• 한국표면공학회지
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• 제47권3호
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• pp.109-115
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• 2014

High power impulse magnetron sputtering (HIPIMS), also known as the technology is called peak power density in a short period, you can get high, so high ionization sputtering rate can make. Higher ionization of sputtered species to a variety of coating materials conventional in the field of improving the characteristics and self-assisted ion thin film deposition process, which contributes to a superior being. HIPIMS at the same power, but the deposition speed is slow in comparison with DC disadvantages. Since recently as a replacement for HIPIMS modulated pulse power (MPP) has been developed. This ionization rate of the sputtered species can increase the deposition rate is lowered and at the same time to overcome the problems to be reported. The differences between the MPP and the HIPIMS is a simple single pulse with a HIPIMS whereas, MPP is 3 ms in pulse length is adjustable, with the full set of multi-pulses within the pulse period and the pulse is applied can be micro advantages. In this experiment, $In_2O_3$ : $SnO_2$ composition ratio of 9 : 1 wt% target was used, Ar : $O_2$ flow rate ratio is 4.8 to 13.0% of the rate of deposition was carried out at room temperature. Ar 40 sccm and the flow rate of $O_2$ and then fixed 2 ~ 6 sccm was compared against that. The thickness of the thin film deposition is fixed at 60 nm, when the partial pressure of oxygen at 9.1%, the specific resistance value of $4.565{\times}10^{-4}{\Omega}cm$, transmittance 86.6%, mobility $32.29cm^2/Vs$ to obtain the value.

• Current Photovoltaic Research
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• 제3권1호
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• pp.32-38
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• 2015

CIGS solar cell consisted of various films. In this research, we investigated electrode materials in $Cu(In,Ga)Se_2$ (CIGS) cells, including Al-doped ZnO (ZnO:Al), intrinsic ZnO (i-ZnO), and Al films. The sputtered ZnO:Al film with a sputtering power at 200W showed the lowest series resistance and highest cell efficiency. The electrical resistivity of the 200-W sputtered ZnO:Al film was $5.2{\times}10^{-4}{\Omega}{\cdot}cm$ by the rapid thermal annealing at $200^{\circ}C$ for 1 min. The electrical resistivity of i-ZnO was not measurable due to its high resistance. But the optical transmittance was highest with less oxygen supply and high efficiency cell was achieved with $O_2/(Ar+O_2)$ ratio was 1% due to the increase of short-circuit current. No significant change in the cell performance by inserting a Ni layer between Al and ZnO:Al films was observed.

• 한국재료학회지
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• 제19권7호
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• pp.349-355
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• 2009

Metal thin film patterns on a LTCC substrate, which was connected through inner via and metal paste for electrical signals, were formed by a screen printing process that used electric paste, such as silver and copper, in a conventional method. This method brought about many problems, such as non uniform thickness in printing, large line spaces, and non-clearance. As a result of these problems, it was very difficult to perform fine and high resolution for high frequency signals. In this study, the electric signal patterns were formed with the sputtered metal thin films (Ti, Cu) on an LTCC substrate that was coated with protective oxide layers, such as $TiO_2$ and $SiO_2$. These electric signal patterns' morphology, surface bonding strength, and effect on electro plating were also investigated. After putting a sold ball on the sputtered metal thin films, their adhesion strength on the LTCC substrate was also evaluated. The protective oxide layers were found to play important roles in creating a strong design for electric components and integrating circuit modules in high frequency ranges.

• 한국재료학회지
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• 제31권6호
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• pp.320-324
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• 2021

Effects of growth variables and post-growth annealing on the optical, structural and electrical properties of magnetron-sputtered Ga_0.04Mg_0.10Zn_0.86O films are characterized in detail. It is observed that films grown from pure oxygen plasma showed high resistivity, ~10² Ω·cm, whereas films grown in Ar plasma showed much lower resistivity, 2.0 × 10^-2 ~ 1.0 × 10^-1 Ω·cm. Post-growth annealing significantly improved the electrical resistivity, to 4.3 ~ 9.0 × 10^-3 Ω·cm for the vacuum annealed samples and to 1.3 ~ 3.0 × 10^-3 Ω·cm for the films annealed in Zn vapor. It is proposed that these phenomena may be attributed to the improved crystalline quality and to changes in the defect chemistry. It is suggested that growth within oxygen environments leads to suppression of oxygen vacancy (Vo) donors and formation of Zn vacancy (V_Zn) acceptors, resulting in highly resistive films. After annealing treatment, the activation of Ga donors is enhanced, Vo donors are annihilated, and crystalline quality is improved, increasing the electron mobility and the concentration. After annealing in Zn vapor, Zn interstitial donors are introduced, further increasing the electron concentration.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.443-446
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• 2001

MI(Magneto-Impedance) sensor which is made by thin films has significantly high detecting sensitivity in weak magnetic field. It also has a merit to be able to build in low power system. Its structure is simple, which makes it easier to prepare a miniature. In this study, its magnetic permeability and anisotropy field(H$\sub$k/) as a function of a thickness of sputtered amorphous CoZrNb thin film with high saturation magnetostriction and excellent soft magnetic property are investigated. In order to make a uniaxial anisotropy, thin film was subjected to post annealing with a static magnetic field with 1KOe intensity at 250, 300, and 320$^{\circ}C$ for 2 hour. Anisotropy field(H$\sub$k/)of thin film is measured by using MH loop tracer. Its magnetic permeability of thin film is measured over the frequency range from 1 MHz to 750MHz. It has shown that the magnetic permeability of amorphous CoZrNb thin film is decreased due to the skin effect with increasing a thickness of CoZrNb thin film, and hence its driving frequency is lowered.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집 Vol.3 No.2
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• pp.778-781
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• 2002

MI(Magneto-Impedance) sensor which is made by thin films has significantly high detecting sensitivity in weak magnetic field. It also has a merit to be able to build in the low power system. Its structure is simple, which makes it easier to prepare a miniature. In this study, its magnetic permeability and anisotropy field$(H_k)$ as a function of a thickness of sputtered amorphous CoZrNb films with zero-magnetostriction and excellent soft magnetic property are investigated. In order to make a uniaxial anisotropy, film was subjected to the post annealing in a static magnetic field with 1KOe intensity at 250, 300, and $320^{\circ}C}$ respectively for 2 hours. Anisotropy field$(H_k)$ of film is measured by using a MH loop tracer. Its magnetic permeability of a film is measured over the frequency range from 1 MHz to 750MHz. It has shown that the magnetic permeability of amorphous CoZrNb film is decreased due to the skin effect with increasing a thickness of the CoZrNb film, and hence its driving frequency is lowered. And, it was examined on the permeability and impedance to fabricate the MI sensor which acts at a low frequency by thickening a CoZrNb film relatively.

• 한국재료학회지
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• 제4권5호
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• pp.535-540
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• 1994

Thin film magnet was fabricated by radio frequency magnetron sputtering using $Nd_13/(Fe.Co)_{70}B_{17}$ alloy target and magnetic properties were investigated according to sputtering conditions from the metallurgical point of view. we could obtain the best preferred orientation of $Nd_2Fe_{14}B$ phase at substrate temperatures between $450^{\circ}C$ and $460^{\circ}C$ with the input power 150W, and thin films had the anisotropic magnetic properties. But, as the thickness of thin film increased, the c-axis orientation gradually tended to be disordered and magnetic properties also become isotropic. Just like Nd-Fe-B meltspun ribbon, the microstructure of thin film magnet was consisted of very find cell shaped $Nd_2Fe_{14}B$ phase and the second phase along grain boundary. While, domain structure showed maze patterns whose magnetic easy axis was was perpendicular to film plane of thin film. It was concluded from these results that the perpendicualr anisotropy in magnetization was attributed to the perpendicular alignment of very find $Nd_2Fe_{14}B$ grains in thin film.

• 한국전기전자재료학회논문지
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• 제16권2호
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• pp.138-143
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• 2003

A double spiral thin-film inductor with a NiFe magnetic core is integrated with DC-DC converter IC. The NiFe core is deposited on a polyimide film as the thinckness of NiFe is 2.5~3.5 ${\mu}$m. Then, copper conductor line is deposited on the NiFe core with double spiral structure. Process integration is performed by sequential processes of etching the polyimide film deposited both top and bottom of the NiFe core and electroplation copper conductor line from exposed metal pad of the DC-DC converter IC. Process integration is simplified by elimination planarization process for top core because the proposed thin-film inductor has a bottom NiFe core only. Inductor of the fabricated monolithic DC-DC converter IC is 0.53 ${\mu}$H when the area of converter IC and thin-film inductor are 5X5$\textrm{mm}^2$ and 3.5X2.5$\textrm{mm}^2$, respectively. The efficiency is 72% when input voltage and output voltage are 3.5 V and 6 V, respectively at the operation frequency of 8 MHz.

• 한국재료학회지
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• 제2권2호
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• pp.110-118
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• 1992

형성방법이 다른 세종류의 TiN기판상에 CVD텅스텐막을 도포할 때의 W의 핵생성 양상을 비교조사하여 다음과 같은 결과를 얻었다. 반응성 스팟터법에 의하여 형성한 TiN과 $NH_3$분위기에서 RTP처리한 $SiH_4$환원에 의하여 CVD-W막을 증착할 때, 증착속도(deposition rate)는 sputtered TiN>RTP TiN>annealed TiN의 순서로 감소하며, W 핵생성에 대한 잠복기는 sputtered $TiN{\leq}RTP$ TiNTiO_{X}N_{Y}$로 바뀌기 때운에 그 위에서 W의 핵성성이 어려워지고, 증착속도도 낮아진 것이다. RTP-TiN의 미세한 결정립구조는 W의 핵성성과 성장에 유리한 효과를 미치지만, 그것의 높은 압축응력이 W의 핵생성과 성장에 미치는 불리한 효과가 더 크기 때문에, RTP-TiN 기판상에 W를 증착할 경우가 sputtered TiN 기판상에 W를 증착할 경우보다 증착속도가 더 낮고, 잠복기도 더 긴 것으로 사료된다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
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• pp.171-177
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• 2001

The adhesion enhancement from inserting a RF bias-sputtered Cr layer between Cu and polyimide (PI) has been studied. The RF bias power applied in this study was ranged from 0 to 400 W. Without the RF bias, the peel strength, which measures the adhesion strength, was nearly o g/mm. As the RF power was increased, the peel strength rose up to ~130 g/mm at 200 W, which remained constant with further increase of the RF bias power. Cross-sectional transmission electron microscopy(TEM) was used to investigate the interfacial reaction between the Cr film and PI substrate during the bias sputtering. The Cr/PI interface without the application of RF dais showed a clean, sharp interface while the RF raised Cr/PI interface had about 10~30 nm thick atomistically mixed interlayer between the metal film and PI substrate. This interlayer appeared to have resulted from the implantation of high energy adatoms during the RF bias sputtering of Cr film. This mixed layer serves as an interlocking layer, which enhances adhesion between the metal and PI layers.