• 제목/요약/키워드: Sputtering Power

검색결과 931건 처리시간 0.024초

DC 스퍼터법과 유도결합형 플라즈마 스퍼터법으로 증착된 HfN 코팅막의 물성 비교연구 (A Comparative Study of Nanocrystalline HfN Coatings Fabricated by Direct Current and Inductively Coupled Plasma Assisted Magnetron Sputtering)

  • 전성용;이소연
    • 한국표면공학회:학술대회논문집
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    • 한국표면공학회 2017년도 춘계학술대회 논문집
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    • pp.103.1-103.1
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    • 2017
  • Nanocrystalline HfN coatings were prepared by reactively sputtering Hf metal target with N2 gas using a magnetron sputtering system operated in DC and ICP (inductively coupled plasma) condition with various powers. The effects of ICP power, ranging from 0 to 200 W, on the coating microstructure, corrosion and mechanical properties were systematically investigated with FE-SEM, AFM, potentiostat and nanoindentation. The results show that ICP power has a significant influence on coating microstructure and mechanical properties of HfN coatings. With the increasing of ICP power, coating microstructure evolves from the columnar structure of DC process to a highly dense one. Average grain size and nano hardness of HfN coatings were also investigated with increasing ICP powers.

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Effects of RF pulsing and axial magnetic field onionized magnetron sputtering

  • Joo. Junghoon
    • Journal of Korean Vacuum Science & Technology
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    • 제2권2호
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    • pp.133-138
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    • 1998
  • To enhance the ionization level of I-PVD and reduce the coil voltage two approaches were tried and as a diagnostic, optical emission spectroscopy and impedance analysis of the plasma was done with a range of Ar pressures and RF power along with XRD analysis of deposited Ag films. RF sputtering power was pulsed with various on/off time scales to recover the ICP quenched by sputtered metals. This in average enhances the ionization of the sputtered atoms with 10 ms/10 ms and 100 ms/100ms pulse on/off time duration and gives higher (200) preferred orientation over (111) in deposited Ag films. Secondly, Small axial B field about 8G remarkably reduced RF coil sputtering and showed scaled relationship between RF power and magnetic field strength for optimal process condition. From OES of Ar0 and Ar+, wave-like dispersion structure appeared and reduced the coil voltage about 20% at very weak field strength of 8G. This should be studied further to have nay relation with low mode helicon wave launching.

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역구조 유기태양전지 버퍼층 응용을 위한 스퍼터링 방법으로 제작된 VOx 박막의 특성 (Characteristics of VOx Thin Films Fabricated by Sputtering as Buffer Layer in Inverted Organic Solar Cell )

  • 양성수;박용섭
    • 한국전기전자재료학회논문지
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    • 제36권1호
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    • pp.36-41
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    • 2023
  • We investigated the properties of vanadium oxide (VOx) buffer layers deposited by a dual RF magnetron sputtering method under various target powers for inverted organic solar cells (IOSCs). Sputter fabricatged VOx thin films exhibited higher crystallinity with the increase of target power, resulting in a uniform and large grain size. The electrical properties of VOx films are improved with the increase of target power because of the increase of V content. In the results, the performance of IOSCs critically depended on the target power during the film growth because the crystalllinity of the VOx film affects the carrier mobility of the VOx film.

자장 구조 변화에 따른 High Power Impulse Magnetron Sputtering (HIPIMS)에서 Al-doped ZnO 박막 증착 특성 (Magnetic Field Dependent Characteristics of Al-doped ZnO by High Power Impulse Magnetron Sputtering (HIPIMS))

  • 박동희;양정도;최지원;손영진;최원국
    • 한국재료학회지
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    • 제20권12호
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    • pp.629-635
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    • 2010
  • Abstract In this study characteristics of Al-doped ZnO thin film by HIPIMS (High power impulse sputtering) are discussed. Deposition speed of HIPIMS with conventional balanced magnetic field is measured at about 3 nm/min, which is 30% of that of conventional RF sputtering process with the same working pressure. To generate additional magnetic flux and increase sputtering speed, electromagnetic coil is mounted at the back side of target. Under unbalanced magnetic flux from electromagnet with 1.5A coil current, deposition speed of AZO thin film is increased from 3 nm/min to 4.4 nm/min. This new value originates from the decline of particles near target surface due to the local magnetic flux going toward substrate from electromagnet. AZO film sputtered by HIPIMS process shows very smooth and dense film surface for which surface roughness is measured from 0.4 nm to 1 nm. There are no voids or defects in morphology of AZO films with varying of magnetic field. When coil current is increased from 0A to 1A, transmittance of AZO thin film decreases from 80% to 77%. Specific resistance is measured at about $2.9{\times}10-2\Omega{\cdot}cm$. AZO film shows C-axis oriented structure and its grain size is calculated at about 5.3 nm, which is lower than grain size in conventional sputtering.

RF Magnetron Sputtering법으로 제작된 비정질 산화물 반도체 IGZO 박막의 특성

  • 진창현;김홍배
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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    • pp.338.1-338.1
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    • 2014
  • 비정질 산화물 반도체(Amorphous Oxide Smeiconcuctor)를 이용하여 투명 박막 트랜지스터의 채널층으로 많은 연구가 진행되고 있다. 투명 박막 트랜지스터의 채널층으로 사용되고 있는 IGZO박막은 비정질임에도 불구하고 높은 이동도와 넓은 밴드갭을 갖고 있는 것으로 알려져 있다. 본 연구는 RF magnetron sputtering법으로 유리기판 위에 IGZO박막을 증착시켰으며 소결된 타겟으로는 In:Ga:ZnO를 각각 1:1:2mol%의 조성비로 혼합하여 이용하였으며, $30{\times}30mm$의 XG Glass 유리기판에 sputtering 방식으로 증착하였다. 박막 증착 조건은 초기압력 $3.0{\times}10^{-6}Torr$, 증착 압력 20mTorr, 반응가스 Ar 25sccm, 공정 변수로는 RF Power 25W, 50W, 75W, 100W 각각 변화를 주어 실험을 진행 하였으며, 증착온도는 실온으로 고정 하였다. 분석 결과로 RF Power 25W 일 때 XRD 분석결과 Bragg's 법칙을 만족하는 피크가 나타나지 않는 비정질 구조임을 확인하였으며, AFM 분석결과 0.5 mm 이하의 Roughness를 가졌다. UV-Visible-NIR 측정 결과 가시광선 영역에서 87%이상의 투과도를 나타냈으며, Hall 측정 결과 Carrier concentration $3.31{\times}10^{19}$, Mobility $10.9cm^2/V.s$, Resistivity $1.8{\times}10^{-2}$, 투명 박막 트랜지스터의 채널층으로 사용 가능함을 확인 할 수 있었다.

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DC Magnetron Sputtering 법에 의한 AC Plasma Display panel의 Cr/Cu/Cr 금속전극 제조 (DC Magnetron Sputtering of Cr/Cu/Cr Metal Electrodes for AC Plasma Display panel)

  • 남대현;이경우;박종완
    • 한국전기전자재료학회논문지
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    • 제13권8호
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    • pp.704-710
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    • 2000
  • Metal electrode materials for plasma display panel should have low electrical resistivity in order to maintain stable gas discharge and have fast response time. They should also hae good film uniformity adhesion and thermal stability. In this study Cr/Cu/Cr metal electrode structure is formed by DC magnetron sputtering. Cr and Cu films were deposited on ITO coated glasses with various DC power density and main pressures as the major parameters. After metal electrodes were formed a heat treatment was followed at 55$0^{\circ}C$ for 20 min in a vacuum furnace. The intrinsic stress of the sputtered Cr film passed a tensile stress maximum decreased and then became compressive with further increasing DC power density. Also with increasing the main pressure stress turned from compression to tension. After heat the treatment the electrical resistivity of the sputtered Cu film of 2${\mu}{\textrm}{m}$ in thickness prepared at 1 motor with the applied power density of 3.70 W/cm$^2$was 2.68 $\mu$$\Omega$.cm With increasing the main pressure the DC magnetron sputtered Cu film became more open structure. The heat treatment decreased the surface roughness of the sputtered Cr/Cu/Cr metal electrodes.

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Optimal Sputtering Parameters of Transparent Conducting ITO Films Deposited on PET SUbstates

  • Kim, Hyun-Hoo;Shin, Sung-ho
    • Transactions on Electrical and Electronic Materials
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    • 제1권2호
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    • pp.23-27
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    • 2000
  • Indium in oxide(ITO) films have been deposited on PET and glass substrates by DC reactive magnetron sputtering without post-deposition thermal treatment, The high quality for microstructure, electrical and optical properties of the as-deposited ITO films on unheated substrates is dominated by the sputtering parameters, The influence of the working gas pressure, DC power and oxygen partial pressure has been systematically investigated, The lowest DC power, and oxygen partial pressure has been systematically investigated, The lowest resistivity of ITO films deposited on PET substrates was 6$\times$10$^{-4}$ $\Omega$cm. It has been obtained at a working pressure of 3 mTorr and DC power of 30 W. The sheet resistance and optical transmittance of these film were 22 $\Omega$/square and 84% respectively. The best values of figures of merit for the electrical and optical characteristics such as T/ $R_{sh}$ and $T^{10}$ / $R_{sh}$ are approximately 38.1 and 7.95($\times$10$^{-3}$ $\Omega$$^{-1}$ ), respectively.

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NMOS 소자의 Ta-Ti 게이트 전극 특성 (Characteristics of Ta-Ti Gate Electrode for NMOS Device)

  • 강영섭;서현상;노영진;이충근;홍신남
    • 한국항행학회논문지
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    • 제7권2호
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    • pp.211-216
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    • 2003
  • 본 논문에서는 오래 전부터 NMOS의 게이트 전극으로 사용된 폴리실리콘을 대체할 수 있는 Ta-Ti 합금의 특성에 대해 연구하였다. 실리콘 기판 위에 열적으로 성장된 $SiO_2$ 위에 Ta과 Ti의 두 타깃을 사용하여 co-sputterring 방법으로 Ta-Ti 합금을 증착하였다. 각각의 타깃은 100W의 sputtering power로 증착하여 시편을 제작하였다. 또한 비교 분석을 위하여 Ta을 100W의 sputtering power로 증착한 시편도 제작하였다. 제작된 Ta-Ti 합금 게이트의 열적/화학적 안정성을 검토하기 위하여 $600^{\circ}C$에서 급속열처리를 수행한 결과 소자의 성능 저하는 나타나지 않았다. 또한 전기적 특성 분석 결과 Ta-Ti 합금은 NMOS에 적합한 일함수인 4.13eV를 산출해 낼 수 있었고, 면저항 역시 폴리실리콘에 비해 낮은 값을 얻을 수 있었다.

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Sputtering 성막속도가 박막의 특성에 미치는 영향 (Effects of Sputter Deposition Rate on the Thin Film Property)

  • 이기암
    • 한국진공학회지
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    • 제2권2호
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    • pp.152-160
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    • 1993
  • 본 연구에서는 DC magnetron sputtering 장비를 이용하여, GdFe, Co, CoCr 박막을 제작함에 있어서 sputtering 조건에 관계되는 Ar 압력, 투입전력, 기판의 종류 등의 요소가 박막의 특성, 특히 보자력과 미세구조에 미치는 영향을 관찰하였다. GdFe의 경우 성막속도가 증가함에 따라 Gd의 atomic%가 줄어드는 것을 알 수 있었으며, Ar압력이 증가함에 따라 성막속도는 감소하였고, 투입전력이 증가함에 따라 성막속도는 거의 선형적으로 증가함을 알 수 있다. 또한 투입전력이 증가함에 따라 박막의 보자력도 증가함을 알 수 있었다. Co 박막에 대해서는 투입전력과 Ar 압력에 관한 성막속도와 미세구조에 관하여 관찰하였다. 이로써 투입전력이 증가하면 성막속도가 증가하며 결정립의 크기가 감소함을 알 수 있었고, Ar 압력이 증가하면 성막속도가 감소함을 알 수 있었다. CoCr의 박막에서는 substrate 종류에 따라 보자력 및 미세구조에 미치는 영향에 대해 연구를 행하였으며, substrate의 종류가 미세구조와 보자력에 상당한 영향을 준다는 것을 알 수 있었다.

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유리성형용 카본금형의 표면조도에 미치는 고출력 스퍼터링 조건의 영향 (The Effect of High Power Sputtering Conditions on Surface Roughness of Carbon Mold for Glass Forming )

  • 주성후;양재웅
    • 한국응용과학기술학회지
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    • 제41권1호
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    • pp.46-57
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    • 2024
  • In this study, the various process conditions for high-power DC Magnetron Sputtering (DCMS) on the surface roughness of carbon thin films were investigated. The optimal conditions for Si/C coating were 40min for deposition time, which does not deviate from normal plasma, to obtain the maximum deposition rate, and the conditions for the best surface roughness were -16volt bias voltage and 400watt DC power with 1.3x10-3torr chamber pressure. Under these optimal conditions, an excellent carbon thin film with a surface roughness of 1.62nm and a thickness of 724nm was obtained. As a result of XPS analysis, it was confirmed that the GLC structure (sp2 bonding) was more dominant than the DLC structure (sp3 bonding) in the thin film structure of the carbon composite layer formed by DC sputtering. Except in infrequent cases of relatively plasma instability, the lower bias voltage and applied power induces smaller surface roughness value due to the cooling effect and particle densification. For the optimal conditions for Graphite/C composite layer coating, a roughness of 36.3 nm and a thickness of 711 nm was obtained under the same conditions of the optimal process conditions for Si/C coating. This layer showed a immensely low roughness value compared to the roughness of bare graphite of 242 nm which verifies that carbon coating using DC sputtering is highly effective in modifying the surface of graphite molds for glass forming.