• Metals and materials international
• /
• 제24권6호
• /
• pp.1275-1284
• /
• 2018

A rotating magnetic field (RMF) was applied in the solidification process of Cu-8Fe alloy. Focus on the mechanism of RMF on the solid solution Fe(Cu) atoms in Cu-8Fe alloy, the influences of RMF on solidification structure, solute distribution, and material properties were discussed. Results show that the solidification behavior of Cu-Fe alloy have influenced through the change of temperature and solute fields in the presence of an applied RMF. The Fe dendrites were refined and transformed to rosettes or spherical grains under forced convection. The solute distribution in Cu-rich phase and Fe-rich phase were changed because of the variation of the supercooling degree and the solidification rate. Further, the variation in solute distribution was impacted the strengthening mechanism and conductive mechanism of the material.

• 대한용접접합학회:학술대회논문집
• /
• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
• /
• pp.798-802
• /
• 2002

Metallurgical studies on the bonded interlayer of directionally solidified Ni-base superalloy GTD111 joints were carried out during transient liquid phase bonding. The formation mechanism of solid during solidification process was also investigated. Microstructures at the bonded interlayer of joints were characterized with bonding temperature. In the bonding process held at 1403K, liquid insert metal was eliminated by well known mechanism of isothermal solidification process and formation of the solid from the liquid at the bonded interlayer were achieved by epitaxial growth. In addition, grain boundary formed at bonded interlayer is consistent with those of base metal. However, in the bonding process held at 1453K, extensive formation of the liquid phase was found to have taken place along dendrite boundaries and grain boundaries adjacent to bonded interlayer. Liquid phases were also observed at grain boundaries far from the bonding interface. This phenomenon results in liquation of grain boundaries. With prolonged holding, liquid phases decreased gradually and changed to isolated granules, but did not disappeared after holding for 7.2ks at 1473K. This isothermal solidification occurs by diffusion of Ti to be result in liquation. In addition, grain boundaries formed at bonded interlayer were corresponded with those of base metal. In the GTD-ll1 alloy, bonding mechanism differs with bonding temperature.

• Journal of Welding and Joining
• /
• 제15권4호
• /
• pp.78-89
• /
• 1997

This study has evaluated the weld metal solidification cracking behavior of several Ni base superalloys (Incoloy 825, Inconel 718 and Inconel 600). Austenitic stainless steels(304, 310S) were also included for comparison. In addition, a possible mechanism of solidification cracking in the fusion zone was suggested based on the extensive microstructural examinations with SEM, EDAX, TEM, SADP and AEM. The solidification cracking resistance of Ni base superalloys was found to be far inferior to that of austenitic stainless steels. The solidification cracking of Incoloy 825 and Inconel 718 was believel to be closely related with the Laves-austenite (Ti rich in 825 and Nb rich in 718) and MC-austenite eutectic phases formed along the grain boundaries during solidification. Cracking in Inconel 600 was always found along the grain boundaries which were enriched with Ti and P. Further, solidifidcation cracking resistance was dependent not only upon the type of love melting phases but also on the amount of the phases along the solidification grain boundaries.

• 한국소성가공학회:학술대회논문집
• /
• 한국소성가공학회 2003년도 추계학술대회논문집
• /
• pp.51-54
• /
• 2003

The continuous casting is primarily a heat-extraction process in which the heat transfer at various cooling zones profoundly influences quality of products. So development of numerical model is necessarily needed for more specific and clear investigations upon heat transfer mechanism at mold and secondary cooling zones. In this study, heat transfer coefficients which shows the characteristic of heat transfer mechanism in mold are calculated for more exact analysis with temperatures measured in bloom mold using optimal algorithm, and finally the validity of cooling conditions at secondary cooling zone which is actually used at field for 30 Ton bloom type continuous casting of 0.187%C is investigated. From the results of solidification analysis, the characteristic of bloom mold shows good agreements with that of previously studies by other authors and optimized cooling conditions for 0.187%C are presented.

• 한국주조공학회지
• /
• 제8권4호
• /
• pp.453-458
• /
• 1988

Al-Si alloy powder produced by the gas atomizer showed fine eutectic structure between ${\alpha}-dendrites$, that was grown by coupled growth, and there remained small amount of ${\alpha}$ in Al - 20 wt% Si alloy. The morphology of Si in the eutectic structure was largely influenced by the recalescence caused by solidification latent heat, and that was thought to be due to decrement of the surface energy of Si. In modified eutectic Si by rapid solidification, fine twin about $0.01\;{\mu}m$ was observed and growth direction of eutectic Si was <112>. This fact implied that the growth mechanism of eutectic Si in rapid solidification was related to TPRE mechanism. Due to rapid solidification Si was soluble in ${\alpha}-phase$ in Al - 12.6wt%Si alloy up to about 3.4wt%, and the solubility of Si in ${\alpha}-phase$ reaches the equilibrium solubility stare after 60min, holding when it was held isothermally at $253-296^{\circ}C$.

• 한국주조공학회지
• /
• 제14권5호
• /
• pp.447-454
• /
• 1994

Wear resistance and wear mechanism of hypereutectic Al-($15{\sim}40$)wt%Si alloys were investigated. Primary Si particles under $20{\mu}m$ size were formed in hypereutectic Al-Si alloy powders due to rapid solidification. But the Si particles of extruded bars were finely distributed in smaller size than that of atomized powders. The wear mechanism of hypereutectic Al-Si alloys was divided into three types of wear phenomena, which were abrasive wear, delamination wear and severe adhesive wear according to sliding speed and load. At low sliding speed and load, wear mechanism was abrasive wear, so Al-15wt%Si alloy showed the best wear resistance. At high sliding speed and load, wear mechanism was adhesive wear, and Al-40wt%Si alloy showed the best wear resistance.

• Journal of Welding and Joining
• /
• 제34권5호
• /
• pp.61-69
• /
• 2016

A numerical simulation of the solid/liquid coexistence temperature range, using solidification segregation model linked with the Kurz-Giovanola-Trivedi model, explained the mechanism of the BTR shrinkage (with an increase in welding speed) in type 310 stainless steel welds by reduction of the solid/liquid coexistence temperature range of the weld metal due to the inhibited solidification segregation of solute elements and promoted dendrite tip supercooling attributed to rapid solidification of laser beam welding. The reason why the BTR enlarged in type 316 series stainless welds could be clarified by the enhanced solidification segregation of impurity elements (S and P), corresponding to the decrement in ${\delta}-ferrite$ crystallization amount at the solidification completion stage in the laser welds. Furthermore, the greater increase in BTR with type 316-B steel was determined to be due to a larger decrease in ${\delta}-ferrite$ amount during welding solidification than with type 316-A steel. This, in turn, greatly increases the segregation of impurities, which is responsible for the greater temperature range of solid/liquid coexistence when using type 316-B steel.

• 제어로봇시스템학회:학술대회논문집
• /
• 제어로봇시스템학회 2001년도 ICCAS
• /
• pp.76.4-76
• /
• 2001

ESR(ElectroSlag Remelting) Process is secondary fine process and melts steels by electric resistance heat and fines the melting steels by an approproate solidification process. The final products are determined through the velocity of melting and the course of solidification in the process that is achieved by way of proper course of solidification. Thus, it is very important to monitor and control the process parameters which affects the melting and solidification process to get the high quality products. This paper describes a method to derive the mathematical model and analysis the dynamic characteristics for designing a controller of the ESR processes. The process consists of a melting and solidifying process and electrical system include the contact resistance mechanism ...

• Journal of Welding and Joining
• /
• 제21권2호
• /
• pp.82-88
• /
• 2003

The bonding phenomenon and mechanism in the transient liquid phase bonding(TLP Bonding) of directionally solidified Ni base superalloy, GTD-111 was investigated. At the bonding temperature of 1403K, liquid insert metal was eliminated by isothermal solidification which was controlled by the diffusion of B and Si into the base metal and solids in the bonded interlayer grew epitaxially from mating base metal inward the insert metal. The number of grain boundaries formed at the bonded interlayer was corresponded with those of base metal. The liquation of grain boundary and dendrite boundary occurred at 1433K. At the bonding temperature of 1453K which is higher than liquation temperature of grain boundary, liquids of the Insert metal were connected with liquated grain boundaries and compositions in each region mixed mutually. In Joints held for various time at 1453t phases formed at liquated grain boundary far from the interface were similar to those of bonded interlayer. With prolonged holding time, liquid phases decreased gradually and liquids of continuous band shape divided many island shape. But liquid phases did not disappeared after holding for 7.2ks at 1453k. Isothermal solidification process at the bonding temperature which is higher than the liquation temperature of the grain boundary was controlled by diffusion of Ti to be result in liquation than B or Si. in insert metal. (Received January 15, 2003)

• 한국재료학회지
• /
• 제12권12호
• /
• pp.897-903
• /
• 2002

Morphological evolution and growth mechanism at the solid/liquid interface during solidification were investigated in the Ni-base superalloy GTD111M by directional soldification and quenching(DSQ) technique. The experiments were conducted by changing solidification rate(V) and thermal gradient(G) which are major solidification process variables. High thermal gradient condition could be obtained by increasing the furnace temperature and closely attaching the heating and cooling zones in the Bridgeman type furnace. The dendritic/equiaxed transition was found in the G/V value lower than $0.05$\times$10{^3}^{\circ}C$s/$\textrm{mm}^2$, and the planar interface of the MC-${\gamma}$ eutectic was found under $17 $\times$ 10{^3}^{\circ}C$ s/$\textrm{mm}^2$. It was confirmed that the dendrite spacing depended on the cooling rate(GV), and the primary spacing was affected by the thermal gradient more than solidification rate. The dendrite lengths were decreased as increasing the thermal graditne, and the dendrite tip temperature was close to the liquidus temperature at $50 \mu\textrm{m}$/s.