• Journal of Magnetics
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• v.14 no.1
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• pp.7-10
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• 2009

In this work, we studied the effects of Sn addition on the ordering temperature of FePt thin film. The coercivity of FePtSn film was about 1000 Oe greater than the coercivity of FePt film for an annealing temperature of $600^{\circ}C$. Therefore, Sn addition was effective in promoting the $L1_0$ ordering and in reducing the ordering temperature of the FePt film. From our X-ray diffraction results, we found that in the as-deposited film, the addition of Sn induced a lattice expansion in disordered FePt thin films. After the annealing process, the excess Sn diffuses out from the ordered FePt thin film because of the difference in the solid solubility of Sn between the disordered and ordered phases. The existence of precipitates of Sn from the FePt lattice was deduced by Curie temperature measurements of the FePt and FePtSn films. Therefore, the key role played by the addition of Sn to the FePt film can be explained by a reduction in the activation energy for the $L1_0$ order-disorder transformation of FePt which originates from the high internal stress in the disordered phase induced by the supersaturated Sn atoms.

• Journal of the Korean Ceramic Society
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• v.34 no.12
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• pp.1221-1226
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• 1997

The effects of sintering atmosphere and dopant addition on the behavior of densification and grain growth of SnO2 ceramics were investigated with consideration of defect chemistry. CoO and Nb2O5 were chosen as dopants, and oxygen and nitrogen were used for controlling of sintering atmospheres. With the decrease of oxygen partial pressure, densification was depressed due to evaporation of SnO2 ceramics. In the case of SnO2 sintering, the addition of CoO, which produced oxygen vacancy in SnO2 ceramics, led to acceleration of densification and grain growth. On the contrary, when Nb2O5 as a dopant producing Sn vacancy was added to SnO2 ceramics, densification and grain growth were simultaneously retarded. As results, it was conformed that diffusion of oxygen ions was rate determinant in densification and grain growth of SnO2 ceramics.

• Journal of the Korean Society for Heat Treatment
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• v.27 no.4
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• pp.185-190
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• 2014

The influences of small amount of Sn addition on microstructure and creep resistance of AZ91-0.4%Ca alloy have been investigated. The microstructure of the AZ91-0.4%Ca alloy was characterized by ${\alpha}$-(Mg) dendrite cells surrounded by eutectic ${\beta}(Mg_{17}Al_{12})$ and $Al_2Ca$ phases. The 0.5%Sn addition resulted in the formation of rod-shaped CaMgSn particles with the extinction of $Al_2Ca$. The Sn-containing alloy exhibited better creep resistance below $175^{\circ}C$, but the tendency was reversed above $200^{\circ}C$. The reason was discussed in relation to the change in thermal stability of ${\beta}$ phase in response to the Sn addition.

• Journal of Korea Foundry Society
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• v.37 no.3
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• pp.63-70
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• 2017

In the present study, effects of an addition of Sn on the microstructure and corrosion behavior were investigated in Mg-4%Zn-(0-3)%Sn casting alloys. With an increase in the Sn content, the ${\alpha}-(Mg)$ dendritic cell size was reduced, whereas the total amount of precipitates increased due to the formation of the $Mg_2Sn$ phase. It was found in immersion and electrochemical corrosion tests that the addition of Sn has a detrimental effect on the corrosion resistance of the Mg-4%Zn alloy. Microstructural examinations of the corrosion product and the corroded surface indicated that an accelerated micro-galvanic effect by the $Mg_2Sn-phase$ particles and a less protective corrosion product on the surface were responsible for the increased corrosion rate at a higher Sn content.

• Korean Journal of Metals and Materials
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• v.48 no.3
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• pp.248-255
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• 2010

The effect of various alloying elements and melt treatment on the microstructural control of Al-Sn metallic bearing alloy was investigated. The thickness of tin film crystallized around primary aluminum decreased with the addition of 5% Cu in Al-Sn alloy, with tin particles being reduced in size by intervening the Ostwald ripening. With the addition of Si in Al-10%Sn alloy, the tin particles were crystallized with eutectic silicon, resulting in uniform distribution of tin particles. With the addition of Cu and Si in Al-Sn alloy, both the tensile strength and yield strength increased, with the increasing rate of yield strength being less than that of tensile strength. Although the Al-10%Sn-7%Si alloy has similar tensile strength compared with Al-10%Sn-5%Cu, the former showed superior abrasion resistance, resulting from preventing the tin particles from movement to the abrasion surface.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.1171-1172
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• 2006

Addition of 2.0wt%$Dy_2O_3$ or 0.3wt%Sn proved to be very effective in improving the permanent magnetic properties of NdFeNbB magnets. $Dy_2O_3$ additions result in the increase in the Hci and temperature dependence due to formation of (NdDy)-rich phase and grain refinement of $\Phi$ phase. This improvement of the coercivity stability of the magnets from the addition of Sn is attributed to the smoothing effect of the Sn addition at the grain boundaries. The magnetic properties, the temperature dependence and Curie temperature of NdFeNbB with $Dy_2O_3$ and Sn combined addition were found to be considerably improved.

• Korean Journal of Materials Research
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• v.12 no.4
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• pp.248-253
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• 2002

Effect of Sn addition on the fatigue properties of Al-Cu-Mn cast alloy was investigated by low and high cycle fatigue tests. Fatigue life showed the maximum value of 5450cycles in the Al-Cu-Mn alloy containing 0.10%Sn, but decreased rapidly beyond 0.20% of Sn additions. It was found that the fatigue strength was 132MPa and fatigue ratio was 0.31 in the alloy containing 0.10%Sn. Metallographic observation revealed that the fatigue crack initiated at the surface and propagated along the grain boundary. This propagation path was attributed to the presence of PFZ along the grain boundary. The tensile strength increased from 330MPa in 7he Sn-free Al-Cu-Mn cast alloy to 429MPa in the alloy containing 0.10%Sn. But above 0.20%Sn additions, tensile strength was decreased by the segregation of Sn.

• Korean Journal of Materials Research
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• v.8 no.11
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• pp.1011-1019
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• 1998

This work designed Sn-5%Pb-1.5%Ag-x%In solder alloy to develop the solder alloy with low Pb content. This solder alloy doesn't cause environmental pollution. and this study reviewed the probability of replacement of Sn-37%Pb solder as evaluation of melting range, wettability. microstructure, microhardne'ss, tensile strength, drossability of this new solder alloys. The level of international regulation in dissolution amount of Pb ion was 3ppm. But dissolution amount of Pb ion in Sn-5%Pb solder alloy confirmed not to threat the global environmental is 0.46ppm. The melting range of this solder alloy was $183-192^{\circ}C$. Also the range of solidification was very narrow within $5^{\circ}C$. The wettability was similar to Sn-37%Pb solder, and the effect of amount of In addition of wettability couldn't be founded. The probability of replacement in the melting range and wettability is very high. And microhardness of this solder alloy was 1.5 times of conventional type solder. Tensile strength of new solder alloys was a little high than that of conventional type solder. With increasing amount of In% addition, tensile strength was increased, but elongation was decreased. The solder alloy of l%In addition revealed AgSn and Pb on dendrite microstructure boundary, and $Ag_3Sn$, $Ag_3In$ and Pb were revealed on it at the solder alloy of 3% In addition. The drossability was superior to Sn-37%Pb solder alloy and the solder alloys of 2% In addition was not generated for 3hrs.

• Korean Journal of Materials Research
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• v.12 no.6
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• pp.436-441
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• 2002

Effect of Sn addition on the stress corrosion cracking(SCC) resistance of the Al-Cu-Mn cast alley was investigated by C-ring teat and electrical conductivity measurement, The electrical conductivity and SCC resistance increased by Sn addition. The alley containing 0,10%Sn showed maximum electrical conductivity and the best SCC resistance. At the same composition, the electrical conductivity and SCC resistance increased from peak aged condition to ever aged condition. The PFZ and coarse precipitates along the grain boundary were observed from TEM micrographs. The fracture mode of the alloy was confirmed as intergranular type and showed brittle fracture surface. The SCC mechanism of the alloy was concluded as the anodic dissolution model, The maximum hardness was increased from 130Hv in the Sn-free alloy to 156Hv in the 0.10%Sn added alloy.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.496-499
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• 2000

In order to investigate the effect of Ge addition to the Cu Matrix on the microstructure and the critical current density, four kinds of internal tin processed Nb$_3$Sn strands with pure Cu and Cu 0.2, 0.4, 0.6 wt％ Ge alloy were drawn to 0.8 mm diameter. The microstructure and critical current of internal tin processed Nb$_3$Sn wires that were heat treated at temperatures ranging from 68$0^{\circ}C$ to 74$0^{\circ}C$ for 240 h were investigated. The Ge addition to the matrix did not make workability worse. A Ge rich layer in the Cu-Ge matrix suppressed the growth of the Nb$_3$Sn layer and promoted grain coarsening. The greater the Ge content in the matrix, the lower the net Jc result after Nb$_3$Sn reaction heat treatment. There was no significant variation in Jc observed with heat treatment temperature ranging from 68$0^{\circ}C$ to 74$0^{\circ}C$.