• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.18 no.8
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• pp.664-671
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• 2006

We propose the correlation to predict the spreading thermal resistance on a plate with symmetrical four heat sources. The correlation transforms four heat sources to a single equivalent heat source and then the spreading thermal resistance can be obtained with the existing equation for a single heat source. When the four heat sources are mounted on a square base plate, the correlation is expressed as a function of the heat source size, the length of base plate, the plate thermal conductivity and the distance between heat sources. Compared to the results of three-dimensional numerical analysis, the spreading thermal resistance by the proposed correlation is in good agreement within 10 percent accuracy.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.39C no.3
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• pp.234-238
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• 2014

Multichip packaging was achieved the best solution to significantly reduce thermal resistance at the same time, to increase luminance intensity in LEDs packaging application. For the packaging, thermal spreading resistance is an important parameter to get influence the total thermal performance of LEDs. In this study, silicon-based multichip light emitting diodes (LEDs) packaged module has been examined for thermal characteristics in several parameters. Compared to the general conventional single LED packaged chip module, multichip LED packaged module has many advantages of low cost, low density, small size, and low thermal resistance. This analyzed module is comprised of multichip LED array, which consists of 32 LED packaged chips with supplement power of 0.2 W at every single chip. To realize the extent of thermal distribution, the computer-aided design model of 6.4 W Si-based multichip LED module was designed and was performed by the simulation basis of actual fabrication flow. The impact of thermal distribution is analyzed in alternative ways both optimizing numbers of fins and the thickness of that heatsink. In addition, a thermal resistance model was designed and derived from analytical theory. The optimum simulation results satisfies the expectations of the design goal and the measurement of IR camera results. tart after striking space key 2 times.

• Journal of the Korean institute of surface engineering
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• v.48 no.6
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• pp.297-302
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• 2015

Nanocrystalline diamond(NCD) coated aluminium plates were prepared and applied as heat sinks for LED modules. NCD films were deposited on 1 mm thick Al plates for times of 2 - 10 h in a microwave plasma chemical vapor deposition reactor. Deposition parameters were the microwave power of 1.2 kW, the working pressure of 90 Torr, the $CH_4/Ar$ gas ratio of 2/200 sccm. In order to enhance diamond nucleation, DC bias voltage of -90 V was applied to the substrate during deposition without external heating. NCD film was identified by X-ray diffraction and Raman spectroscopy. The Al plates with about 300 nm thick NCD film were attached to LED modules and thermal analysis was carried out using Thermal Transient Tester (T3ster) in a still air box. Thermal resistance of the module with NCD/Al plate was 3.88 K/W while that with Al plate was 5.55 K/W. The smaller the thermal resistance, the better the heat emission. From structure function analysis, the differences between junction and ambient temperatures were $12.1^{\circ}C$ for NCD/Al plate and $15.5^{\circ}C$ for Al plate. The hot spot size of infrared images was larger on NCD/Al than Al plate for a given period of LED operation. In conclusion, NCD coated Al plate exhibited better thermal spreading performance than conventional Al heat sink.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.26 no.7
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• pp.1022-1030
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• 2002

The experiments were performed with a $31{\times}31{\times}7mm^3$ simulated 3-dimensional module on the thermal conductive board of a parallel plate channel. The convective thermal conductance for the path from the module surface directly to airflow and conjugate thermal conductance for the path leading from the module to the floor by way of a module support, then, to the airflow were determined with several combinations of module-support-construction(210, 0.32, 0.021 K/W)/floor-material(398, 0.236W/mK) and channel height(15-30mm). As the result, it was found that the conjugate thermal conductance and the temperature distribution around the module depend on the thermal resistance of the module support, and the channel height. These configurations were designed to investigate on the feasibility of using the substrate as an effective heat spreader in the forced convective air-cooling of surface mounted heat source. The experimental results were discussed in the light of interactive nature of heat transfer through two paths, one directed from the module to the airflow and the other via the module support and the floor to the air.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.18 no.6
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• pp.477-485
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• 2006

A study on frost prevention of fin-tube heat exchanger is experimently performed by spreading antifreezing solution on heat exchanger surface. It is desirable that the antifreezing solution spreads completely on the surface forming thin liquid film to prevent frost nucleation and crystal growth and to reduce the thermal resistance across the liquid film. A small amount of antifreezing solution falls in drops on heat exchanger surface using two types of supplying devices, and a porous layer coating technique is adopted to enhance the wettedness of antifreezing solution on the surface. It is observed that the antifreezing solution liquid film prevents fin-tube heat exchanger from frosting, and heat transfer performance does not degrade through the frosting tests. The concentration of supplied antifreezing solution can be determined by heat transfer analysis of the first row of heat exchanger to avoid antifreezing solution freezing due to dilution by moisture absorption.

• Proceedings of the KSME Conference
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• 2001.06d
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• pp.214-219
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• 2001

In this study, numerical investigation has been performed on the spreading and solidification of a droplet impacting onto a solid substrate in the thermal spray process. The finite difference method with volume-of-fluid approach is used to analyze the free surface flow and the source-based enthalpy method is employed to model the latent heat release during the solidification. In this work, the numerical model is validated through the comparison of the present numerical result with experimental data available for the flat substrate.

• Journal of Mechanical Science and Technology
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• v.18 no.4
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• pp.681-688
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• 2004

For use of the thermal cycle of the biochemical fluid sample, the isothermal temperature source with a large surface area was designed, fabricated and its thermal characterization was experimentally evaluated. The comprehensive overview of the technology trend on the temperature control devices was detailed. The large surface area isothermal temperature source was realized by using the vapor chamber heat spreader. The cost-effectiveness and simple manufacturing process were achieved by using the metal-etched wick structure. The temperature distribution was quantitatively investigated by using IR temperature imaging system at equivalent temperatures to the PCR thermal cycle. The standard deviation was measured to be within 0.7$^{\circ}C$ for each temperature cycle. This concludes that the presented isothermal temperature source enables no temperature gradient inside bio-sample fluid. Furthermore it can be applied to the cooling of the electronic devices due to its slimness and low thermal spreading resistance.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.26 no.11
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• pp.1597-1604
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• 2002

In this study, numerical investigation has been performed on the impingement, spreading and solidification of a coating material droplet impacting onto a solid substrate in the thermal spray process. The numerical model is validated through the comparison of the present numerical result with experimental data fer the flat substrate without surface defects. An analysis of deposition formation on the non-polished substrate with surface defects is also performed. The parametric study is conducted with various surface defect sizes and shapes to examine the effect of surface defects on the impact and solidification of the liquid droplet on the substrate.

• Electrical & Electronic Materials
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• v.10 no.9
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• pp.881-888
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• 1997

This study demonstrats the profiles of phosphorus ions in silicon by MeV implantation(1∼3 MeV). Implanted profiles could be measured by SIMS(Cameca 4f) and compared with simulation results(TRIM program and analytical description method only using on Pearson function). The experimental result in the peak concentration region has a little bit deviation from simulation data. By RBS and Channeling measurements the defect distribution of implanted samples could be measured and spectrum are calibrated depth with RUMP simulation By XTEM measurement the thickness of defect zone also could be measured. Finally thermal annealing for the electrical activation of implanted ions carried out by RTA(rapid thermal annealing). The concentration-depth profiles after heat treatment was measured by SR(spreading resistance)-method.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.67 no.3
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• pp.448-453
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• 2018

PV module protective film plays an important role in protecting the solar cell from external environment by anti-hydrolysis polyester, UV resistance and mechanical properties. The backsheet was manufactured by using Roll-to-Roll dry laminating process. The backsheet structure is composed of 3 layers, which are PE, PET, and Fluorine polymer films. In this study, we have experimented the variation of thermal conductivities depending on MgO inputs 10% to 25% in order to confirm the dependence of the module efficiencies. High thermal conductive backsheet can increase the module output power efficiency because the heat is dissipated by spreading out the internal heat. Long-term environment weatherability tests were conducted for confirming 25 year reliability in the field such as PCT, UV, and power efficiency degradations. As the evaluation result, high thermal conductivity can be effective for increase of power efficiency of solar panel by using thermal conductive MgO masterbatch.