• Nuclear Engineering and Technology
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• v.52 no.4
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• pp.681-688
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• 2020

The telegrapher's theory was used to develop a new formulation for the neutron noise equation. Telegrapher's equation is supposed to demonstrate a more realistic approximation for neutron transport phenomena, especially in comparison to the diffusion theory. The physics behind such equation implies that the signal propagation speed is finite, instead of the infinite as in the case of ordinary diffusion. This paper presents the theory and results of the development of a new method for calculation of the neutron noise using the telegrapher's equation as its basis. In order to investigate the differences and strengths of the new method against the diffusion based neutron noise, a comparison was done between the behaviors of two methods. The neutron noise based on SN transport considered as a precision measuring point. The Green's function technique was used to calculate the neutron noise based on telegrapher's and diffusion methods as well as the transport. The amplitude and phase of Green's function associated with the properties of the medium and frequency of the noise source were obtained and their behavior was compared to the results of the transport. It was observed, the differences in some cases might be considerable. The effective speed of propagation for the noise perturbations were evaluated accordingly, resulting in considerable deviations in some cases.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.59-63
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• 2010

Immersion Sn plating was produced on Cu foil by distributing nano-sized diamonds (ND). The ND distributed on the coating surface broke the continuity of Sn-oxide layer, therefore leading to penetrate the molten solder through the oxide and retarding the wettability degradation during a reflow process. Furthermore, the ND in the Sn coating played a role of diffusion barrier for Sn atoms and decreased the growth rate of intermetallic compound ($Cu_6Sn_5$) layer during the solid-state aging. The study confirmed the importance of ND to improve the wettability and reliability of the Sn plating. Complete dispersion of the ND within the immersion Sn plating needs to be further developed for the electronic packaging applications.

• Current Photovoltaic Research
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• v.5 no.3
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• pp.83-88
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• 2017

The growth of intermetallic compounds is an important factor in the reliability of solar cells. Especially, the temperature change in the soldering process greatly affects the thickness of the intermetallic compound layer. In this study, we investigated the intermetallic compound growth by Sn-diffusion in solder joints of solar cells. The thickness of the intermetallic compound layer was analyzed by IR lamp power and hot plate temperature control, and the correlation between the intermetallic compound layer and the adhesive strength was confirmed by a $90^{\circ}$ peel test. In order to investigate the growth of the intermetallic compound layer during isothermal aging, the growth of the intermetallic compound layer was analyzed at $85^{\circ}C$ and 85% for 500 h. In addition, the activation energy of Sn was calculated. The diffusion coefficient of the intermetallic compound layer was simulated and compared with experimental results to predict the long-term reliability.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.9
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• pp.741-746
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• 2010

Three-dimensionally ordered macro-porous Sn-C composites were prepared by using polystyrene microsphere as a template. The Sn-C composites were composed of well-interconnected pore with circular shape and wall structure with wall thickness of a few tens of nano-meters. This porous three-dimensional structure is readily and uniformly accessible to the electrolyte, which facilitates lithium ion diffusion during charge-discharge reactions. The wall thickness of the composites was increased as the increase of Sn content of the composite. From EDS analysis, it is confirmed that the Sn was dispersed uniformly in Sn-C composites. The capacity was increased as the Sn content increased, which is due to Sn anode with high capacity. The Sn-C composites with high Sn content showed superior cyclic performances. Such enhancement is ascribed to the thick wall thickness and small pore size of the sample with high Sn content. The Sn-C composite with Sn 30 wt% showed relatively high capacity and stable cycle life, however, the stability of the 3-dimensional structure should be enhanced by further work.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.59-64
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• 2013

In-situ annealing tests of Cu/Ni/Au/Sn-Ag/Cu micro-bump for 3D IC package were performed in an scanning electron microscope chamber at $135-170^{\circ}C$ in order to investigate the growth kinetics of intermetallic compound (IMC). The IMC growth behaviors of both $Cu_3Sn$ and $(Cu,Ni,Au)_6Sn_5$ follow linear relationship with the square root of the annealing time, which could be understood by the dominant diffusion mechanism. Two IMC phases with slightly different compositions, that is, $(Cu,Au^a)_6Sn_5$ and $(Cu,Au^b)_6Sn_5$ formed at Cu/solder interface after bonding and grew with increased annealing time. By the way, $Cu_3Sn$ and $(Cu,Au^b)_6Sn_5$ phases formed at the interfaces between $(Cu,Ni,Au)_6Sn_5$ and Ni/Sn, respectively, and both grew with increased annealing time. The activation energies for $Cu_3Sn$ and $(Cu,Ni,Au)_6Sn_5$ IMC growths during annealing were 0.69 and 0.84 eV, respectively, where Ni layer seems to serve as diffusion barrier for extensive Cu-Sn IMC formation which is expected to contribute to the improvement of electrical reliability of micro-bump.

• Journal of Welding and Joining
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• v.20 no.1
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• pp.97-102
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• 2002

The growth kinetics of intermetallic compound layers formed between the eutectic Sn-3.5Ag solder and the Cu and Ni/Cu pad by solid stateisothermal aging were examined. The interfacial reaction between the eutectic Sn-3.5Ag solder and the Cu and Ni/Cu pad was investigated at 70, 120, 150, $170^{\circ}C$ for various times. The intermetallic compound layer was composed of two phase: $Cu_6Sn_5$(${\varepsilon}-phase$) adjacent to the solder and $Cu_6Sn_5$(${\varepsilon}-phase$) adjacent to the copper and on solder/Ni pad the intermetallic compound layer was $Ni_3Sn_4$. Because the values of time exponent(n) have approximately 0.5, the layer growth of the intermetallic compound was mainly controlled by volume diffusion over the temperature range studied. The apparent activation energy for layer growth of total Cu-Sn($Cu_6Sn_5 + Cu_6Sn$), $Cu_6Sn_5$, $Cu_3Sn$ and $Ni_3Sn_4$ intermetallic compound were 64.82kJ/mol, 48.53kJ/mol, 89.06kJ/mol and 71.08kJ/mol, respectively.

• Journal of Internet Computing and Services
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• v.19 no.4
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• pp.15-26
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• 2018

This study focused on the difference of the volume of sanitory pad issue and The aim of this study is to explore the relationship between the characteristics of SNS and the diffusion of issue in the process of crisis issue. SNS is categorized into communication diffusion, communication restriction,, diffusion, restriction base on the media interactivity and the user interactivity, In case of Twitter, media interactivity is low and user interactivity is low. In case of Youtube, media interactivity and user interactivity are all high. Crisiss issue is interactively diffused via Youtube compared to via Twitter. There was a negative public opinion in social media even if the government and the manufacturer said that there was no harm in the sanitary goods. In conclusion, this study highlights the importance of social media environment in the diffusion of information. The government prepared for the use of SNS in crisis because there was a negative opinion on the government and the manufacturer via SNS.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2001.06a
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• pp.42-43
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• 2001

• Journal of the Korean Ceramic Society
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• v.36 no.11
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• pp.1266-1273
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• 1999

• Journal of the Korean institute of surface engineering
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• v.27 no.5
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• pp.292-302
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• 1994

Alloy deposits of 80Sn-20Pb, electroplated on Cu-based leadframe alloy from an organic sulfonate bath were aged at $150^{\circ}C$ to form intermetallic phases between substrate and deposit, and effects of the deposit morphology, influenced by deposition conditions, on the fracture resistance of the 80Sn-20Pb deposit aged at $150^{\circ}C$ were examined. The growth rate of intermetallic compound layer on aging depended on the microstructure of deposit ; it was fastest in deposit formed using pulse current in bath without grain refining additive, but slowest in deposit formed using dc current in bath containing grain refining additive in spite of similar structure with equivalent grain size. The grain refining additive incorporated in electrodeposit appears to inhibit diffusion of atoms on aging, resulting in slow growth of intermetallic layer in the thickness direction but substantial growth in the lateral one. Density of surface cracks that were occurring when samples were subjected to the $90^{\circ}$-bending test increased with increasing the thickness of intermatallic layer on aging. For the same aged samples, the surface crack density of the sample electrodeposited from a bath containing the grain refining additive was the least due to the inhibiting effect of the additive incorporated into the deposit during electrolysis on atomic diffusion.