetron sputtering system with a AZO (2wt% $Al_2O_3$) ceramic target at a temperature of $150^{\circ}C$. The annealing treatments were carried out in hydrogen ambient for 1hr at a temperature of $400^{\circ}C$. The AZO:H films were etched with 1 % HCl. The influence of the properties of AZO:H films deposited in various working pressures is investigated. As a result, the AZO:H film deposited in 4mTorr showed excellent electrical property of $\rho=5.036{\times}10^{-4}{\Omega}cm$ and strongly oriented (002) peak. The transmittance in the wavelength of 450nm was above 80%. It can be used as front electrode for increasing efficiency of GaN LED.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 하계학술대회 논문집
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• pp.185-188
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• 2000

Crystal orientation of Ni$_{18}$ $Fe_{19}$ thin films prepared by facing targets sputtering system was investigated. FTS system can deposit a high quality thin film and control deposition conditions in wide range. T he crystallographic characteristics of Ni$_{18}$ $Fe_{19}$ thin films on variation of thickness and substrate tempera ture was investigated by XRD and AFM. As a result, we obtained Ni$_{18}$ $Fe_{19}$ thin films prepared at subst rate temperature room temperature, thickness 160nm and over revealed good crystal orientation to [111] direction.irection.

• 한국진공학회지
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• 제8권3A호
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• pp.245-248
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• 1999

Recently low resistance of gate line or data line is required for large screen size TFT-LCD panels. As a result, lower resistance Al-alloy is currently reviewed extensively and the resistivity is required smaller than 10$\mu\Omega$cm. In this paper, Al-Nd and Al-Zr thin film were deposited on glass substrated by D.C. magnetron sputtering system under various condition. Its properties were characterized by SEM, AFM, XRD and 4-point-probe. The optimal condition was $120^{\circ}C$, 125W, 0.4Pa, 30sccm (Ar) and $350^{\circ}C$, 20min. annealing. At that condition the resistivity of Al-Zr(0.9%wt.) is about 4$\mu\Omega$cm.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2011년도 춘계학술대회 및 Fine pattern PCB 표면 처리 기술 워크샵
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• pp.165-166
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• 2011

conical type의 sputtering 시스템으로 3차원 치과 보철물 위에 균일한 Ti 박막의 증착을 시도하였으며, 증착 변수에 따른 Ti 박막의 특성을 조사하였다.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권1호
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• pp.655-658
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• 2007

Characteristics of Al cathode films deposited by using specially designed twin target sputter (TTS) system were investigated. It was found that Al cathode films prepared by TTS were amorphous structure with nanocrystallines due to low substrate temperature and OLEDs fabricated using TTS system have low leakage current density at reverse bias because of effective confinement of energetic particles during sputtering process.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2015년도 제49회 하계 정기학술대회 초록집
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• pp.123-123
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• 2015

Al doped ZnO(AZO) films as a transparent conductive oxide (TCO) electrode were deposited on glass, polyethylene naphthalate (PEN) and polyethylene terephthalate (PET) at room temperature by a conventional rf-magneton sputtering (CMS) and a facing target sputtering (FTS) using Al2O3 and ZnO targets. In order to investigation of AZO properties, the structural, surface morphology, electrical, and optical characteristics of AZO films were respectively analyzed. The resistivities of AZO films using FTS system were $6.50{\times}10-4{\Omega}{\cdot}cm$ on glass, $7.0{\times}10-4{\Omega}{\cdot}cm$ on PEN, and $7.4{\times}10-4{\Omega}{\cdot}cm$ on PET substrates, while the values of AZO films using CMS system were $7.6{\times}10-4{\Omega}{\cdot}cm$ on glass, $1.20{\times}10-3{\Omega}{\cdot}cm$ on PEN, and $1.58{\times}10-3{\Omega}{\cdot}cm$ on PET substrates. The AZO-films deposited by FTS system showed uniform surface compared to those of the films by CMS system. We thought that the films deposited by FTS system had low stress due to bombardment of high energetic particles during CMS process, resulted in enhanced electrical conductivity and crystalline quality by highly c-axis preferred orientation and closely packed nano-crystalline of AZO films using FTS system.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제48권5호
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• pp.361-366
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• 1999

The life of AC PDP depends largely on the sputtering-resistant property of the protecting layer such as MgO thin-film. However, it is very difficult to measure the sputtering-resistant property in the stable driving conditions of AC PDP. In this paper we have suggested a high speed measurement technique of the sputtering-resistant property of MgO thin-film by applying the MgO thin-film as the target of RF magnetron sputtering system. We have also applied this method to the e-beam MgO and sputter-MgO and e-beam MgO superior to sputter-MgO 3 times over. Also, the relation of Xe gas partial pressure(X) and sputtered thickness(Y) was Y=3.4X+13.5.

• 한국표면공학회지
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• 제45권5호
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• pp.206-211
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• 2012

Process analysis was carried out during deposition of MgO by inductively coupled plasma assisted reactive magnetron sputtering in Ar and $O_2$ ambient. At the initiation of Mg sputtering with bipolar pulsed dc power in Ar ambient, total pressure showed sharp increase and then slow fall. To analyse partial pressure change, QMS was used in downstream region, where the total pressure was maintained as low as $10^{-5}$ Torr during plasma processing, good for ion source and quadrupole operation. At base pressure, the major impurity was $H_2O$ and the second major impurity was $CO/N_2$ about 10%. During sputtering of Mg in Ar, $H_2$ soared up to 10.7% of Ar and remained as the major impurity during all the later process time. When $O_2$ was mixed with Ar, the partial pressure of Ar decreased in proportion to $O_2$ flow rate and that of $H_2$ dropped down to 2%. It was understood as Mg target surface was oxidized to stop $H_2$ emission by Ar ion sputtering. With ICP turned on, the major impurity $H_2$ was converted into $H_2O$ consuming $O_2$ and C was also oxidized to evolve CO and $CO_2$.