• 한국전기전자재료학회논문지
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• 제13권4호
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• pp.294-299
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• 2000

For practical application as a humidity sensor SnO$_2$thick films devices were fabricated on the refresh type electrode by screen printing method and their material and humidity sensing properties were investigated. As a function of Sb$_{2}$/O$_{3}$ addition rate grain size was increased while porosity and initial resistance were rapidly decreased. And the area of resistance variation according to relative humidity was decreased with increasing heat treatment temperature. SnO$_2$thick film device heat treated at 95$0^{\circ}C$ and contained 0.05mole% Sb$_{2}$/O$_{3}$ had a best humidity sensing properties. From this result it is conformed that humidity sensing properties of SnO$_2$thick film devices could be approved by very small amount of Sb$_{2}$/O$_{3}$ addition.

• 소성∙가공
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• 제30권1호
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• pp.22-26
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• 2021

The present study demonstrated the effects of processing variable and alloying elements on the processing window of austempered cast iron, one of the heat-treatable cast irons, in order to elucidate the relation between heat treatment and microstructure in terms of time and temperature. Such microstructure is strongly affected by austenitizing conditions and alloying elements. The size of processing window tends to increase initially with increasing austenitizing temperature from 1123 to 1173 K, followed by a decline in the reverse direction between 1173 and 1223 K. Thus, the optimized processing window with large frame was found at an austenitizing temperature of 1173 K. To determine the effect of Sn addition, the processing window in the sample was created by the addition of 0.08 wt.% Sn, which appeared larger than that without Sn and with 0.06 wt.% Sn.

• 대한화학회지
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• 제24권3호
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• pp.183-192
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• 1980

$SnO_2$, Sb-doped $SnO_2$>, 그리고 백금촉매하에서 일산화탄소의 산화반응을 연구하였다. $SnO_2$ 및 Sb-doped $SnO_2$ 촉매하에서 산화반응은 CO 및 $O_2$에 대해서 각각 1차, 백금 촉매하에서는 1/2차 반응에 따랐다. $SnO_2$에 소량의 Sb첨가(dopant composition : 0.05∼0.1mole%)는 반응속도를 증가시키고 그 이상의 첨가는 오히려 반응속도를 감소시켰다. 백금 촉매하의 산화반응에서는 일산화탄소의 농도가 증가함에 따라 반응속도가 오히려 감소하는 억제효과를 보여주었다. 각 촉매하에서 산화반응의 활성화에너지는 Sb-dopoped $SnO_2$ 촉매 (dopant compisito : 0.05 mole%)에서 5.7 kcal, 백금 촉매에서 6.4 kcal이었다. 실험적으로 얻은 반응차수와 doping 효과로부터 가능한 반응메카니즘을 제안하였다.

• 대한화학회지
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• 제38권3호
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• pp.241-245
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• 1994

산화성 첨가반응을 이용하여 실라트란(분자내 Si-N고리횡단 상호작용을 갖는 5-배위의 규소화합물)의 규소원자와 주족원소간에 Si-M 결합작용이 있는 새로운 이종다핵 화합물을 합성하려고 시도하였다. 1-브로모실라트란(1a)과 $SnBr_2를 반응시켜 노란색(2a)과 흰색(2b)의 고체 혼합물을 얻었고 용해도 차에 의해 각각을 분리하여 ^1H-NMR, ^{29}Si-NMR, ^{119}Sn-NMR, Mass스펙트럼으로 규명한 결과 노란색 화합물만이 Si-Sn결합을 갖는 것으로 판명되었다. SnBr_2를 1-브로모-3,7,10-트리메틸실라트란(1b)과도 반응시켜 Si-Sn 결합을 갖는 화합물, N[CH_2CH(CH_3)O]_3SiSnBr_3(CH_3OH)_2(3)$을 분리하여 여러가지 방법으로 확인하였다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1993년도 정기총회 및 추계학술대회 논문집 학회본부
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• pp.181-184
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• 1993

Microwave characteristics of the system (Zr, Sn)$TiO_4$, ceramics within composition range X between 0.2 and 0.35 were investigated at 8GHz. For the improvement properties of (Zr, Sn)$TiO_4$, system, $Ta_2O_5$ and $WO_3$ addition in the range of 0.5 to 2.0wt% were investigated.

• 한국주조공학회지
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• 제34권6호
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• pp.187-193
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• 2014

In the present work, the effect of adding Ce on the corrosion behavior of Mg-4Al-2Sn-1Ca alloy was investigated. The studied alloys were fabricated by gravity casting method and a potentiodynamic polarization, A.C. impedance and hydrogen evolution tests were carried out in a 3.5% NaCl solution with pH 7.2 at room temperature to measure the corrosion properties of Mg-4Al-2Sn-1Ca-xCe alloys. The microstructure of the Mg-4Al-2Sn-1Ca alloy was composed of ${\alpha}$-Mg, Mg17Al12, Mg2Sn and CaMgSn phase. Also, a $Al_{11}Ce_3$ phase was newly formed by the addition of Ce. With an increase of the Ce contents, the microstructure became refined and the corrosion resistance improved.

• 마이크로전자및패키징학회지
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• 제7권2호
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• pp.13-19
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• 2000

금속간 화합물의 두께와 솔더와 금속간 화합물의 계면 거칠기가 Cu pad위의 BGA솔더 조인트의 전단강도에 미치는 영향을 Sn (0. 1.5, 2.5wt.% Cu)와 Sn-40Pb (0, 0.5wt.% Cu) 솔더를 사용하여 알아보았다. 각각의 조성의 솔더를 사용하여 솔더링 반응을 1, 2 ,4분 동안 한 후 전단강도를 측정하였다. Sn솔더에 Cu 첨가는 초기 금속간 화합물의 두께를 증가시키는 결과를 가져오는 반면 Sn-40Pb 솔더의 경우에는 주로 금속간 화합물/솔더의 계면거칠기의 감소를 가져오게 된다. 최대 전단 강도값을 나타내는 금속간 화합물의 임계두께는 솔더의 물질에 따라 변하게 되는데, 본 실험에서는 Sn-Cu솔더의 경우에는 ~2.3 $\mu\textrm{m}$, Sn-Pb-Cu에서는 ~ 1.2 $\mu\textrm{m}$ 정도로 측정되었다. 금속간 화합물의 임계두께는 금속간 화합물/솔더의 계면이 더욱 거칠어질수록 증가하는 것으로 나타났다. 이는 파단면 관찰에서 나타난 초기의 솔더내에서의 파괴가 금속간 화합물이 임계두께 이상으로 성장함에 금속간 화합물/솔더의 계면으로 이동하는 결과와 일치한다.

• 한국전기전자재료학회논문지
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• 제37권1호
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• pp.74-78
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• 2024

We have studied the effects of Ag on the characteristics of Sn₄₈In₅₂Ag_x (wt%) low-melting solders for photovoltaic ribbons. The Sn₄₈In₅₂ (wt%) solder coexisted in the InSn₄ and In₃Sn alloys. Ag atoms added in the solder formed an AgIn₂ alloy by reacting with some part of In atoms, while they did not react with Sn atoms. The addition of Ag atoms in the Sn₄₈In₅₂Ag_x (wt%) solders showed useful results; an increase in peel strength and a decrease in melting temperature. The peel strength of the ribbon plated with the Sn₄₈In₅₂ (wt%) solder was 53.6 N/mm², and that of the Sn₄₈In₅₂Ag₁ (wt%) solder largely increased to 125.1 N/mm². In the meanwhile, the melting temperature of the Sn₄₈In₅₂ (wt%) solder was 119.2℃, and that of the Sn₄₈In₅₂Ag₁ (wt%) solder decreased to 114.0℃.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.73-73
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• 2000

Shear strength of BGA solder joints on Cu pad was studied for Cu-contained Sn n.5 a and 2.5wt.% Cu) and Sn-Pb (o.5wt.% Cu) solders, with emphasis on the roles of the C Cu-Sn intermetallic layer thickness and the roughness of the interface between the i intermetallic layer and solder. The shear strength test was performed both for a as-soldered s이der joints with soldering reaction times of 1, 2, 4 min and for aged s이der j joints at 170 C up to 16 days. The Cu addition to both pure Sn and eutectic Sn-Pb s solders increased the intermetallic layer thickness at both soldering and aging t temperatures. The Cu addition also resulted in changes in the roughness of the interface b between the intermetallic layer and solder at as-soldered states. With increasing Cu c content. the interface roughened for Sn-Cu solders whereas it flattened for Sn-Pb-Cu s solders. The shear fractures in all solder joints investigated were confined in the bulk s solder rather than through the intermetallic layer. Therefore, the effect of Cu content in s solders on the shear strength of the solder joints was primarily attributed to its i influence on the micros$\sigma$ucture of bulk solder, such as the size and spatial distributions of CU6Sn5 precipitates. In addition, the critical intermetallic layer thickness for a m maximum shear strength seemed to depend on the Cu content in bulk solder.older.

• 한국전기전자재료학회논문지
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• 제18권1호
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• pp.57-61
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• 2005

The microwave dielectric properties of 0.6TiTe$_3$O$_{8}$-0.4MgTiO$_3$ ceramics with H$_3$BO$_3$-SnO were investigated to improve the sintering condition for the LTCC. According to the X-ray diffraction patterns, 0.6TiTe$_3$O$_{8}$-0.4MgTiO$_3$ ceramics with H$_3$BO$_3$-SnO had the columbite structure of TiTe$_3$O$_{8}$ phase and the ilmenite structure of MgTiO$_3$ phase and there were no second phase. Increasing the addition of H$_3$BO$_3$-SnO, the density and dielectric constant of the 0.6TiTe$_3$O$_{8}$-0.4MgTiO$_3$ ceramics were increased but the quality factor was decreased. The temperature coefficient of resonant frequency was shifted to the negative(-) direction with addition of H$_3$BO$_3$-SnO.EX>-SnO.