Korean Journal of Materials Research (한국재료학회지)

Materials Research Society of Korea (한국재료학회)
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Accelerated Thermo-Mechanical Fatigue Life of Pb-Free Solder Joints for PZT Ceramic Resonator

PZT 세라믹 레조네이터 무연솔더 접합부의 열-기계적 피로 가속수명

  • Hong, Won-Sik (Physics-of-Failure Research Center, Korea Electronics Technology Institute) ;
  • Park, No-Chang (Physics-of-Failure Research Center, Korea Electronics Technology Institute) ;
  • Oh, Chul-Min (Physics-of-Failure Research Center, Korea Electronics Technology Institute)
  • 홍원식 (전자부품연구원 고장물리연구센터) ;
  • 박노창 (전자부품연구원 고장물리연구센터) ;
  • 오철민 (전자부품연구원 고장물리연구센터)
  • Published : 2009.06.27
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Abstract

In this study, we optimized Pb-free Sn/Ni plating thickness and conditions were optimized to counteract the environmental regulations, such as RoHS and ELV(End-of Life Vehicles). The $B_{10}$ life verification method was also suggested to have been successful when used with the accelerated life test(ALT) for assessing Pb-free solder joint life of piezoelectric (PZT) ceramic resonator. In order to evaluate the solder joint life, a modified Norris-Landzberg equation and a Coffin-Manson equation were utilized. Test vehicles that were composed of 2520 PZT ceramic resonator on FR-4 PCB with Sn-3.0Ag-0.5Cu for ALT were manufactured as well. Thermal shock test was conducted with 1,500 cycles from $(-40{\pm}2)^{\circ}C$ to $(120{\pm}2)^{\circ}C$, and 30 minutes dwell time at each temperature, respectively. It was discovered that the thermal shock test is a very useful method in introducing the CTE mismatch caused by thermo-mechanical stress at the solder joints. The resonance frequency of test components was measured and observed the microsection views were also observed to confirm the crack generation of the solder joints.

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References

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