• Journal of Korea Foundry Society
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• v.14 no.6
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• pp.558-565
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• 1994

The horizontal continuous casting process with the heated mold was applied to obtain the unidirectionally solidified rods($4{\sim}8mm$ dia.) of pure copper with good surface quality. The results could be summarized as follows. 1. The unidirectional solidification of pure copper rods with good surface(mirror surface) quality could be obtained by placing the S/L interface inside the heated mold cavity even though the cast copper rods were covered with thin copper oxide layer. 2. The casting speed for 4mm dia. rods with mirror surfaces was affected significantly by the mold-cooler distance rather than the cooling flow rate when other casting conditions were fixed. 3. The casting speed was the main factor affecting the oxidation of copper during the continuous casting and the thickness of copper oxide layer decreased almost linearly as the casting speed increased.

• Journal of Korea Foundry Society
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• v.26 no.2
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• pp.92-97
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• 2006

Contact material is widely used as electrical parts. Ag-Cd alloy has a good wear resistance and stable contact resistance. But the disadvantages of Ag-Cd alloy are coarse Cd oxides and harmful metal, Cd. To solve the disadvantages of that, Ag-Sn alloy that has stable and fine Sn oxide at high temperature has been developed. In order to optimize Sn amount that affects the formation of the oxide layer on the surface, we worked for the microstructures and properties of Ag-Sn material fabricated by rapid solidification process. The experimental procedure were melting using high frequency induction, melt spinning, and internal oxidation. We have shown that the optimized Sn amount for high hardness is 7.09 wt%Sn. Surface oxide layer forms when Sn amount is over 9.45 wt%. The size of Sn oxide is 20 nm.

• Journal of the Korean Institute of Telematics and Electronics
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• v.25 no.8
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• pp.950-958
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• 1988

We have implemented a RTA system using W-halogen lamps and tried to recrystallize the phosphorus ion implanted amorphous silicon on insultor (SOI) taking advantages of seeding window. The purpose of this study is to investigate the possibility of a typical crystalline orientation occurred during the solidifying process of molten amorphous silicon layer. Experimental results show that several twin boundaries are found on the seeding window region after annealing for 15 sec at 1040\ulcorner. These twin boundaries represent that the recrystallization is partialy possible and when the annealing is done at 1150\ulcorner, (100) etch pits with <110> facets are found on the solidified amorphous silicon layer. Consequently, Hall mobility of recrystallized silicon film is measured and the thermal behavior of grain boundary is also observed by SEM.

• Journal of Korea Foundry Society
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• v.13 no.6
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• pp.540-546
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• 1993

The effects of fluid flow on the purification of aluminum were studied. As the revolution rate(N) increased, the size of columnar grain decreased gradually. The concentration of solidified crystal was decreased with increasing distance from chill and revolution rate(N). Distribution boundary layer thickness(${\delta}$) was calculated from the solute distribution obtained in solid experimentally and by use of BPS equation. The value of ${\delta}$ changed from about $60{\mu}m$ at N value of 27rpm to about $15{\mu}m$ at N value of 1000rpm. From this result, high purification was obtained by decreasing the diffusion boundary layer under forced convection.

• Korean Journal of Materials Research
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• v.19 no.9
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• pp.473-480
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• 2009

In order to provide the mechanism of nozzle clogging, recovered nozzles for high strength steel grade were examined carefully after continuous casting. The thickness of clogged material in SEN is increased in the following order: from the bottom to the top of the nozzle, upper part of slag line, and the pouring hole. Nozzle clogging material begins to form due the adhesion of metal to nozzle wall, the decarburization, and reduction of oxide in the refractory by Al and Ti in the melt. The reduction of oxide in the refractory by Al and Ti improves the wettability of the melt on the refractory and forms a thin Al-Ti-O layer. Metal containing micro alumina inclusions is solidified on the Al-Ti-O layer, and the solid layer grows due to the heat evolution through the nozzle wall. Thermodynamic calculation has been made for the related reactions. The effect of superheat to the nozzle clogging is discussed on ultra low carbon steel and low carbon steel.

• Journal of Korea Foundry Society
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• v.27 no.2
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• pp.72-76
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• 2007

Contact materials are widely used as electrical parts. Ag-Cd alloy has a good wear resistance and stable contact resistance. But the Cd exists as coarse oxide in alloy so it have an effect on mechanical properties badly. Moreover, the Cd is an injury material to environment. Nowadays, the use of Cd is strictly restricted. Because of these disadvantage, Ag-Sn-In alloy has been developed. In Ag-Sn-In alloy, the Sn : In ratio affects the internal oxidation properties, such as the formation of the oxide layer on the surface. In this work, we changed and optimized the Sn : In ratio variety for good internal oxidation properties. We have shown that a internal oxidation process did not fully completed when the Sn : In ratio is over 4 : 1 because of the Sn oxide layer at surface. The increase of In decelerates the formation of Sn oxide layer.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.9
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• pp.707-713
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• 2001

As the integrated circuit device shrinks to smaller dimensions, chemical mechanical polishing (CMP) process was requirdfo the global planarization of inter-metal dielectric (IMD) layer with free-defect. However, as the IMD layer gest thinner, micro-scratches are becoming as major defects. However, as the IMD layer gets thinner, micro-scratches are becoming as major defects. Micro-scratches are generated by agglomerated slurry, solidified and attached slurry in pipe line of slurry supply system. To prevent agglomerated slurry particle from inflow, we installed 0.5${\mu}{\textrm}{m}$ point of use (POU) filter, which is depth-type filter and has 80% filtering efficiency for the 1.0${\mu}{\textrm}{m}$ size particle. In this paper, we studied the relationship between defect generation and polished wafer counts to understand the exact efficiency fo the slurry filteration, and to find out the appropriate pad usage. Our experimental results showed that it sis impossible to prevent defect-causing particles perfectly through the depth-type filter. Thus, we suggest that it is necessary to optimize the slurry flow rate, and to install the high spray bar of de-ionized water (DIW) with high pressure, to overcome the weak-point of depth type filter.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.05b
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• pp.34-37
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• 2001

As the integrated circuit device shrinks to smaller dimensions, chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric (IMD) layer with free-defect. However, as the inter-metal dielectrics (IMD) layer gets thinner, micro-scratches are becoming as major defects. Micro-scratches are generated by agglomerated slurry, solidified and attached slurry in pipe line of slurry supply system. To prevent agglomerated slurry particle from inflow, we installed 0.5${\mu}m$ POU (point of use) filter, which is depth-type filter and has 80% filtering efficiency for the $1.0{\mu}m$ size particle. In this paper, we studied the relationship between defect generation and pad count to understand the exact efficiency of the slurry filtration, and to find out the appropriate pad usage. Our preliminary results showed that it is impossible to prevent defect-causing particles perfectly through the depth-type filter. Thus, we suggest that it is necessary to optimize the flow rate of slurry to overcome depth type filters weak-point, and to install the high spray of de-ionized Water (DIW) with high pressure.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.15 no.4
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• pp.93-100
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• 2016

The laser surface treatment of magnesium alloy was studied. $ZrO_2$ was used as sintering ceramics, and its corrosion resistance was verified. Appropriate laser parameters were proposed for homogeneous solidification of the sintered layer. The chemical compositions of the sintered layer were analyzed with laser-induced breakdown spectroscopy. $Na_2SO_4$ was used for a corrosion test, and the resistance of the sintered sample was confirmed. The microstructures of the sintered parts were also examined. The solidified grains on the top sintered surface were observed; however, reasonable fusion was obtained at the interface between the baseline and the ceramics. Laser surface treatment using $ZrO_2$ on magnesium alloy showed an improvement in corrosion resistance.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.08a
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• pp.12-14
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• 2003

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP). process was required for the global planarization of inter-metal dielectric (IMD) layer with free-defect. However, as the IMD layer gets thinner, micro-scratches are becoming as major defects. Micro-scratches are generated by agglomerated slurry, solidified and attached slurry in pipe line of slurry supply system. It is well known that the presence of hard and larger size particles in the CMP slurries increases the defect density and surface roughness of the polished wafers. In this paper, we have studied. aging effect the of CMP slurry as a function of particle size. We prepared and compared the self-developed silica slurry by adding of abrasives before and after annealing. As our preliminary experiment results, we could be obtained the relatively stable slurry characteristics comparable to original silica slurry in the slurry aging effect.