• Proceedings of the Korean Institute of Intelligent Systems Conference
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• 2001.05a
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• pp.199-202
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• 2001

We, Human beings, use both powers of reason and emotion simultaneously, which surely help us to obtain flexible adaptability against the dynamic environment. We assert that this principle can be applied into the general system. That is, it would be possible to improve the adaptability by covering a digital oriented information processing system with an analog oriented emotion layer. In this paper, we proposed a vertical slicing model with an emotion layer in it. And we showed that the emotion-based control allows us to improve the adaptability of a system at least under some conditions.

• Journal of Aerospace System Engineering
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• v.14 no.4
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• pp.25-31
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• 2020

The development of manufacturing technology for braided composites has led to farther extension of the applications in aerospace structures. Since the mechanical characteristics of braided composites are affected by various materials and manufacturing parameters, it is important to determine the parameters required to appropriately design the braided composite structures. In this study, we proposed a geometric model of RUC (repeating unit cell) for 2D braided composites, and predicted the mechanical properties according to the change of fiber volume fraction, fiber filament size, braiding angle, and gap between adjacent yarns by the yarn slicing technique and stress averaging method. Finally, we analyze the characteristics of mechanical properties according to each manufacturing parameter of the braided composite material.

• Proceedings of the IEEK Conference
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• 2001.06e
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• pp.227-230
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• 2001

We, Human beings, use both powers of reason and emotion simultaneously, which surely help us to obtain flexible adaptability against the dynamic environment. We assert that this principle can be applied into the general system. That is, it would be possible to improve the adaptability by covering a digital oriented information processing system with an analog oriented emotion layer. In this paper. we proposed a vertical slicing model with an emotion layer in it. And we showed that the emotion-based control allows us to improve the adaptability of a system at least under some conditions.

• Proceedings of the Korea Association of Information Systems Conference
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• 1998.10a
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• pp.157-164
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• 1998

본 논문은 원시 프로그램에 오류가 생겼을 때 신속한 오류검출, 소프트웨어의 유지 보수, 유연한 테스팅 등을 목적으로 하는 프로그램 슬라이싱과 원시 프로그램의 복잡한 베 어 흐름이나 데이터 흐름을 이해하고 프로그램이 테스팅 속도 향상과 오류위치를 파악하는 데 도움을 주는 구조적 순서도의 개념을 도압하여, C 언어데 대한 할당문(Assignment Statement)과 복합 제어 문(Compound Control Statement)으로 된 원시 프로그램의 입력 에 대해 프로시듀어(Procedure) 내에서의 구조적 순서도인 나씨-슈나아더만 차트 (Nassi-Shnei-derman Chart)를 자동 생성하고 실제 관심있는 변수에 대해 정적 슬라이싱 (Static Slicing)을 하는 도구를 개발함으로써 보다 빠르고 정확한 프로그램 구조의 이해에 도움을 주고자 한다.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.10 no.5
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• pp.350-355
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• 2000

The fabrication of sapphire wafer in C plane has been developed by horizontal Bridgeman method and GaN based semiconductor epitaxial growth has been carried out in metal organic chemical vapour deposition. The single crystalline ingot of sapphire has been utilized for 2 inch sapphire wafers and wafer slicing and lapping machines were designed. These several steps of lapping processes provided the mirror-like surface of sapphire wafer. The measurements of the surface flatness and the roughness were carried out by the atomic force microscope. The GaN thin film growth on the developed wafer was confirmed the wafer quality and applicability to blue light emitting devices.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.26 no.5
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• pp.171-174
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• 2016

The diamond wire sawing method to produce silicon wafers for the photovoltaic application is still a new and highly investigated wafering technology. This technology, featured as the higher productivity, lower wear of the wire, and easier recycling of the coolant, is expected to become the mainstream technique for slicing the silicon crystals. However, the saw marks on the wafer surface have to be investigated and improved. This paper discusses the removal of saw marks on diamond wire-sawn single crystalline silicon wafer. With a pretreatment step using tetramethyl ammonium hydroxide ($(CH_3)_4NOH$, TMAH) and conventional texturing process with KOH solution (1 % KOH, 8 % IPA, and DI water), the saw marks on the surface of the diamond wire-sawn silicon wafers can be effectively removed and they are invisible to naked eyes completely.

• Korean Journal of Computational Design and Engineering
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• v.22 no.2
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• pp.190-201
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• 2017

This paper proposes how to solve a problem of FDM 3D printer's irregular output when changing volume of extrusion, adjusting movement speed of the printer's head and a way to fill new inner part. Existing slicers adjust directly to change the rotation speed of the stepper. In this method, the change of the extrusion area is delayed due to the gap between the stepper and the nozzle, so that precise control is difficult. We control the extrusion area adjusting the moving speed of the print head and making constantly the rotation speed of the stepper. Thus, the output time can be shortened by generating an efficient path having a short travel distance. For evaluation, we applied our method to lithophanes with detailed variation. Comparing existing methods, our method reduced output time at least 30%.

• Korean Journal of Computational Design and Engineering
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• v.22 no.2
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• pp.215-221
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• 2017

This paper describes a method of precise estimation for printing time and material consumption which are directly related to the 3D printing cost. Printing process and head motion of 3D printers using digital printing head, which is analyzed by its digitized steps, is rapidly simulated without slicing to calculate estimated printing results. Using this method, printing time and material usage of 3D printer were estimated quickly and precisely and compared to the real printing result. Applying compensation using the printing parameters, transferred from the 3D printer to the printing estimation system, even more accurate estimation is achieved. This method is used in the 3D Sprint software.

• Journal of KIISE:Software and Applications
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• v.28 no.8
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• pp.551-559
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• 2001

정적 슬라이싱과 동적 슬라이싱의 차이는 동적 슬라이싱은 프로그램에 주어진 입력을 가정하는 반면에 정정 슬라이싱은 입력에 대한 가정을 하지 않는다는 점이다. 동적 슬라이싱은 실행-시간 정보를 이용할 수 있으므로 정적 슬라이싱보다 적은 슬라이스를 만들 수 있으나 특정 입력 상태에만 적용될 수 있다는 제한을 갖는다. 이 논문은 초기 상태들의 집합에 대해서 프로그래을 슬라이싱하는 요약 프로그램 슬라이싱이라는 새로운 기법을 제시한다. 이 방법은 프로그램으로부터 슬라이스를 구하는데 요약 해석을 이용한다. 요약 해석을 프로그램 실행 없이 프로그램의 실행-시간 동작에 대한 안전한 정보를 제공한다. 따라서 결과적으로 얻은 요약 슬라이스는 주어진 입력 상태들의 집합에 대해서 정적으로 계산되었다는 점에서 동적 슬라이스와는 다르다. 또한 요약 프로그램 슬라이싱은 배열과 같은 자료구조를 정적 슬라이싱보다 정확하게 다룰 수 있으며 슬라이스 크기도 줄일 수 있다.

• Journal of the Institute of Convergence Signal Processing
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• v.3 no.1
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• pp.87-92
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• 2002

Placement is an important step in the physical design of VLSI circuits. It is the problem of placing a set of circuit modules on a chip to optimize the circuit performance. The most popular algorithms for placement include the cluster growth, simulated annealing and integer linear programming. In this paper we propose a stochastic evolution algorithm searching solution space for the placement problem, and then compare it with simulated annealing by analyzing the results of each implementation.