• Journal of Advanced Marine Engineering and Technology
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• v.29 no.7
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• pp.779-784
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• 2005

This paper presents the theory of similarity transformations applied to the momentum and energy equations for laminar, forced, external boundary layer flow over a horizontal flat plate which leads to a set of non-linear, ordinary differential equations of phase change material slurry(PCM Slurry). The momentum and energy equation set numerically to obtain the non-dimensional velocity and temperature profiles in a laminar boundary layer are solved. The heat transfer characteristics of PCM slurry was numerically investigated with similar method. It is clarified that the similar solution method of Newtonian fluid can be used reasonably this type of PCM slurry which has low concentration. The data of local wall heat flux and convective heat transfer coefficient of PCM slurry are higher than those of water more than 150$\~$200$\%$, approximately.

• Journal of Advanced Marine Engineering and Technology
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• v.28 no.6
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• pp.962-971
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• 2004

This paper has dealt with thermo-physical properties of microencapsulated phase change material slurry as a latent heat storage material having a low melting point. The measured results of the thermo-physical properties of the test microencapsulated phase change material slurry, those are, density, specific heat, thermal conductivity and viscosity, were discussed for the temperature region of solid and liquid phases of the dispersion material (paraffin). The measurements of these properties of microencapsulated phase change material slurry have been carried out by using a specific-gravity meter, a water calorimeter, a differential scanning calorimeter(DSC), a transient hot wire method and rotating type viscometer, respectively. It was clarified that the additional properties law could be applied to the estimation of the density and specific heat of microencapsulated phase change material slurry and also the Euckens equation could be applied to the estimation of the thermal conductivity of this slurry.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.372-373
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• 2006

Chemical kinetics affects Cu CMP results (removal rate, Non uniformity etc.) Because Cu is removed by chemical action. Key factors in chemical kinetics are process temperature and concentration of slurry components. In this study, Hydrogen peroxide and citric acid were selected as a oxidant and a complexing agent and Slurry were made by mixing this components. In order to study effects of Chemical Kinetics, X-ray photoelectron spectroscopy (XPS) were performed on Cu sample after etching test as concentration of citric acid and slurry temperature. Finally Cu CMP was performed as same conditions.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.11
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• pp.46-52
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• 2004

CMP (Chemical-Mechanical Polishing) is a process in which both chemical and mechanical mechanisms act simultaneously to produce the planarized wafer. CMP process is an extensive usage and continuing high growth rates in the semiconductor industry. The understanding of the process, however, is much slower. The nature of material removal from the wafer is still undefined and ambiguous. Material removal rate according to the slurry flow rate is also undefined and ambiguous. Thus, in this study, the basic mechanism of material removal rate as slurry flow rate is defined in terms of energy supply and energy loss.

• Proceedings of the SAREK Conference
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• 2006.06a
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• pp.144-149
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• 2006

In this study ice making characteristics are experimentally investigated for the ice slurry generating system which is pneumatically operated. The experimentations are conducted under the various test conditions such as chilled water inlet temperature, aqueous solution concentration, flow rate of cooling water, scraper pitch and frequency of cylinder stroke. For the above experimental conditions, ice making characteristics of the slurry ice generating system are evaluated in terms of the overall heat transfer coefficient, heat transfer rate and the amount of slurry ice generation. And the experimental results show that the heat transfer rate of the system increases as the flow rate of cooling water solution increases and the concentration of ethylene glycol and inlet temperature of chilled water decreases.

• Geomechanics and Engineering
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• v.35 no.6
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• pp.593-601
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• 2023

In this paper, an analytical solution of large-strain cylindrical cavity expansion in compaction grouting problem under temperature field is given. Considering the stress increment caused by temperature, the analytical solution of cavity expansion under traditional isothermal conditions is improved by substituting the temperature stress increment into the cavity expansion analysis. Subsequently, combined with the first law of thermodynamics, the energy theory is also introduced into the cylindrical cavity expansion analysis, and the energy dissipation solution of cylindrical cavity expansion is derived. Finally, the validity and reliability of solution are proved by comparing the results of expansion pressure with those in published literatures. The results show that the dimensionless expansion pressure increases with the increase of temperature, and the thermal response increases with the increase of dilation angle. The higher the exothermic temperature of grouting slurry, the greater the plastic deformation energy of the surrounding soil, that is, the greater the influence on the surrounding soil deformation and the surrounding environment. The proposed solution not only enrich the theoretical system of cavity expansion, but also can be used as a theoretical tool for energy geotechnical engineering problems, such as CPT, nuclear waste disposal, energy pile and chemical grouting, etc.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.22 no.6
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• pp.888-898
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• 1998

The present study investigated the effects of the experimental parameters on the cooling characteristics of the multichip module cooled by the indirect liquid cooling method using water and paraffin slurry. The experimental parameters are mass fraction of 2.5 ~ 7.5% for paraffin slurry, heat flux of 10 ~ 40 W/cm$^{2}$ for the simulated VLSI chips and Reynolds numbers of 5,300 ~ 15,900. The apparatus consisted of test section, paraffin slurry maker, pump, constant temperature baths, flowmeter, etc. The test section made of in-line, four-row array of 12 heat sources for simulating 4 * 3 multichip module which was flush mounted on the top wall of a horizontal rectangular channel with the aspect ratio of 0.2. The inlet temperature was 20 deg. C for all experiments. The size of paraffin slurry was constant as 10 ~ 40 .mu.m befor and after the experiment. The chip surface temperatures for paraffin slurry with the mass fraction of 7.5% showed lower by 16 deg. C than those for water when the heat flux is 40 W/cm$^{2}$. The local heat transfer coefficients for the paraffin slurry with the mass fraction of 7.5% were larger by 17 ~ 25% than those for water at the first and the fourth row. The local heat transfer coefficients reached to a row-number-independent, thermally fully developed value approximately after the third row. The local Nusselt numbers at the fourth row for paraffin slurry with the mass fraction of 7.5% were larger by 23 ~ 29% than those for water.

• Journal of Animal Environmental Science
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• v.19 no.1
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• pp.47-54
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• 2013

Two types of reactors were set to investigate the change of characteristics of pig slurry by aeration during fertilization period. One system was equipped with air diffuser to supply oxygen to pig slurry for liquid fertilization, but there was no air diffuser in the other system. Air supply to the experimental systems was regulated by air flow meter. The reactors were set up in the laboratory to protect the pig slurry from external condition such as temperature and humidity changes. Maintaining optimal pH range in the experimental reactors is an important factor for liquid fertilization of pig slurry. In this study, pH ranges of aerobic reactor and anoxic reactor was 7.04~7.19 and 7.34~7.81, respectively. The temperature of aerobic reactors was $2{\sim}3^{\circ}C$ higher then indoor temperature. The amount of sludge accumulated at the bottom layer of non-aerated reactors was 4~5 times more than that of aerated reactors.

• Journal of Animal Environmental Science
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• v.6 no.3
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• pp.161-168
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• 2000

The study exploited TAO system for the treatment of piggery slurry and aimed to draw characteristics and conditions of the reactor by differentiating the number of air input pump and foam cutter. The results are: 1. Under different operation condition, Run-3 with three air input pumps and four foam cutters showed the highest efficiency in the change of water level and temperature; 40-70cm and 45-55$^{\circ}C$, respectively. 2. Evaporation volume in Run-3 was the highest; 55.5l/$m^2$ . day in Run-1, 75.0/$m^2$ . day in Run-2, and 120.3/$m^2$ . day in Run-3. 3. Throughout the experimental period, temperature inside the reactor was maintained at around 5$0^{\circ}C$, regardless of seasonal temperature changes.

• Korean Journal of Materials Research
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• v.16 no.2
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• pp.75-79
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• 2006

The effect of ozone and/or ultrasound treatments on the efficiency of slurry removal in post sliced cleaning (PSC) of silicon ingot was studied. Efficiency of slurry removal was evaluated as functions of time, temperature and surfactant with DOE (Design of Experiment) method. Residual slurries were observed on the wafer surface in case of cleaning by ozone or ultrasound separately. However, a clean wafer surface was appeared when cleaned with ozone and ultrasound simultaneously. It has found that cleaning time was the main effect among temperature, time and surfactant. Elevated temperature, addition of surfactant and high ozone concentration helped to accelerate efficient removal of slurry. The improvement of removal efficiency seems to be related to the formation of more active OH radicals. The highly cleaned surface was achieved at 10 wt% ozone, 1 min and 10 vol% surfactant with ultrasound. Application of ozone and ultrasound might be a useful method for PSC process in wafer cleaning.