• Journal of the Korean institute of surface engineering
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• v.47 no.1
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• pp.13-19
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• 2014

The various surface treated conditions of Fe-3.0%Ni-0.7%Cr-1.4%Mn-X steel such as as-received, ion nitriding, DLC coated, DLC coated after nitriding for 3 hrs and 6 hrs were investigated to evaluate the beneficial effect for plastic mold steel. Micro Vickers hardness tester was used to estimate nitriding depth from the hardness profile and to measure hardness on the surface. Elastic modulus and residual stress were measured by a nanoindentator. Scratch test and SP (small ball punch test) were utilized to assess the adhesive strength of DLC coating. The depth of nitriding layer was measured as $50{\mu}m$ for the condition of 3 hrs nitriding and $90{\mu}m$ for that of 6 hrs nitriding. Hardness, elastic modulus, residual stress of DLC coating were 20.37 GPa, 162.78 GPa and -1456 MPa respectively. Residual stress on the surface of DLC coating after nitriding could increase to -3914 MPa by introducing nitriding before DLC coating. During the 'Ball-On-Disc' test ${\gamma}^{\prime}$ particles pulled out from the surface of nitrized layer tend to enhance abrasive wear mode since the fraction of ${\gamma}^{\prime}$ (Fe4N) in ion-nitrized layer is known to increases with nitriding time. Thus the specific wear rate of the nitriding layer increased. Comparing with nitriding the specific wear rate in work piece disc as well as ball decreased prominently in DLC coating due to the remarkable reduction in friction coefficient.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2008.11a
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• pp.424-426
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• 2008

A parametric study was carried out to find the fuel lubrication performance of high speed small rolling element bearings. Both MIL-PRF-7808 turbine oil and JP-8 aircraft fuel were used as the lubricant to compare the operational characteristics. 17 mm inner diameter deep groove ball bearing and 20 mm cylindrical roller bearing were used. A high speed bearing test rig was developed and the testing was done with varying applied load, cooling air temperature, lubricant flow rate, and speed. Fuel caused more cage wear than oil for ball bearing with increasing axial load and rotational speed. The bearing temperature using fuel was lower than that using oil, and this seems to be the result of the high cooling capacity of fuel. According to various tests, the fuel lubrication is applicable for the lubrication on the main shaft bearings of expendable small gas turbines.

• Composites Research
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• v.13 no.4
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• pp.75-82
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• 2000

A small diameter steel-ball impact experiment was performed to study the impact resistance of the surface of glass plates bonded with glass fabric/epoxy lamina. Five kinds of materials were used in this study: soda-lime glass plates, glass/epoxy lamina(one layer)-bonded and unbonded glass plates, glass/epoxy lamina(three layers)-bonded and unbonded glass plates. The range of impact velocity was 40 120m/s. The maximum stress and absorbed fracture energy were measured on the back surface of glass plates. With increasing impact velocity, various types of surface cracks such as ring, cone, radial and lateral cracks took place in the interior near the impacted site of glass plates. The cracks drastically decreased with glass/epoxy lamina coating. The surface fracture behavior could be evaluated using the maximum stress and the absorbed fracture energy.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.67-73
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• 2001

To investigate the relationships of solder joint characteristics with solder composition and A:V ratio (solder volume per pad area), Sn-37Pb and Sn-4.0Ag-0.5Cu solder balls with 330, 400, 450 and $457{\mu}{\textrm}{m}$ size were reflowed on same substrate. Sn-37Pb and Sn-4.0Ag-0.5Cu was reflowed at $220^{\circ}C$ and $240^{\circ}C$ respectively by IR-type soldering machine. As a result of reflowed solder- ball diameter(D) and height(H) measurement, D/H was decreased with solder ball size increment in range of 330~450 ${\mu}{\textrm}{m}$. But, D/H was increased in the solder joint for 457 ${\mu}{\textrm}{m}$ size, it was caused possibly by decrement of solder ball height increment compared with solder volume increment. As a result of shear and pull test, joint strength with A:V ratio was high. Joint strength of Sn-4.0Ag-0.5Cu was higher than Sn-37Pb. However, Sn-37Pb had more stable solder joint of small standard deviation. A thick and clean scallop type Ni-Cu-Sn intermetallic compound layer was formed in high A:V ratio and Sn-4.0Ag-0.5Cu solder joint interface.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.778-781
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• 2002

Durability of rubber dust cover in the ball joint for automotive suspension parts were analyzed by FEM and compared with experimental data. Upper open area of ball joint is sealed by dust cover for preventing outflow of the lubricating oil and intrusion of send, dust, water, etc. This rubber cover undergoes repeated loadings such as tension and compression while the car is running. Analysis about rubber material needs to consider every kinds of nonlinearities arise in finite element analysis, which are geometric nonlinearity due to large displacement and small strain, materially nonlinearity and nonlinear boundary condition such as contact. So in the study, the deformation behavior of dust cover was analysed by using the commercial finite element program MARC. This program could solve these kinds of nonlinear analysis accurately. Finite element model of dust cover is considered as 3-dimensional half model based on 2-dimensional axisymmetric model. Material property of rubber was modeled by Ogden model and input data for calculation takes form uniaxial tension test of rubber specimen, The final object of the study is obtaining the design specification of dust covers and the result of analysis should be a useful data to design of rubber

• Tribology and Lubricants
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• v.27 no.3
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• pp.140-146
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• 2011

A miniature pendular type impact testing machine was designed and developed, adopting a magnetic powder brake in order to investigate tensile and shear behavior of a small solder ball at high speed. In this testing system, the potential energy of the pendulum is transferred into the impact energy during its drop. Then, the impact energy is transmitted through the striker which is connected to the push rods to push the specimen for tensile loading. The tensile behavior of lead-free solder ball in diameter of 760 ${\mu}m$ was successfully investigated in a speed range of 0.15 m/s~1.25 m/s using this designed device. The maximum tensile strength of the solder joint decreases with the loading speed in the testing condition. The maximum tensile strength of the joint was 56 MPa in the low speed region.

• Journal of Powder Materials
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• v.10 no.6
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• pp.415-421
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• 2003

The study for producing the flake powders by milling of aluminum foil and gas atomized powders was carried out. The effects of lifter bars on the ball motions and milling of aluminum foils were also investigated. The aluminum foils were laminated each other, elongated, fragmented into small foils and finally formed into the flake powders during the dry ball-milling. The spherical atomized-powders were milled to coarse flake powders with high aspect ratio and then changed to fine flake powders with lower aspect ratio. Even though long times were required for making flake powders by milling of foils, the water covering areas of them were higher than those of powders milled using gas-atomized powders, suggesting aluminum foils were more plastically deformed by micro-forging. On the other hand, as the number of lifter bars increased, the necessary rotation speeds of milling jar for cascading mode and cataracting mode decreased drastically. It was possible to achieve same quality of milled flake powder by using the lifter bars under the lower milling speeds. The painting test showed that the appearance of painted surface was good and optimum content range of aluminum paste in car paint to maximize the degree of gloss was 3-5%.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.3
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• pp.238-243
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• 2002

The dielectric properties and synthesis of $LaAIO_3$ ceramics from mixtures of $La_2O_3$ and $AI(OH)_3$ via ground(planetary ball mill) and unground(wet ball mill) were investigated. The single phase $LaAIO_3$ of ground powder was formed at $1000^{\circ}C$, while that of unground powder was formed at $1300^{\circ}C$. Density and grains of ground sample showed 98% of theory density and a uniform size of 0.75\mu\textrm{m}$, respectively, However those of unground sample showed 93% and non-uniform sizes of 4-5 $\mu\textrm{m}$. Dielectric constant and temperature coefficient of capacitance ($\tau$c) of both ground and unground samples were 21~22 and +70~74 ppm$/^{\circ}C$, respectively. Dielectric loss of ground sample(0.0004) was 10 times as low as that of unground sample(0.003) due to a uniform and small gram size.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.2
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• pp.37-42
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• 2001

The BGA package has been the area array package of choice for several years. Recently, the transition has been to finer pitch configurations called Chip Scale Packages (CSP). Several of these package types are available at 0.5 mm pitch. requiring surface mount assemblers to evaluate and optimize various elements of the assembly process. This presentation describes the issues associated with making the transition from BGA to CSP assembly. Areas addressed will include the accuracy of pick and place equipment, printed wiring board lines and spaces, PWB vias, in-circuit test issues, solder paste printing, moisture related factors, rework and reliability. The transition to 0.5 mm pitch requires careful evaluation of the board design, solder paste selection, stencil design and component placement accuracy. At this pitch, ball and board pad diameters can be as small as 0.25 mm and 0.20 mm respectively. Drilled interstitial vias are no longer possible and higher ball count packages require micro-via board technology. The transition to CSP requires careful evaluation of these issues. Normal paste registration and BGA component tolerances can no longer achieve the required process levels and higher accuracy pick and place machines need to be implemented. This presentation will examine the optimization of these critical assembly operations, contrast the challenges at 0.5 mm and also look at the continuation of the process to incorporate smaller pitch flip chip devices.

• Journal of the Korean Ceramic Society
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• v.40 no.7
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• pp.696-701
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• 2003

The grinding efficiencies of silica powder in a small scale stirred ball mill were investigated by energy consumption estimate. Comparing with a non-treated silica powder and a heating treated silica powder, it was found that a silica powder cooled in room temperature after heating treatment at 600∼900$^{\circ}C$ consumed lower grinding energy than non-treated silica powder, and a silica powder quenched after heating treatment consumed lower grinding energies about 52∼62%, in case of dry grinding. Additionally, if heating treated silica powder grind in wet method, energy consumption will be decreased about 40% than in dry grinding, and the dependency of the particle size to the grinding efficiency, quenching significantly improved it.