• Clean Technology
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• v.11 no.3
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• pp.153-164
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• 2005

This study found a reliable evaluation for four kinds of pb-Free plating solutions and it's layers, through pure Sn, SnAg, SnBi and SnCu. These four kind of solutions are widely used to pb-Free plating. Hull-cell, Harring-blum, coverage, throwing power, current efficiency, stability, life-time, composition, hardness, roughness, abrasion, scratch, solderability, corrosion, contact angle, morphology, SIR(Surface insulation resistance) and Whisker test were experimented. Also, Using ICP, XRF, FE-SEM, EDS, temperature/humidity chamber, solderability tester, hardness tester, roughness tester, abrasion tester, salt spray tester, contact angle tester, SIR tester, and microscope. In this paper could be shown the systematic and various analysis for reliability about four kinds of pb-Free plating solutions, processes and it's deposit surface.

• Restorative Dentistry and Endodontics
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• v.18 no.2
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• pp.431-445
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• 1993

The purpose of this study was to observe corrosion characteristics of six dental amalgams and was to analyse corrosion products electrochemically. After each amalgam alloy and Hg was triturated as the direction of the manufacturer by using mechanical amalgamator, the triturated mass was inserted into the cylinderical metal mold ($12{\times}10mm$) and was condensed with 160kg/$cm^2$ by using the hydrolic press. The specimen was removed from the mold and was stored at room temperature for 1 week, and was polished with amalgam polishing kit. The anodic and cathodic polarization curve was obtained by using cyclic voltammetric method with 3-electrode potentiostat in saline for each amalgam and Ag, Sn, Cu plate specimen at $37{\pm}0.5^{\circ}C$. The potential sweep range was -1.7V~0. 4V(vs SCE) in working electrode and scan rate was 50mV/s and the exposed surface area of each specimen to the electrolytic solution was $0.79cm^2$. The results were as follows. 1. In anodic-cathodic polarization curve of amalgam specimens, two anodic current rising areas and two cathodic current peaks were obtained at the low Cu amalgam(CF, CS) specimen and three anodic current rising areas and three cathodic current peaks were obtained at the high Cu amalgam (TY, DS, HV) specimen. 2. As this compared with the anodic and cathodic current peak potentials of Sn, Cu and Ag specimen, the first cathodic current peak I c was caused by the reduction of divalent tin salt, second cathodic current peak IIIc results from the reduction of quadravalent tin salt, and third cathodic current peak me results from the reduction of copper salt. 3. As reverse potential sweeping was done repeatedly, anodic current was decreased slightly in all amalgam specimens.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.11a
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• pp.287-288
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• 2015

최근 투명 산화물 전극 (TCO)은 LED, electronic display, solar cell, touch screen panel (TSP) 등 다양한 분야에 많이 사용되고 있다. TCO는 높은 광 투과도와 전도성으로 인해 여러 분야에 많이 사용되고 있으며, 특히 ITO (Sn-doped indium oxide)가 display 분야에 많이 적용되고 있다. 하지만, ITO는 투과도와 면저항의 반비례 관계를 가지므로 더 낮은 면저항이 요구되는 대면적 TSP 분야에 적용되기에는 많은 개선이 필요하다. 따라서, 본 연구에서는 metal mesh film의 연구를 통해 TSP 분야에 사용되는 ITO를 대체하고자 한다. 제작된 mesh film은 모두 면저항은 $15{\Omega}/{\square}$ 이하, 광 투과도 90% (@550nm) 이상을 나타내었다.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.17-27
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• 2011

This paper describes an experimental study and finite element analysis (FEA) carried out for investigating thermal deformation behavior of solders, resulting from temperature change in the solder. With such a goal in mind, a shear specimen that was composed of two metal bars having different coefficient of thermal expansion and solder blocks placed between two bars was designed and fabricated. Two different types of solder blocks, eutectic solder (Sn/36Pb/ 2Ag) and lead-free solder (Sn/3.0Ag/0.5Cu) were tested as well. Fringe patterns for several temperature steps were recorded and analyzed for three temperature cycles using a real-time moir$\acute{e}$ setup. The experimental data was verified with FEA and used to evaluate the suitability for numerous solder constitutive models available in literatures. FEA employing Anand material model suggested by Darveaux et al. and Chang et al. were found to be in an excellent agreement with the experimental results for the eutectic solder and the lead-free solder, respectively. In addition, numerical predictions on bending displacement, shear strain and viscoplastic distortion energy are documented and viscoplastic deformation behavior of two types of solder material are compared.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.81-81
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• 2018

Bi-Te계 열전소자는 상온에서의 열전 효율이 우수하기 때문에 항공, 컴퓨터 등의 열전발전 또는 열전냉각 모듈에 널리 사용된다. 이 열전소자를 활용한 열전모듈은 다수의 n형 및 p형 열전소자가 세라믹 위에 형성된 Cu 전극에 전기적으로 직렬이 되도록 서로 솔더링 접합이 되어 있는 구조를 가지고 있다. 이처럼 직렬 연결된 방식에서는 높은 접합강도를 필요로 한다. 열전모듈 제작 시 Bi-Te 계 소자를 바로 Cu 기판에 접합시키면 솔더에 들어있는 Sn과 기판의 Cu가 접합하는 과정에서 소재 내로 확산하여 접합강도를 저하시킨다. 이러한 열전모듈의 접합강도 저하를 막기 위해 무전해 Ni-W-P 도금층을 확산 방지층으로 적용하였다. 본 연구에서는 Ni-W-P 도금이 Bi-Te 계 열전 모듈의 접합강도에 미치는 영향을 조사하였다. 본 연구에서는 Bi-Te계 열전소자에 양호한 밀착성을 가지는 Ni-W-P 도금층을 형성시키기 위해서 알루미나 분말을 이용한 sand-blasting 방법을 사용하여 Bi-Te 소재 표면에 분사하는 방법으로 표면을 거칠게 하였다. 그 후 무전해 Ni-W-P 도금을 $85^{\circ}C$에서 20분간 실시하여 약 4um의 Ni-W-P 도금층을 형성시켰다. 열전 모듈은 Sn-Ag-Cu 솔더를 사용하여 제작하였으며 접합강도는 Bonding tester를 사용하여 측정하였다. 제작한 열전 모듈의 단면 및 파단면 관찰을 통하여 접합강도가 변하는 요인을 조사하였다. 제작한 열전 모듈의 단면을 FE-EPMA로 관찰한 결과 Ni-W-P 도금층이 Bi-Te 소자와 Sn과 Cu사이의 확산을 방지하는 확산방지층 역할을 하는 것을 관찰할 수 있었다. 또한 열처리 전 열전모듈과 200도, 150시간 열처리 후 접합강도를 각각 측정해 본 결과, 열처리 후의 접합강도가 상승하는 것을 확인 할 수 있었다. 따라서 Bi-Te계 열전모듈 제작에 무전해 Ni-W-P 도금층을 형성시키므로 인해 확산방지층의 생성과 접합강도의 상승에 도움을 주었다.

• Journal of the Korean Chemical Society
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• v.31 no.6
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• pp.555-566
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• 1987

Fifty ancient Korean coins originated in Yi Dynasty have been determined for 9 elements such as Sn, Fe, As, Ag, Co, Sb, Ir, Ru and Ni by instrumental neutron activation analysis and for 3 elements such as Cu, Pb, and Zn by atomic absorption spectrometry. Bronze coins originated in early days of the dynasty contain as major constituents Cu, Pb and Sn approximately in the ratio 90 : 4 : 3, whereas, those in latter days contain in ratio 7 : 2 : 0. Brass coins which had begun in 17 century contain as major constituents Cu, Zn and Pb approximately in the ratio 7 : 1 : 1. The multivariate data have been analyzed for the relation among elemental contents through the variance-covariance matrix. The data have been further analyzed by a principal component mapping method. As the results training set of 8 class have been chosen, based on the spread of sample points in an eigen vector plot and archaeological data such as age and the office of minting. The training set and test set of samples have finally been analyzed for the assignment to certain classes or outliers through the statistical isolinear multiple component analysis (SIMCA).

• Journal of Welding and Joining
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• v.17 no.3
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• pp.79-89
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• 1999

The study was carried out to examine in more detail metallurgical and mechanical properties of brazed joints of diamond cutting wheel. In this work, shank(mild steel) and sintered bronze-base tips were brazed with three different filler materials(W-40, BAgl and BAg3S). The machine used in this work was a high frequency induction brazing equipment. The joint thickness, porosities and microstructure of brazed joints with brazing variables(brazing temperature, holding time) were evaluated with OLM, SEM, EDS and XRD. Bending(torque) test was also performed to evaluate strength of brazed joints. Further wetting test was performed in a vacuum furnace in order to evaluate the wettability of filler metals on base metals9shank and tips). The brazing temperature had a strong influence on the joint strength and the optimum brazing temperature range was about $700~850^{\circ}C$ for the bronze/steel combinations. The strength of the brazed joint was found to be influenced by the three factors : degree of reaction region, porosity content, joint thickness. The reaction region was formed in the bronze-base tip adjacent to the joint. The reaction region resulted in a bad influence on the strength due to the formation of Cu5.6Sn, CuZn4, $\beta(CuZn)$ and CdAg, etc. Porosities increased as brazing variables(brazing temperature, holding time) increased, and the brazed joints with porosities of less than about 3-5% had an optimum strength for the bronze-base tip.

• Journal of Conservation Science
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• v.19
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• pp.67-72
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• 2006

The chemical compositions and lead isotope ratio of Poong-Tag(wind bell) bell excavated from Wanggyeong site, Gyeongju have analyzed by ICP and TIMS. The analysis result of chemical composition of Poong-Tag shows that it consists of 92:4 ratio of Cu:Sn. Other 8 minor elements(Pb, Zn, Fe, Ag, Ni, As, Sb and Co) show the concentration of below 0.2% respectively. This result means that Poong-Tag have made using highly purified Cu and Sn ore. For the study of provenance of raw material with the lead isotope ratio, the origin of the raw material of Poong-Tag can not be presumed owing to beyond the scope. The observation result of microstructure of Poong-Tag show the dendrite structure made through casting process. The chemical composition, microstructure, and lead isotope ratio of Poong-Tag excavated from Wanggyeong site, Gyeongju can be used as fundamental data to compare with other Poong-Tag of different regions and periods.

• Journal of Welding and Joining
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• v.32 no.3
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• pp.60-67
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• 2014

The ability of electronic packages and assemblies to resist solder joint failure is becoming a growing concern. This paper reports on a study of high speed shear energy of Sn-4.0wt%Ag-0.5wt%Cu (SAC405) solder with different electroless Ni-P thickness, with $HNO_3$ vapor's status, and with various pre-conditions. A high speed shear testing of solder joints was conducted to find a relationship between the thickness of Ni-P deposit and the brittle fracture in electroless Ni-P deposit/SAC405 solder interconnection. A focused ion beam (FIB) was used to polish the cross sections to reveal details of the microstructure of the fractured pad surface with and without $HNO_3$ vapor treatment. A scanning electron microscopy (SEM) and an energy dispersive x-ray analysis (EDS) confirmed that there were three intermetallic compound (IMC) layers at the SAC405 solder joint interface: $(Ni,Cu)_3Sn_4$ layer, $(Ni,Cu)_2SnP$ layer, and $(Ni,Sn)_3P$ layer. The high speed shear energy of SAC405 solder joint with $3{\mu}m$ Ni-P deposit was found to be lower in pre-condition level#2, compared to that of $6{\mu}m$ Ni-P deposit. Results of focused ion beam and energy dispersive x-ray analysis of the fractured pad surfaces support the suggestion that the brittle fracture of $3{\mu}m$ Ni-P deposit is the result of Ni corrosion in the pre-condition level#2 and the $HNO_3$ vapor treatment.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.11-17
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• 2010

The electromigration phenomenon in lead-free flip-chip solder joint has been one of the serious problems. To understand the mechanism of this phenomenon, the crystallographic orientation of Sn grain in the Sn-Ag-Cu solder bump has been analyzed. Different time to failure and different microstructural changes were observed in the all test vehicle and bumps, respectively. Fast failure and serious dissolution of Cu electrode was observed when the c-axis of Sn grain parallel to electron flow. On the contrary of this, slight microstructural changes were observed when the c-axis of Sn perpendicular to electron flow. In addition, underfill could enhance the electromigration reliability to prevent the deformation of solder bump during EM test.