• Corrosion Science and Technology
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• v.6 no.6
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• pp.282-285
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• 2007

Smaller size and higher integration of electronic systems make narrower interconnect pitch not only in chip-level but also in package-level. Moreover electronic systems are required to operate in harsher conditions, that is, higher current / voltage, elevated temperature / humidity, and complex chemical contaminants. Under these severe circumstances, electronic components respond to applied voltages by electrochemically ionization of metals and conducting filament forms between anode and cathode across a nonmetallic medium. This phenomenon is called as the electrochemical migration. Many kinds of metal (Cu, Ag, SnPb, Sn etc) using in electronic packages are failed by ECM. Eutectic SnPb which is used in various electronic packaging structures, that is, printed circuit boards, plastic-encapsulated packages, organic display panels, and tape chip carriers, chip-on-films etc. And the material for soldering (eutectic SnPb) using in electronic package easily makes insulation failure by ECM. In real PCB system, not only metals but also many chemical species are included. And these chemical species act as resources of contamination. Model test systems were developed to characterize the migration phenomena without contamination effect. The serpentine-shape pattern was developed for analyzing relationship of applied voltage bias and failure lifetime by the temperature / humidity biased(THB) test.

• Economic and Environmental Geology
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• v.26 no.1
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• pp.41-54
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• 1993

The Ulsan Fe-W deposit, which can be classified as a calcareous skarn deposit, is represented by ore pipe consisting principally of magnetite and lesser amounts of scheelite with minor sulphides, sulphosaits, arsenides, sulpharsenides, etc. At Ulsan mine, metasomatic processes of skarn growth may be divided broadly into two stages based on the paragenetic sequence of calc-silicate minerals and their chemical composition; early and late skarn stages. Early stage has started with the formation of highly calcic assemblages of wollastonite, diopsidic clinopyroxene and nearly pure grossular, which are followed by the formation of clinopyroxenes with salite to ferrosalite composition and grandite garnets with intermediate composition. Based on these calc-silicate assemblages, the temperatures of early skarn formations have been in the ranges of $550^{\circ}$ to $450^{\circ}$. The calc-silicate assemblages formed during the earlier half period of late skarn stage show the enrichment of notable iron and slight manganese, and the depletion of magnesium; clinopyroxenes are hedenbergitic, and grandite garnets are andraditic. The formation temperatures during this skarn stage are inferred to have been in the range of $430^{\circ}$ to $470^{\circ}C$ at low $X_{CO_2}$ by data from fluid inclusions of late andraditic garnets. The later half period of late skarn stage is characterized by the hydrous alteration of pre-existing minerals and the formation of hydrous silicates. The main iron-tungsten mineralization representing prominent deposition of magnetite immediately followed by minor scheelite impregnation has taken place at the middle of early skarn stage, while complex polymetallic mineralization has proceeded during and after the late skarn stage. Various metals and semimetals of Fe, Ni, Co, Cu, Zn, As, Mo, Ag, In, Sn, Sb, Te, Pb and Bi have been in various states such as native metal, sulphides, arsenides, sulphosaits, sulpharsenides and tellurides.

• Korean Journal of Metals and Materials
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• v.48 no.12
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• pp.1056-1063
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• 2010

We present a new joining method for Pd-Cu membrane foils used as permeation tubes to collect $CO_2$. Since foils have poor mechanical strength, joining should be done at low temperatures to reduce residual stresses and without joining pressure. This contradicts the well known conditions for good contact between base materials that determines joint qualities. We selected Sn-Ag-Cu alloys that are highly reactive with Pd and Cu as a filler metal. As the filler melts at joining temperatures as low as $220{\sim}280^{\circ}C$, Pd and Cu are dissolved into the melt and react with the filler elements, which raises the melting temperature of the filler based on eutectic structures among the elements. Then, isothermal solidification progresses for the rest of the joining time. Intermetallic compounds (IMC) in the joints, one of the main factors for brittle joints, are inevitably formed. However, by optimizing both joining time and temperature, we balanced the wettability with IMC. Sealing test results confirmed that the joints are mechanically reliable during operation.

• Economic and Environmental Geology
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• v.13 no.3
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• pp.167-184
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• 1980

The granitic plutons associated with Ogcheon geosynclinal zone can be grouped into three different subzones; SE-Subzone for the migmatitic and schistose granites of the southeast margin, 101-181m.y. old; NW-Subzone for those of the northwest margin, 112-163m. y. old; and C-Subzone for those of central part of the zone, 63-183m.y. old. The intrusives in C-Subzone are further subdivided into the older, adamellite to granodiorite (148-183m.y. old) and the younger, perthitic granites (63-106m,y. old). The metallogenic distribution of South Korea suggests that, in the Ogcheon Zone, it is possible to delineate an elongated polymetallogenic province in the general orientation of the zone intimately related with the migmatite and plutonic zones mentioned. Moreover, the mineralization in the province was basically controlled by the patterns of local geology involving country rocks and related igneous bodies, that permit subdivision of the province into the following three parts: Northeast (NE) Province consists dominantly of thick Paleozoic calcareous sediments; Middle (M) Province is characterized by predominant argillaceous and partly calcareous sediments of Precambrian to Late Paleozoic age; and Southwest (SW) Province consisting mainly of volcanic and arenaceous sediments of Mesozoic age. The three different plutonic zones with three different country rock provinces above mentioned make a combination which consists of nine classes. Each class can be assumed to be characterized by specific mineralization type. In order to classify the mineralization types, the present study sampled twenty six ore deposits and mineralized areas in Ogcheon zone as shown figure 2; eight ore deposits from plutonic SE-Subzone, ten from the plutonic NE-Subzone and eight from the plutonic C-Subzone. The characteristics of the classes are as follows: NE-SE is predominant in Au-Ag vein and Sn-migmatite of katazonal occurrence; NE-C is most productive in Pb-Zn and remarkable in Fe contact deposit in mesozone and partly Pb-Zn-Cu skarn in limestone and subordinate in mesozone and partly Pb-Zn pipes; M-SE is considerable in Au-Ag vein and rare elements (Nb, Ta, etc.) of pegmatite; M-C is predominant in F-veins in epizone and Mo-W, Fe, Cu veins occur in replacement type; M-NW is productive in Fe metamorphic and skarn types, partly remarkable in Cu, Pb-Zn contact; SW-SE is barren in mineralization related to Jurassic igneous rocks; SW-C is predominant in alunite and pyrophyllite in tuffs; and SW-NW is scarece in Pb-Zn, Cu, As and Au-Ag veins.

• Korean Journal of Oriental Medicine
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• v.6 no.1
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• pp.117-122
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• 2000

The purpose of this study is to compare the contents of heavy metals of boiled ssangwhatang with those of herbal ingredients which are composed of ssangwhatang. Ssangwhatang is used for antifatigue, tonic and so on. With industrial development, our environment has been very polluted. Herbal medicines also are seriously contaminated by heavy metals and pesticides. The herbal medicines of ssangwhatang were bought at 10 defferent markets. The contents of 14 heavy metals(Ag, As, Ba, Cd, Cr, Cu, Fe, Hg, Mn, Ni, Pb, Sb, Sn, Zn) were analysed using ICP. It was found out that 7 heavy metals(Pb, As, Ba, Cd, Hg, Sb, Sn) were not detected at all in boiled ssangwhatangs. But they were detectable in all ssangwhatangingredients before boiling. For example, the content of Pb in one pack of ssangwhatang before boiling was $0.039^{\circ}{\pm}0.005mg$ and Pb in boiled one was not detected. Herbal medicine itself is seriously contaminated by heavy metals. These results suggest that boiled ssangwhatang which we take is safe from the contamination of heavy metals.

• ETRI Journal
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• v.13 no.2
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• pp.42-53
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• 1991

고유전율 적충세라믹 커패시터 소재인 $BaTiO_3$ 자기물은 일반적으로 큐리오도인 약 $120^{\circ}C$부근에서 유전율이 최고 약 10,000정도로 증가한 다음 급격히 감소하므로 적절한 이동체를 첨가하여 큐리온도를 상온으로 이동시켜 상온에서 최대 유전율을 이용하여야 한다. 그리고$BaTiO_3$ 자기물은 $1300^{\circ}C$이상의 고온소결시 고가인 Pd전극이 요구된다. 그러나 자기물의 소결온도를 저온화화면 저가의 Ag합금으로 전극재료를 대체할 수 있다. 본 연구에서는 이동제로서 $CaSnO_3$ 를 이용하여 큐리온도를 상온으로 이동시켰다. 또한 소결온도를 저온화하기 위하여 $BaTiO_3$ 세라믹에 여러가지 산화물을 첨가하여 소결현상을 살펴보았다. 실험결과 첨가제를 넣지 않은 경우 소결온도는 $1350^{\circ}C$의 고온이 필요한 반면, $CuO,B_2O_3$는 $1050^{\circ}C$의 낮은 온도에서도 치밀화와 입도성장이 잘 일어났다. 특히 $B_2$$O_3$ 를 첨가한 경우는 $1250^{\circ}C$이상에서 소결할 때 절연저항이 낮아 유전손실이 큰 문제점을 보였지만, 최대 유전율이 11,000 정도로 높고, 양호한 유전율의 온도변화 특성을 나타내어 우수한 고유전율 소재의 첨가제로 응용될 가능성을 보였다

• Journal of Welding and Joining
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• v.32 no.3
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• pp.74-80
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• 2014

Due to environmental regulations (RoHS, WEEE and ELV) of the European Union, electronics and automotive electronics have to eliminate toxic substance from their devices and system. Especially, reliability issue of lead-free solder joint is increasing in car electronics due to ELV (End-of-Life Vehicle) banning from 2016. We have prepared engine control unit (ECU) modules soldered with Sn-40Pb and Sn-3.0Ag-0.5Cu (SAC305) solders, respectively. Degradation characteristics of solder joint strength were compared with various conditions of automobile environment such as cabin and engine room. Thermal cycle test (TC, $-40^{\circ}C$ ~ ($85^{\circ}C$ and $125^{\circ}C$), 1500 cycles) were conducted with automotive company standard. To compare shear strength degradation rate with eutectic and Pb-free solder alloy, we measured shear strength of chip components and its size from cabin and engine ECU modules. Based on the TC test results, finally, we have known the difference of degradation level with solder alloys and use environmental conditions. Solder joints degradation rate of engine room ECU is superior to cabin ECU due to large CTE (coefficient of thermal expansion) mismatch in field condition. Degradation rate of engine room ECU is 50~60% larger than cabin room electronics.

• Journal of the Korean Society of Safety
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• v.27 no.6
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• pp.7-13
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• 2012

A lack of study on the dynamic tensile strengths of Sn-based solder joints at high strain rates was the motivation for the present study. A modified miniature Charpy impact testing machine instrumented with an impact sensor was built to quantitatively evaluate the dynamic impact strength of a solder joint under tensile impact loading. This study evaluated the tensile strength of lead-free solder ball joints at strain rates from $1.8{\times}10^3s^{-1}$ and $8.5{\times}10^3s^{-1}$. The maximum tensile strength of the solder ball joint decreases as the load speed increases in the testing range. This tensile strength represented that of the interface because of the interfacial fracture site. The tensile strengths of solder joints between Sn-3.0Ag-0.5Cu and copper substrate were between 21.7 MPa and 8.6 MPa in the high strain range.

• Korean Journal of Materials Research
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• v.19 no.6
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• pp.337-343
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• 2009

In this study, we optimized Pb-free Sn/Ni plating thickness and conditions were optimized to counteract the environmental regulations, such as RoHS and ELV(End-of Life Vehicles). The $B_{10}$ life verification method was also suggested to have been successful when used with the accelerated life test(ALT) for assessing Pb-free solder joint life of piezoelectric (PZT) ceramic resonator. In order to evaluate the solder joint life, a modified Norris-Landzberg equation and a Coffin-Manson equation were utilized. Test vehicles that were composed of 2520 PZT ceramic resonator on FR-4 PCB with Sn-3.0Ag-0.5Cu for ALT were manufactured as well. Thermal shock test was conducted with 1,500 cycles from $(-40{\pm}2)^{\circ}C$ to $(120{\pm}2)^{\circ}C$, and 30 minutes dwell time at each temperature, respectively. It was discovered that the thermal shock test is a very useful method in introducing the CTE mismatch caused by thermo-mechanical stress at the solder joints. The resonance frequency of test components was measured and observed the microsection views were also observed to confirm the crack generation of the solder joints.

• Restorative Dentistry and Endodontics
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• v.17 no.2
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• pp.287-306
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• 1992

The amounts of copper, mercury, silver, tin, and zinc released from conventional, dispersed phase and spherical high copper content amalgam immersed in artificial saliva soln. for periods of 2 hours, 1 day, 7 days, 30 days has been measured using Neutron Activation analysis and Atomic Absorption Spectrophotometry. The second electron image and EDX of the surface of samples immersed in artificial saliva were observed using SEM. The following results were obtained. 1. The dispersed non-$\gamma_2$ amalgam released more Hg, Ag than the $\gamma_2$-amalgams. Later a decrease of the release rate could be observed. 2. The dispersed high copper amalgam released more copper than low-copper amalgam and the release rate was decreased with time. But the amounts of copper released from Tytin increased with time. 3. Zinc was released all the experiment time. 4. EDAX showed that surface was composed of Ca,P, Sn, Ag, Zn, and Cu, but C1 was not detected. 5. The discontinued destructed surface was observed from the polished amalgam surface. High copper amalgam was destructed more than low copper amalgam.