• Advances in materials Research
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• 제1권1호
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• pp.83-92
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• 2012

The effect of under-bump-metallization (UBM) on electromigration was investigated at temperatures ranging from $135^{\circ}C$ to $165^{\circ}C$. The UBM structures were examined: 5-${\mu}m$-Cu/3-${\mu}m$-Ni and $5{\mu}m$ Cu. Experimental results show that the solder joint with the Cu/Ni UBM has a longer electromigration lifetime than the solder joint with the Cu UBM. Three important parameters were analyzed to explain the difference in failure time, including maximum current density, hot-spot temperature, and electromigration activation energy. The simulation and experimental results illustrate that the addition 3-${\mu}m$-Ni layer is able to reduce the maximum current density and hot-spot temperature in solder, resulting in a longer electromigration lifetime. In addition, the Ni layer changes the electromigration failure mode. With the $5{\mu}m$ Cu UBM, dissolution of Cu layer and formation of $Cu_6Sn_5$ intermetallic compounds are responsible for the electromigration failure in the joint. Yet, the failure mode changes to void formation in the interface of $Ni_3Sn_4$ and the solder for the joint with the Cu/Ni UBM. The measured activation energy is 0.85 eV and 1.06 eV for the joint with the Cu/Ni and the Cu UBM, respectively.

• Korean Journal of Materials Research
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• 제13권8호
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• pp.531-536
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• 2003

The electromagnetic properties and microstructures of the ferrites based on ($Ni_{0.2}$ $Cu_{0.2}$ $Zn_{0.6}$)$_{1.085}$($Fe_2$$O_3$)$_{0.915}$ were investigated by changing the amount of additive SnO$_2$and CaO and the sintering temperatures. Addition of $SnO_2$caused pores in the specimen. There was no variation of grain size by changing the amount of additives. Total loss was reduced when ($Ni_{0.2} $Cu_{0.2}$ $Zn_{ 0.6}$)$_{1.085}$ ($Fe_2$$O_3$)$_{0.915}$ composition was sintered at $1150^{\circ}C$ rather than $1300^{\circ}C$. Addition of CaO was useful to reduce the total loss because it increased the sintering density. The lowest total loss was obtained when 0.06 wt% $SnO_2$and 0.4 wt% CaO were added at the same time.

• Korean Journal of Materials Research
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• 제9권2호
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• pp.188-194
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• 1999

To investigate the effect of niobium and tin on the mechanical properties of zirconium alloys, the tensile test and the microstructural analysis were performed on the Zr-based binary(Zr-xNb, Zr-xSn) and ternary(Zr-0.8Sn-xNb, Zr-0.4Nb-xSn) alloys. As the content of Nb or Sn element increased, the strengths of the Zr-based alloys tended to gradually increase. The increase of mechanical strength was remarkable strength was remarkable in the range more than the solubility of Nb and Sn. The strengthening effects were discussed on the basis of the solid solution hardening, the precipitate hardening, the grain size effect, and the texture effect. The mechanical strength is mainly controlled by the solid solution hardening and additionally by the precipitate hardening in the content more than solubility limit of Nb and Sn. The grain refinement also has a slight effect on the strength of the zirconium alloys with the addition of Nb and Sn. However, the texture effect can be excluded due to the same Kearns number regardless of the content of alloying elements.

• Journal of the Korean Electrochemical Society
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• 제14권1호
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• pp.16-21
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• 2011

$Li_4Sn_xTi_{5-x}O_{12}$ was manufactured by high energy ball milling (HEBM) and used as an anode material for lithium ion battery. Various amount of $SnO_2$was added to $Li_4Ti_5O_{12}$ and heated at different temperatures. The purpose of this research was to see the effect of $SnO_2$ addition into $Li_4Ti_5O_{12}$. Manufactured samples were analyzed by TGA, XRD, SEM, PSA. Battery cycler was used to test the charge/discharge properties of active materials. Heat treatment temperature of $800^{\circ}C$ was needed to make a stable structure of $Li_4Sn_xTi_{5-x}O_{12}$ and the particle size distribution was $0.2{\sim}0.6\;{\mu}m$. Charge/discharge process was repeated for 50 cycles at room temperature. The initial capacity was 168mAh/g and the voltage plateau was observed at 1.55V(Li/$Li^+$).

• The Journal of the Korea Contents Association
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• 제19권4호
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• pp.138-149
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• 2019

The purpose of this study is to empirically address the influences of motives for using SNS on relational bridging and relational bonding in SNS and motives for continuous use SNS by applying the concepts of bonding and bridging, defined in the social capital theory, and major motives for using SNS are classified into three categories-social, information, and recreation categories - based on the previous studies and the usage and gratification theories. Through this study, it was revealed that motives of all these three categories-social, information, and recreation categories-have significant influences over relational bridging and relational bonding in SNS while relational bridging and relational bonding in SNS have significant influences over consistent motives for using SNS so the hypothesis of this study is accepted. It was also proven that motives of all these three categories - social, information, and recreation categories-for using SNS are important factors for creating new communities or expand relationships with other SNS users sharing similar interests. In addition, it was found that SNS users constantly use SNS to build relationships that could create a strong bond between individuals and receive emotional supports when necessary and to expand its own network by creating new relationships with other SNS users.

• Journal of the Korean Ceramic Society
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• 제50권1호
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• pp.87-91
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• 2013

The doping effect of Sn on the microstructure evolution and dielectric properties was studied in $CaCu_3Ti_{4-x}Sn_xO_{12}$ polycrystals. Samples were produced by a conventional solid-state reaction method. Sintering was carried out at $1115^{\circ}C$ for 2-16 h in air. The dielectric constant and loss were examined at room temperature over a frequency range between $10^2$ and $10^6$ Hz. The microstructure was found to evolve into three stages. Addition of $SnO_2$ led to an increase in density and advanced formation of abnormal grains. The formation of coarse grains with a reduced thickness of the boundary brought about an enhanced dielectric constant and a lower dielectric loss below ~1 kHz. EDS data showed the Cu-rich phase along the grain boundary, which should contribute to the improved dielectric constant according to the internal barrier layer capacitor model. After all, $SnO_2$ was an effective dopant to elevate the dielectric characteristics of $CaCu_3Ti_{4-x}Sn_xO_{12}$ polycrystals as a promoter for abnormal grain growth.

• Journal of the Korean Magnetics Society
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• 제13권3호
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• pp.121-126
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• 2003

The electromagnetic properties and microstructures of the basic composition of (N $i_{0.2}$C $u_{0.2}$Z $n_{0.6}$)$_{1.085}$(F $e_2$ $O_3$)$_{0.915}$ were invested by changing of the additive Sn $O_2$, CaO amounts and ferrite processes. There is no variation of grain size by changing additive amount. It can reduce the total loss when (N $i_{0.2}$C $u_{0.2}$Z $n_{0.6}$)$_{1.085}$(F $e_2$ $O_3$)$_{0.915}$ composition sintered at 1150 $^{\circ}C$ better than 130$0^{\circ}C$. Additive CaO confirmed of useful addition for the reduce total loss, because it increasing sintering density. Decreasing total loss were observed by adding both Sn $O_2$ 0.06 wt％ and CaO 0.4 wt％.

• Korean Journal of Materials Research
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• 제15권8호
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• pp.528-535
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• 2005

It is inclined to increase that use of hazardous substances such as lead(Pb), mercury (Hg), cadmium(Cd) etc. are prohibited in the electronics according to environmental friendly policies of an advanced nation for protecting environment of earth. As this reasons, many researches for ensuring the reliability were proceeding in Pb free soldering process. n the flux remains on the PCB(printed circuit board) in the soldering process or the electronics exposed to corrosive environment, it becomes the reasons of breakdown or malfunction of the electronics caused by corrosion. Therefore in this studies we researched the polarization and Tafel properties of Sn40Pb and SnCu system solders based on the electrochemical theory. The experimental polarization curves were measured in distilled ionized water and 1 mole $3.5 wt\%$ NaCl electrolyte of $40^{\circ}C$, pH 7.5. Ag/AgCl and graphite were utilized by reference and counter electrodes, respectively. To observe the electrochemical reaction, polarization test was conducted from -250mV to +250mV. From the polarization curves composed of anodic and cathodic curves, we obtained Tafel slop, reversible electrode potential(Ecorr) and exchange current density((cow). In these results, we compared the corrosion rate of SnPb and SnCu solders.

• Journal of the Korean Ceramic Society
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• 제54권3호
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• pp.243-248
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• 2017

Pd-doped $SnO_2$ thick film with a pure tetragonal phase was prepared on patterned Pt electrodes by an ink dropping method. Nanostructured $SnO_2$ powder with a diameter of 10 nm was obtained by a modified hydrazine method. Then the ink solution was fabricated by mixing water, glycerol, bicine and the Pd-doped $SnO_2$ powder. When the Pd doping concentration was increased, the grain size of the Pd-doped $SnO_2$ thick film became smaller. However, an agglomerated and extruded surface morphology was observed for the films with Pd addition over 4 wt%. The orthorhombic phase disappeared even at a low Pd doping concentration and a PdO peak was obtained for a high Pd doping concentration. The crack-free Pd-doped $SnO_2$ thick films were able to successfully fill the $30{\mu}m$ gap of the patterned Pt electrodes by the optimized ink dropping method. The prepared 3 wt% Pd-doped $SnO_2$ thick films showed monoxide gas responses ($R_{air}/R_{CO}$) of 4.0 and 35.6 for 100 and 5000 ppm, respectively.

• Journal of Technologic Dentistry
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• 제36권3호
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• pp.141-147
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• 2014

Purpose: Dental casting #Gr I (Co-25Cr-5Mo-3Sn-1Mn-1Si), #Gr II (Co-25Cr-5Mo-5Cu-1Mn -1Si) and #Gr III (Co-25Cr-5Mo-3Sn-5Cu-1Mn-1Si) master alloys of granule type were manufactured the same as manufacturing processes for dental casting Ni-Cr and Co-Cr-Mo based alloys of ingot type. These alloys were analyzed melting processes with heating time of high frequency induction centrifugal casting machine using infrared thermal image analyzer. Methods: These alloys were manufactured such as; alloy design, the first master alloy manufatured using vacuum arc casting machine, melting metal setting in crucible, melting in VIM, pouring in the mold of bar type, cutting the gate and runner bar and polishing. These alloys were put about 30g/charge in the ceramic crucible of high frequency induction centrifugal casting machine and heat, Infrared thermal image analyzer indicated alloys in the crucible were set and operated. Results: The melting temperatures of these alloys measuring infrared thermal image analyzer were decreased in comparison with remanium$^{(R)}$ GM 800+, vera PDI$^{TM}$, Biosil$^{(R)}$ f, WISIL$^{(R)}$ M type V, Ticonium 2000 alloys of ingot type and vera PDS$^{TM}$(Aabadent, USA), Regalloy alloys of shot type. Conclusion: Co-Cr-Mo based alloy in addition to Sn(#Gr I alloy) were decreased the melting temperature with heating time of high frequency induction centrifugal casting machine using infrared thermal image analyzer.