• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.2
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• pp.119-125
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• 2017

We have studied the effects of Ag on the characteristics of $Sn_{43}Bi_{57}Ag_x$(wt%) lead-free solders for photovoltaic ribbon. Ag atoms in the solder formed an alloy phase of Ag3Sn after reacting with some part of Sn atoms, while they did not react with Bi atoms, but decreased the mean size of Bi solid phase and the thickness of solder. When Ag atoms of 3.0 wt% was added to eutectic $Sn_{43}Bi_{57}$(wt%) solder, it showed the optimally useful results that the peel strength of photovoltaic ribbon greatly increased and the sheet resistance of the solder decreased. In the meanwhile, the eutectic $Sn_{43}Bi_{57}$(wt%) solder showed a low melting temperature of $138.9^{\circ}C$, and showed a very similar result regardless of the added amount of Ag atoms.

• Transactions on Electrical and Electronic Materials
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• v.15 no.3
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• pp.155-158
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• 2014

The phase transformation of Sn-Pb-Bi solder for photovoltaic ribbon during soldering was studied using real-time synchrotron x-ray scattering. At room temperature, Sn and Pb crystal phases in the solder existed separately. By heating to $92^{\circ}C$, a new PbBi alloy crystal phase was formed, which grew further up to $160^{\circ}C$. The Sn crystal phase first started to melt at $160^{\circ}C$, and was mostly melted at $165^{\circ}C$. In contrast, the Pb and PbBi crystal phases started to melt at $165^{\circ}C$, and were mostly melted at $170^{\circ}C$. The useful result was obtained, that the solder's melting temperature decreased from $183^{\circ}C$ to $170^{\circ}C$ by addition of a small amount of Bi atoms to the eutectic Sn62-Pb38 (wt%) solder. Our study first revealed the detailed in-situ phase transformation of Sn-Pb-Bi solder during heating to the eutectic temperature. Considering the results of peel strength and hardness, adding 1 wt% of Bi atoms to the Sn62-Pb38 (wt%) solder produced an appropriate composition.

• Journal of Korea Foundry Society
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• v.20 no.3
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• pp.208-215
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• 2000

The mechanical properties and corrosion resistance of Ti alloys for medical implants have been investigated. Ti, Ti-15Sn-4Nb and Ti-15Sn-4Nb-2Zr alloys were melted in arc furnace and the corrosion resistance of Ti alloys was evaluated by anodic polarization test. The microstructure and mechanical properties of Ti alloys were analysed by optical microscope, hardness and tensile tester. The tensile strength of the pure-Ti improved by addition of Sn and Nb and Ti-15Sn-4Nb alloy showed better Rockwell hardness compared with pure Ti. However, there was no significant difference in corrosion resistance between thoseTi-alloys made of Pure-Ti and Ti-15Sn-4Nb alloy. The passive films on the Ti-15Sn-4Nb alloy in air atmosphere consisted of $TiO_2$, SnO and NbO as demonstrated by X-ray photoelectron spectroscopy(XPS)

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.70-73
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• 2004

Two different $SnO_2$ nanomaterials(nanowires and nanobelts) were synthesized from the thermal evaporation of ball-milled $SnO_2$ powders at $1350^{\circ}C$ without the presence of any catalysts, and their structural properties are then investigated by X-ray diffraction, scanning electron microscopy, and transmission electron microscopy. This investigation reveals that the $SnO_2$ nanowires are single-crystalline and their growth direction is parallel to the [100] direction, and that the $SnO_2$ nanobelts are single crystalline and their shape is zigzag. In addition, photoresponse of a single $SnO_2$ nanowire was performed with light above-gap energy, and different characteristics of photoresponse were obtained for the nanowire at ambient atmosphere and in vacuum.

• Korean Journal of Materials Research
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• v.26 no.9
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• pp.468-471
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• 2016

$SnO_2:CNT$ thick films for gas sensors were fabricated by screen printing method on alumina substrates and were annealed at $300^{\circ}C$ in air. The nano $SnO_2$ powders were prepared by solution reduction method using tin chloride ($SnCl_2.2H_2O$), hydrazine ($N_2H_4$) and NaOH. Nano $SnO_2:CNT$ sensing materials were prepared by ball-milling for 24h. The weight range of CNT addition on the $SnO_2$ surface was from 0 to 10 %. The structural and morphological properties of these sensing material were investigated using X-ray diffraction and scanning electron microscopy and transmission electron microscope. The structural properties of the $SnO_2:CNT$ sensing materials showed a tetragonal phase with (110), (101), and (211) dominant orientations. No XRD peaks corresponding to CNT were observed in the $SnO_2:CNT$ powders. The particle size of the $SnO_2:CNT$ sensing materials was about 5~10 nm. The sensing characteristics of the $SnO_2:CNT$ thick films for 5 ppm $H_2S$ gas were investigated by comparing the electrical resistance in air with that in the target gases of each sensor in a test box. The results showed that the maximum sensitivity of the $SnO_2:CNT$ gas sensors at room temperature was observed when the CNT concentration was 8wt%.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.1 s.34
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• pp.47-52
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• 2005

Worldwide movement for prohibition of Pb usage drives imminent implementation of Pb-free solders in microelectronic packaging industry. Reliability information of Pb-free solders has not been completely constructed yet. One of the potential reliability concerns of Pb-free solders is allotropic transformation of Sn known as tin pest. Volume increase during the formation of tin pest could deteriorate the reliability of solder joints. It was also reported that the addition of soluble elements (i.e. Pb, Bi, and Sb) into Sn can effectively suppress the tin pest. However, the mechanical properties of the tin pest resistant alloys have not been studied in detail. In this study, lap shear creep test was conducted with Sn and Sn-0.7Cu based solder alloys doped with minor amount of Bi or Sb. Shear strain rates of the alloy were generally higher than those of Sn-3.5Ag based alloys. Rupture strains and corresponding Monkman- Grant products were largest for Sn-0.5Bi alloy and smallest for Sn-0.7Cu-0.5Sb alloy. Rupture surface Sn-0.5Bi alloy showed highly elongated $\beta$-Sn globules necked to rupture by shear stresses, while elongation of $\beta$-Sn globules of Sn-0.7Cu-0.5Sb alloy was relatively smaller.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.71-79
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• 2021

In this study, we have successfully fabricated the Sn-Ni paste and evaluated the bonding properties for high-temperature endurable EV (Electric Vehicle) power module applications. From evaluating of the micro-structural changes in the TLPS (Transient Liquid Phase Sintering) joints with Sn and Ni contents in the Sn-Ni pastes, a lack of Ni powders and Ni particle agglomerations by Ni surplus were observed in the Sn-20Ni and Sn-50Ni joints (in wt.%), respectively. In contrast, relatively dense microstructures are observed in the Sn-30Ni and Sn-40Ni TLPS joints. From differential scanning calorimetry (DSC) thermal analysis results of the fabricated Sn-Ni paste and TLPS bonded joints, we confirmed that the complete reactions of Sn with Ni to form Ni-Sn intermetallic compounds (IMCs) at bonding temperatures occurred, and there is no remaining Sn in the joints after TLPS bonding. In addition, the interfacial reactions and IMC phase changes of the Sn-30Ni joints under various bonding temperatures were reported, and their mechanical shear strength were investigated. The TLPS bonded joints were mainly composed of residual Ni particles and Ni₃Sn₄ intermetallic phase. The average shear strength tended to increase with increasing bonding temperature. Our results indicated a high shear strength value of approximately 30 MPa at a bonding temperature of 270 ℃ and a bonding time of 30 min.

• Journal of Powder Materials
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• v.25 no.4
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• pp.302-308
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• 2018

A lean alloy is defined as a low alloy steel that minimizes the content of the alloying elements, while maintaining the characteristics of the sintered alloy. The purpose of this study is to determine the change in microstructure and mechanical properties due to the addition of silicon or tin in Fe-Mo-P, Fe-Mn-P, and Fe-Mo-Mn-P alloys. Silicon- or tin-added F-Mo-P, Fe-Mn-P, and Fe-Mo-Mn-P master alloys were compacted at 700 MPa and subsequently sintered under a $H_2-N_2$ atmosphere at $1120^{\circ}C$. The sintered density of three alloy systems decreases under the same compacting pressure due to dimensional expansion with increasing Si content. As the diffusion rate in the Fe-P-Mo system is higher than that in the Fe-P-Mn system, the decrease in the sintered density is the largest in the Fe-P-Mn system. The sintered density of Sn added alloys does not change with the increasing Sn content due to the effect of non-dimensional changes. However, the effect of Si addition on the transverse rupture strengthening enhancement is stronger than that of Sn addition in these lean alloys.

• Tribology and Lubricants
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• v.37 no.3
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• pp.83-90
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• 2021

In this study, an ultrasonic nanocrystal surface modification (UNSM) was used to improve the mechanical properties, scratch resistance and tribological performance of Cu-based bimetals, which are usually used to manufacture sliding bearings and bushings for internal combustion engines (ICEs). Two different Cu-based bimetals, namely CuPb10Sn10 and CuSn10Bi7, were sintered onto a low carbon steel substrate. The mechanical properties and dry tribological performance using a tensile tester and micro-tribo tester were evaluated, respectively. The scratch resistance was assessed using a micro-scratch tester at an incremental load. The tensile test results showed that the yield strength (YS) and ultimate tensile strength (UTS) of both Cu-based bimetals increased after UNSM. Furthermore, the scratch and tribological tests results revealed that the scratch resistance and tribological performance of both Cu-based bimetals were improved by the application of UNSM. These improvements were mainly attributed to the eliminated pores, increased hardness and reduced roughness after UNSM. CuSn10Bi7 demonstrated better mechanical properties, scratch resistance and tribological performance than CuPb10Sn10. It was found that the presence of Bi in CuSn10Bi7 formed a Cu₁₁Bi₇ intermetallic phase, which is harder than Cu₃Sn. Hence, CuSn10Bi7 demonstrated higher strength and wear resistance than CuPb10Sn10. In addition, a CuSn10Bi7 formed both SnO₂ and Bi₂O₃ that prevented adhesion and improved the tribological performance. It can be expected that under dry tribological conditions, ICEs can utilize UNSM bearings and bushings made of CuSn10Bi7 instead of CuPb10Sn10 under oil-lubricated conditions.

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.185.2-185.2
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• 2015

Tin Oxide (SnO2) has been widely investigated as a transparent conducting oxide (TCO) and can be used in optoelectronic devices such as solar cell and flat-panel displays. In addition, it would be applicable to fabricating the wide bandgap semiconductor because of its bandgap of 3.6 eV. There have been concentrated on the improvement of optical properties, such as conductivity and transparency, by doping Indium Oxide and Gallium Oxide. Recently, with development of fabrication techniques, high-qulaity SnO2 epitaxial thin films have been studied and received much attention to produce the electronic devices such as sensor and light-emitting diode. In this study, powder sputtering method was employed to deposit epitaxial thin films on sapphire (0001) substrates. A commercial SnO2 powder was sputtered. The samples were prepared with varying the growth parameters such as gas environment and film thickness. Then, the samples were characterized by using XRD, SEM, AFM, and Raman spectroscopy measurements. The details of physical properties of epitaxial SnO2 thin films will be presented.