• 마이크로전자및패키징학회지
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• 제22권1호
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• pp.1-5
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• 2015

Recently, data throughput of smart electric devices increases dramatically. There is a great interest in a new technology which exceeds the limit of electrical transmission method. Optical PCB can supplement the weakness of electrical signal processing, the research for optical PCB is very active. In this paper, we propose the thermal imprint lithography process to fabrication optical layer of optical PCB and experiment to optimize the process conditions. We confirm process time, pressure, process temperature, demolding temperature and fabricate optical interconnection structure which has $45^{\circ}$ tilted mirror surface for confirm the interconnection efficiency.

• 마이크로전자및패키징학회지
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• 제28권1호
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• pp.21-29
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• 2021

Recently, semiconductor chips and electronic components are increasingly being used in IT devices such as wearable watches, autonomous vehicles, and smart phones. As a result, there is a growing concern about device malfunctions that may occur due to electromagnetic interference being entangled with each other. In particular, electromagnetic wave emissions from wearable or flexible smart devices have detrimental effects on human health. Therefore, flexible and transparent electromagnetic interference (EMI) shielding materials and films with high optical transmittance and outstanding shielding effectiveness have been gaining more attention. The EMI shielding films for flexible and transparent electronic devices must exhibit high shielding effectiveness, high optical transmittance, high flexibility, ultrathin and excellent durability. Meanwhile, in order to prepare this EMI shielding films, many materials have been developed, and results regarding excellent EMI shielding performance of a new materials such as carbon nano tube (CNT), graphene, Ag nano wire and MXene have recently been reported. Thus, in this paper, we review the latest research results to EMI shielding films for flexible and transparent device using the new materials.

• 한국멀티미디어학회논문지
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• 제25권8호
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• pp.1085-1096
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• 2022

The manufacturing industry is continuously pursuing advanced technology and smartization as it converges with innovative technology. Improvement of manufacturing productivity is achieved by monitoring, analyzing, and controlling the facilities and processes of the manufacturing site in real time through a network. In this paper, we proposed a new OPC-UA based digital twin model for smart factory facilities. A testbed system for USB flash drive packaging facility was implemented based on the proposed digital twin model and OPC-UA data communication scheme. Through OPC-UA based digital twin model, equipment and process status information is transmitted and received from PLC to monitoring and control 3D digital models and physical models in real time. The usefulness of the developed digital twin testbed system was evaluated through usability test.

• 마이크로전자및패키징학회지
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• 제24권1호
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• pp.51-56
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• 2017

최근 계측기의 소형화, 전자화에 따라 차압식 유량계의 경우 기존에 기계가공을 통해 개발하던 센서부를 전자식 MEMS 차압센서로 대체하려는 많은 노력이 있으나, MEMS 차압센서의 경우 고압이 인가시 실리콘 다이아프램의 파괴 및 센서의 접합부의 파괴가 발생하는 문제점이 있다. 따라서 본 논문에서는 proof pressure 이상의 압력에서 센서의 다이아프램이 파괴되지 않는 구조를 제안하였으며, 그에 따른 차압식 압력센서를 설계 및 제작하였다. 센서 동작압력(0-3 bar)의 3배 이상의 압력에서 센서의 동작특성을 평가하였다. 개발된 센서는 $3.0{\times}3.0mm$이며, 0~3 bar 사이의 압력에서 LCR meter (HP 4284a)로 측정한 결과 3.67 pF at 0bar, 5.13 pF at 3 bar를 나타내었으며, 센서의 동작압력(0-3 bar)에서 0.37%의 hysteresis를 나타내는 압력센서를 개발하였다.

• Smart Structures and Systems
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• 제6권3호
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• pp.309-333
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• 2010

Civil infrastructure, in both its construction and maintenance, represents the largest societal investment in this country, outside of the health care industry. Despite being the lifeline of US commerce, civil infrastructure has scarcely benefited from the latest sensor technological advances. Our future should focus on harnessing these technologies to enhance the robustness, longevity and economic viability of this vast, societal investment, in light of inherent uncertainties and their exposure to service and even extreme loadings. One of the principal means of insuring the robustness and longevity of infrastructure is to strategically deploy smart sensors in them. Therefore, the objective is to develop novel, durable, smart sensors that are especially applicable to major infrastructure and the facilities to validate their reliability and long-term functionality. In some cases, this implies the development of new sensing elements themselves, while in other cases involves innovative packaging and use of existing sensor technologies. In either case, a parallel focus will be the integration and networking of these smart sensing elements for reliable data acquisition, transmission, and fusion, within a decision-making framework targeting efficient management and maintenance of infrastructure systems. In this paper, prudent and viable sensor and health monitoring technologies have been developed and used in several large structural systems. Discussion will also include several practical bridge health monitoring applications including their design, construction, and operation of the systems.

• 한국융합학회논문지
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• 제13권1호
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• pp.149-160
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• 2022

본 연구에서는 스마트팜에서 생산된 새싹인삼의 저장성을 향상시키기 위해 전처리과정과 포장 용기에 따른 새싹인삼의 물리적 품질 및 미생물 변화를 10일 간 저장하면서 평가하였다. 전처리 방법(ascorbic acid, citric acid, peroxyacetic acid) 및 포장용기(expanded polystyrene (EP), polypropylene (PP), polyethylene (PE), polypropylene + polyethylene + cast polypropylene(PP+PE+CPP))에 따른 품질 변화를 물성(texture)검사, 일반세균수검사, 수분함량 및 색도 측정으로 평가하였다. 전처리 종류에 따라 비교한 결과, citric acid처리군에서 가장 낮은 텍스쳐 변화 및 세균 증식 억제에 효과를 확인하였다. 전처리 중 가장 효과가 높은 citric acid 처리군을 용기별로 저장 후 품질을 평가한 결과, PP용기에 10일 저장한 경우, 유의적인 텍스쳐 감소 및 색변화가 나타나지 않았고, 저장기간 증가에 따라 일반세균수가 가장 낮게 증가하였다. 따라서 본 연구는 citric acid 전처리군 및 PP용기에서 저장했을 때 새싹인삼의 품질 손상이 가장 적게 나타나 새싹인삼의 저장성 개선에 도움을 줄 수 있을 것으로 판단된다.

• International Journal of Internet, Broadcasting and Communication
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• 제12권4호
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• pp.55-60
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• 2020

This study aims to apply Arduino and 3D printing technology considered as a key subject in the age of 4th industrial revolution which is a step 1 for customizing and applying the process of production by chemical molding companies producing environment-friendly biodegradable packaging materials to the 3D printing teaching in universities. Step 3 is applied to IoT for Arduino application, and 3D printing technology is also used on the basis of teaching creative integrated human resource. Integration of Arduino with 3D printers is based on the assumption that middle- and high-school students can learn it step by step to higher levels and university students majoring or not majoring in computing science can also have computing skills for solving 3D printing-based problems. For IoT application in this study, the 3D printing technology is applied to the external shape of products for producing an Arduino-based lighting fixture. The applied 3D printing technology is further extended to teaching modeling of producing packaging materials by chemical product molding companies in the age of 4th industrial revolution.

• 센서학회지
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• 제27권5호
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• pp.300-305
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• 2018

The uncooled microbolometer thermal sensor for low cost and mass volume was designed to target the new infrared market that includes smart device, automotive, energy management, and so on. The microbolometer sensor features 80x60 pixels low-resolution format and enables the use of wafer-level vacuum packaging (WLVP) technology. Read-out IC (ROIC) implements infrared signal detection and offset correction for fixed pattern noise (FPN) using an internal digital to analog convertor (DAC) value control function. A reliable WLVP thermal sensor was obtained with the design of lid wafer, the formation of Au80%wtSn20% eutectic solder, outgassing control and wafer to wafer bonding condition. The measurement of thermal conductance enables us to inspect the internal atmosphere condition of WLVP microbolometer sensor. The difference between the measurement value and design one is $3.6{\times}10-9$ [W/K] which indicates that thermal loss is mainly on account of floating legs. The mean time to failure (MTTF) of a WLVP thermal sensor is estimated to be about 10.2 years with a confidence level of 95 %. Reliability tests such as high temperature/low temperature, bump, vibration, etc. were also conducted. Devices were found to work properly after accelerated stress tests. A thermal camera with visible camera was developed. The thermal camera is available for non-contact temperature measurement providing an image that merged the thermal image and the visible image.

• 접착 및 계면
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• 제7권4호
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• pp.53-59
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• 2006

The paper highlights technical advances and introduces recent innovations such as smart curing laminating adhesives for flexible packaging with low migration rates of aromatic isocyanates and amines. Latent reactive one-part systems on the basis of surface deactivated solid isocyanates open up new dimensions for heat setting adhesives and waterborne PU dispersions. The new generation of Purmelt Micro Emission adhesives contains less than 0.1% of MDI monomer, thereby drastically reducing the emission of hazardous isocyanate vapors during processing and setting a significantly improved technical standard in occupational safety. Once again, polyurethane adhesives have demonstrated their unique ability to adapt to new process, product, safety and environmental requirements.

• International journal of advanced smart convergence
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• 제11권1호
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• pp.70-75
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• 2022

The purpose of this study was to develop hand creams among the types of cosmetics based on domestic pumpkins grown in Yangju. Pumpkins are mostly used for cooking, but because they contain a large amount of vitamin A, they can also be used as raw materials for cosmetics to prevent skin aging. The final design was researched and developed through a graphic expression of pumpkin characteristics, a design process, and a survey on preference for differentiated packaging design. The survey targets women in their 20s and 30s who directly purchase cosmetics, and an analysis of consumers' preference for brand product decisions showed that simple and modern designs suitable for cosmetics images topped the list. In addition, it showed a positive image of cosmetics development using local agricultural products and high brand value. We present the possibility that domestic pumpkin raw materials can be applied to cosmetics and aim to develop excellent cosmetics brands through consumer preference surveys.