• 한국표면공학회지
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• 제15권4호
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• pp.192-207
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• 1982

A study has been made of the interaction parameters of Zn other elements in dilute solutesd solution of molten cadmium alloys over the temperature range of 450 to 570$^{\circ}C$. The experi-mental measurementss were made in a touch instant cell using a fusedd Licl-KCl electrolyte. The activity of zinc in binary and ternary solutions sexhibiteds a strong positive deviation from Raoult's law. The addition of silver, indium or lead increased the activity of zinc whereas addition of copper, bismuth or tin decreased the zinc activity slightly. The results for all the metallic solutions showed a linear dependence of reciprocal of ab-solute temperature over the experimental range. The interaction parameters obtained are as follows.

• 한국CDE학회논문집
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• 제11권1호
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• pp.27-40
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• 2006

The exchange of parameterized feature-based CAD models is important for product data sharing among different organizations and automation systems. The role of feature-based modeling is to gonerate the shape of product and capture design intends In a CAD system. A feature is generated by referring to topological entities in a solid. Identifying referenced topological entities of a feature is essential for exchanging feature-based CAD models through a neutral format. If the CAD data contains the modification history in addition to the construction history, a matching mechanism is also required to find the same entity in the new model (post-edit model) corresponding to the entity in the old model (preedit model). This problem is known as the persistent naming problem. There are additional problems arising from the exchange of parameterized feature-based CAD models. Authors have analyzed previous studies with regard to persistent naming and characteristics for the exchange of parameterized feature-based CAD models, and propose a solution to the persistent naming problem. This solution is comprised of two parts: (a) naming of topological entities based on the object spore information (OSI) and secondary name (SN); and (b) name matching under the proposed naming.

• 한국전기전자재료학회논문지
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• 제31권3호
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• pp.156-159
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• 2018

Inductively coupled plasma (ICP) treatment with argon and a mixture of argon and oxygen gases has been used to modify the surface of polycarbonate (PC) substrates. The results showed that the surface contact angle was inversely proportional to the plasma discharge power and that the mixed-gas plasma (gas flow 10:10 sccm, discharge power 60 W) decreased the surface contact angle as low as $18.3^{\circ}$, indicating a large increase in the surface hydrophilicity. In addition, $SnO_2$ thin films deposited on the PC substrate effectively enhanced the ICP plasma treatment, and could also enhance the usefulness of PC in the inner parts of automobiles.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.30-30
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• 2008

Lead-free piezoelectric ceramics 0.97$(Na_{0.5}K_{0.5})NbO_3$-0.03Ba$(Ti_{1-x}Sn_x)O_3$ [NKN-BTS-x] ceramics doped with 1 mol% $MnO_2$ have been fabricated by a sintering technique with muffling. The $MnO_2$-doped NKN-BTS-x ceramics with x$\leq$0.2 have pure orthorhombic perovskite structure at room temperature. The dense microstructure was developed with grain growth as an increase of amount of Sn. Moreover, the addition of Sn was found to have a significant influence on piezoelectric properties. In particular, the $MnO_2$-doped NKN-BTS-0.1 ceramics showed improved piezoelectric properties of piezoelectric constant ($d_{33}$=145pC/N), relatively large electromechanical coupling factor ($k_p$=43%), dielectic constant (${\varepsilon}^T_{33}/{\varepsilon}_0$=676) dielectric loss (tan$\delta$=1.3%).

• 한국분말재료학회지
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• 제20권3호
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• pp.203-209
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• 2013

In this study, STS 316L powders with 3 wt.% Cu and 1 wt.% Sn known as corrosion-resistance reinforcement elements, are prepared to make different kinds of specimens, in which, 3 wt.% Cu and 1 wt.% Sn are added in different forms by mixing, alloying and fully alloying. After sintering in the same condition, the corrosion resistance, wear resistance and their mechanical properties of specimens are tested respectively. According to the comparison, STS 316L specimen sintered at $1270^{\circ}C$ showed the most excellent mechanical property: HRB 78 (hardness), 1130.7 MPa (RCS), 26.6% (Fraction Wear), It was similar with the specimen made of STS316L and fully alloyed Cu and Sn powders, meanwhile, the latter one appears the best corrosion resistance, 75hrs-salt immersion test results. In addition, the specimens with Cu and Sn powders additive showed relatively worse wear resistance in compared with STS316L specimen.

• 한국콘텐츠학회논문지
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• 제15권2호
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• pp.466-475
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• 2015

본 연구는 SNS를 통해 지각된 사회적 지지가 교사들의 성인애착과 직무만족도에 미치는 영향을 살펴보고자 하였다. 이를 위해 교사들을 대상으로 설문조사를 실시하였으며, 총 103부의 응답이 최종분석에 사용되었다. 연구결과, SNS를 통해 지각된 사회적 지지가 성인애착에서는 정서적지지, 정보적지지, 도구적지지가 애착불안에 영향을 미치는 것으로 나타났으며, 애착회피에서는 정서적 지지가 통계적으로 유의한 영향을 미치는 것으로 나타났다. 또한 SNS를 통해 지각된 사회적 지지가 직무만족도에 미치는 영향에서는 정서적 지지와 정보적지지가 직무만족도에 유의한 영향을 미치는 것으로 나타났다. 결론 및 논의에서는 이러한 연구결과를 토대로 본 연구의 시사점 및 제한점을 제시하였다.

• ETRI Journal
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• 제38권6호
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• pp.1163-1171
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• 2016

Integration technologies involving flexible substrates are receiving significant attention owing the appearance of new products regarding wearable and Internet of Things technologies. There has been a continuous demand from the industry for a reliable bonding method applicable to a low-temperature process and flexible substrates. Up to now, however, an anisotropic conductive film (ACF) has been predominantly used in applications involving flexible substrates; we therefore suggest low-temperature lead-free soldering and bonding processes as a possible alternative for flex-on-flex applications. Test vehicles were designed on polyimide flexible substrates (FPCBs) to measure the contact resistances. Solder bumping was carried out using a solder-on-pad process with Solder Bump Maker based on Sn58Bi for low-temperature applications. In addition, thermocompression bonding of FPCBs was successfully demonstrated within the temperature of $150^{\circ}C$ using a newly developed fluxing underfill material with fluxing and curing capabilities at low temperature. The same FPCBs were bonded using commercially available ACFs in order to compare the joint properties with those of a joint formed using solder and an underfill. Both of the interconnections formed with Sn58Bi and ACF were examined through a contact resistance measurement, an $85^{\circ}C$ and 85% reliability test, and an SEM cross-sectional analysis.

• 디지털콘텐츠학회 논문지
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• 제15권5호
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• pp.621-630
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• 2014

본 연구는 G. 레이코프와 M. 존슨이 제시한 '개념적 은유'를 적용해 소셜 네트워크 서비스의 은유적 특성을 분석하는 것을 목적으로 한다. 소셜 네트워크 서비스는 일방향적 소통만 가능했던 기존 매체와는 달리, 사용자가 참여적으로 자신의 일상을 표현하고 타인의 서사를 해석하는 과정을 통해서 그 텍스트를 확장한다. 기존 매체에서 수동적이던 독자가, SNS에서 적극적인 발화자로 전환될 수 있었던 가장 큰 이유는 SNS에 내재된 은유적 속성 때문이다. 이에 본 연구에서는 SNS 사용자 텍스트의 생성 및 해석 과정을 '근원영역'과 '목표영역'을 중심으로 고찰했다. 이후 은유적 속성을 통해 나타난 사용자 텍스트의 생성구조를 폴 리쾨르의 삼중 미메시스를 통해 증명했다. SNS를 환유로 전제했던 기존의 연구 관점과 달리, 본 연구는 SNS의 은유적 특성 및 의미를 제시했다는 점에서 그 의의가 있다.

• 한국전기전자재료학회논문지
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• 제17권6호
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• pp.575-579
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• 2004

Package reliability test was conducted to investigate the effect of solder paste composition at BGA Package. It was found that the shape and size of the phase form are affected by the processing parameters. The material have used to fill in the via was Sn/36Pb/2Ag and Sn/0.75Cu type solder paste. Sn/36Pb/2Ag and Sn/0.75Cu paste were fabricated on Tape-BGA substrates by screen printing process, and via ball mount data were characterized with variations of dwell time of 85 seconds at reflow peak temperature at 22$0^{\circ}C$ or 24$0^{\circ}C$. The test condition was MRT 30 $^{\circ}C$/60 %RH/96 HR. Failures formed of a ball-off in solder paste process were observed by using a Optical Microscope and SEM(Scanning Electron Microscope). It was concluded that intermetallic layer growth played important roles in increasing solder fatigue strength for addition of Ag composition. The degradation of shear strength of solder composition is discussed.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.360-360
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• 2012

Zn-Sn-O (Zinc-Tin-Oxide; ZTO) thin films have been gaining extensive academic and industrial attentions owing to a semiconducting channel materials applicable to large-sized flat-panel displays. Due to the constituent oxides i.e., ZnO and SnO2, the resultant Zn-Sn-O thin films possess artificially controllable bandgaps and transmittances especially effective in the visible regime. The current approach employed RF sputtering in depositing the Zn-Sn-O thin films onto glass substrates at ambient conditions. This work places its main emphases on the electrical/optical features which are closely related to the combinations of processing variables. The electrical characterizations are performed using dc-based current-voltage characteristics and ac-based impedance spectroscopy. The optical constants, i.e., refractive index and extinction coefficient, are calculated through spectroscopic ellipsometry along with the estimation of bandgaps. The charge transport of the deposited ZTO thin films is based on electrons characteristic of n-type conduction. In addition to the basic electrical/optical information, the delicate manipulation of n-type conduction is indispensible in diversifying the industrial applications of the ZTO thin films as active devices in information and energy products. Ultimately, the electrical properties are correlated to the processing variables along with the underlying mechanism which largely determines the electrical and optical properties.