• Journal of Convergence for Information Technology
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• v.12 no.2
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• pp.149-156
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• 2022

In this paper, it was attempted to form a titanium (Ti: Titanium) thin film using the atmospheric pressure plasma process technology for the conductor, which is the main component of the optical sensor. The atmospheric plasma equipment was remodeled. A 4-inch Ti target for sputter was etched using CF4 gas, and the by-product was coated on a glass sample. These by-products were formed up to about 2 cm, and could be divided into 15 areas according to color. Surface shape and constituent elements were analyzed using scanning electron microscopy (SEM) and energy dispersive spectrometer (EDS), respectively. Electrical properties using 4-point probe equipment were also measured. If the process is performed by positioning the sample at about 4.5 mm to 5 mm from the target, a uniform Ti thin film will be deposited. However, it was found that the thin film contained a significant amount of fluorine, which greatly affects the electrical properties of the thin film. Therefore, additional experiments and studies should be performed to remove or minimize fluorine during deposition.

• Korean Journal of Materials Research
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• v.2 no.2
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• pp.110-118
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• 1992

When CVD-W films deposited on the reactively sputter-deposited TiN(${\circled1}$), the $NH_3$-RTP (rapid themal processed) TiN(${\circled2}$), and the furnace-annealed TiN submitate (${\circled3}$) by $SiH_4$, reduction, deposition rate is in the order of ${\circled1}>{\circled2}>{\circled3}$ and incubation period of W nucleation is in the order of ${\circled1}{\leq}{\circled2}<{\circled3}$. The longest incubation period of nucleation and lowest deposition rate for the CVD-W on the annealed TiN is due to the incorporation of oxygen from the nitrogen ambient containing some oxygen as contaminant into the TiN film. The higher W deposition rate and the lower incubation period of W nucleation on the RTP-TiN substrate in comparison with those on the sputtered TiN substrate seem to be due to a negative effect of the high compressive stress of the RTP-TiN on the nucleation and growth of W. Also the thickness uniformity of the W film deposited on the TiN substrate by $SiH_4$ reduction turns out to be better than that by $H_2$ reduction.

• Korean Journal of Materials Research
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• v.3 no.6
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• pp.593-597
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• 1993

Adhesion of CVD W to the TiN glue layer in the blanket W process which is a promising candidate for filing contact holes in subhalfmicron ULSIs has been investigated. The adhesion was enhanced with increasing the W film thickness due to the decrease of the TiN film stress. The adhesion strength was increased by the sputter etching of the TiN surface prior to the W deposition owing to the removal of contaminants and the increase of the surface roughness. The adhesion of the W film to the TiN glue layer property was also improved by Ar ion implantation of the TiN surface owing to the activation of the TiN surface.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2002.10b
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• pp.159-160
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• 2002

To investigate the humidity effect on tribological behaviors of Si-DLC/DLC multi-layers, the samples were prepared using a system consisted of an ion-gun for deposition DLC films and a balanced magnetron sputter for introducing silicon atoms to Si-DLC films. The Si-DLC/DLC multi-layers were composed of pure DLC films and Si-incorporated DLC films alternatively and had different bilayer numbers. Hardness and residual stress were drastically decreased through the formation of Si-DLC/DLC multi-layers compared to those of the pure and Si-incorporated DLC films. Wear results obtained under the various humidity conditions (<10%, $40{\sim}50%$, and >85%) showed that the pure DLC film was largely depended on the humidity while the Si-DLC and the Si-DLC/DLC multi-layers were little affected by the environmental humidity. Although friction coefficients of all samples were increased with the relative humidity, the multi-layer films showed relatively lower friction coefficients that those of the single films.

• Korean Journal of Materials Research
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• v.24 no.9
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• pp.451-457
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• 2014

We developed a high-performance methane gas sensor based on a $SnO_2$ hollow hemisphere array structure of nano-thickness. The sensor structures were fabricated by sputter deposition of Sn metal over an array of polystyrene spheres distributed on a planar substrate, followed by an oxidation process to oxidize the Sn to $SnO_2$ while removing the polystyrene template cores. The surface morphology and structural properties were examined by scanning electron microscopy. An optimization of the structure for methane sensing was also carried out. The effects of oxidation temperature, film thickness, gold doping, and morphology were examined. An impressive response of ~220% was observed for a 200 ppm concentration of $CH_4$ gas at an operating temperature of $400^{\circ}C$ for a sample fabricated by 30 sec sputtering of Sn, and oxidation at $800^{\circ}C$ for 2 hr in air. This high response was enabled by the open structure of the hemisphere array thin films.

• Bulletin of the Korean Chemical Society
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• v.33 no.2
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• pp.398-402
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• 2012

ZnSe/$SiO_2$ coaxial nanowires were synthesized by a two-step process: thermal evaporation of ZnSe powders and sputter-deposition of $SiO_2$. Two different types of nanowires are observed: thin rod-like ones with a few to a few tens of nanometers in diameter and up to a few hundred of micrometers in length and wide belt-like ones with a few micrometers in width. Room-temperature photoluminescence (PL) measurement showed that ZnSe/$SiO_2$ coaxial nanowires had an orange emission band centered at approximately 610 nm. The intensity of the orange emission from the $SiO_2$-sheathed ZnSe nanowires was enhanced significantly by annealing in a reducing atmosphere whereas it was degraded by annealing in an oxidizing atmosphere. The origins of the PL changes by annealing are discussed based on the energy-dispersive X-ray spectroscopy analysis results.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.175-175
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• 2009

최근 전자 소자의 소형화 집적화에 따른 대응 방안으로 한 개의 소자에 두가지 이상의 물리적 특성을 갖는 다기능성 소재의 개발에 많은 연구가 진행되고 있다. 다강체는 강유전성 (ferroelectricty ), 강자성 (ferromagnetism), 강탄성 (ferroelasticity) 중에서 두 개 이상의 현상을 나타내는 재료로, 이중에서도 특히 강유전성과 강자성을 동시에 나타내는 다강체가 학계 및 산업계로부터 집중적인 관심을 받으면서 최근 이 분야 연구가 국내 외적으로 매우 활발하게 이루어지고 있다. 이는 다강체를 이용하면 기존의 강유전 현상을 이용한 메모리소자인 FRAM이나 차세대 메모리소자로 주목을 받고 있는 MRAM을 결합한 새로운 방식의 메모리소자의 탄생이 가능할 수도 있기 때문이다. 즉, 일부 다강체가 나타내는 magnetoelectric (ME) 현상을 이용하면 자기적으로 신호를 인가하여 전기신호로 데이터를 저장하거나 또는 전기적으로 신호를 인가하여 자기적으로 데이터를 저장하는 것이 가능해지기 때문이다. 이 연구에서는 다강체 특성을 가지는 $Fe/BaTiO_3$ 이중박막을 IBSD(Ion Beam Sputter Deposition)을 이용하여 (111)Pt/Ti/$SiO_2/Si$ 기판에 증착을 하여 구조적, 전기적, 자기적 특성을 토론할 것이다.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.209-209
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• 2003

The adventages of Li alloys have attracted the attention of many research groups, many of which have investigated tin-based alloys [1-2], Despite interesting performances of these, the irreversible capacity loss systematically observed on the first cycle for these compounds is a main drawback for their use as anode materials in lithium ion cells. Not only Sn is efficient in forming alloys with Li, Si can also react with Li to form alloys with a high Li/Si ratio, like Li$\_$22/Si$\_$5/ at 400$^{\circ}C$. It corresponds to a capacity of 4200mAh/g. Electrochemical Li-Si reaction occurs between 0 and 0.3 V against Li/Li$\^$+/, so that high-energy density battery can be realized. Despite the high theoretical capacity of elements like Si, however, particles of the alloys crack and fragment due to the repeated alloying and do-alloying which occurs as cell are charged and discharged. The research groups of Muggins [3] and Besenhard [4] have proposed that the volume expansion due to the insertion of Li can be reduced in micro- and submicro-structured matrix alloys. For this reason, the research group of J.R. Dahn investigated Sn/Mo sequential sputter deposition to prepare nanocomposites [5]. In this study, we investigated the characterization and the electrochemical characteristics of sequentially sputtered Si/Mo multilayer for microbattery anode.

• Journal of the Korean Society for Heat Treatment
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• v.28 no.6
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• pp.291-295
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• 2015

IGZO single layer and $IGZO/TiO_2$ bi-layered films were deposited on glass substrate at room temperature with radio frequency magnetron sputtering to investigate the effect of $TiO_2$ buffer layer on the electrical and optical properties of the films. For all deposition, the thickness of IGZO and $TiO_2$ Buffer layer was kept at 100 and 5 nm, respectively. In a comparison of figure of merit, IGZO films with a 5-nm-thick $TiO_2$ buffer layer show the higher figure of merit ($8.40{\times}10^{-5}{\Omega}^{-1}$) than that of the IGZO single layer films ($6.23{\times}10^{-5}{\Omega}^{-1}$) due to the enhanced optical transmittance and the decreased sheet resistance of the films. The observed results mean that a 5 nm thick $TiO_2$ buffer layer in the $IGZO/TiO_2$ films results in better electrical and optical performance than conventional IGZO single layer films.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.7
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• pp.3160-3164
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• 2012

To obtain available process at low temperature, SiOC thin film was prepared with various flow rates by using the rf magnetron sputtering, and AZO thin film was also deposited on SiOC film by rf magnetron sputtering system. The optical electrical properties of the SiOC film and SiOC/AZO were analyzed by the uv visible spectrometer and PL spectra. SiOC film on n type Si showed various type emission according to the deposition condition. The SiOC film showed the blue shift with increasing the thickness in PL spectra. AZO/SiOC/Si film had a broad emission characteristic, which is enhanced the efficiency in solar cell.