• 마이크로전자및패키징학회지
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• 제15권2호
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• pp.17-21
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• 2008

Sn-Cu계 솔더 범프에서 무전해도금법을 이용한 범프 형성에 대한 연구를 하였다. $20{\mu}m$ via에 전기도금법으로 구리를 채운 웨이퍼 위에 ball형태의 범프를 형성하기 위하여 구리와 주석을 도금하여 약 $10{\mu}m$높이의 범프를 형성하였다. 구리 범프 형성 시 via위에 선택적으로 도금하기 위하여 활성화 처리 후 산세처리를 실시하고 무전해 도금액에 안정제를 첨가하였다. 무전해도금법을 이용하여 주석 범프 형성 시 도금층이 구리 범프에 비해 표면의 균일도가 벌어지는 것으로 관찰되었지만 reflow공정을 실시한 후 ball 형태의 균일한 Sn-Cu 범프를 형성하였다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1997년도 추계학술대회 논문집 학회본부
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• pp.279-281
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• 1997

The properties of Platinum dry etching were investigated in MICP(Magnetized Inductively Coupled Plasma). The problem with Platinum etching is the redeposition of sputtered Platinum on the sidewall. Because of the redeposits on the sidewall, the etching of patterned Platinum structure produce feature sizes that exceed the original dimension of the PR size and the etch profile has needle-like shape.[1] Generally, $Cl_2$ plasma is used for the fence-free etching.[1][2][3] The main object of this study was to investigate a new process technology for the fence-free Pt etching. Platinum was etched with Ar plasma at the cryogenic temperature and with Ar/$SF_6$ plasma at room temperature. In cryogenic etching, the height of fence was reduced to 20% at $-190^{\circ}C$ compared with that of room temp., but the etch profile was not fence-free. In Ar/$SF_6$ Plasma, chemical reaction took part in etching process. The trend of properties of Ar/$SF_6$ Plasma etching is similar to that of $Cl_2$ Plasma etching. Fence-free etching was possible, but PR selectivity was very low. A new gas chemistry for fence-free Platinum etching was proposed in this study.

• 한국재료학회지
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• 제25권12호
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• pp.655-658
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• 2015

The development of glucose biosensors has been attracting much attention because of their importance in monitoring glucose in the human body; such sensors are used to diagnose diabetes and related human diseases. Thanks to the high selectivity, sensitivity to glucose detection, and relatively low-cost fabrication of enzyme-immobilized electrochemical glucose sensors, these devices are recognized as one of the most intensively investigated glucose sensor types. In this work, ZnO nanofibers were synthesized using an electrospinning method with polyvinyl alcohol zinc acetate as precursor material. Using the synthesized ZnO nanofibers, we fabricated glucose biosensors in which glucose oxidase was immobilized on the ZnO nanofibers. The sensors were used to detect a wide range of glucose from 10 to 700 M with a sensitivity of $10.01nA/cm^2-{\mu}M$, indicating that the ZnO nanofiber-based glucose sensor can be used for the detection of glucose in the human body. The control of nanograins in terms of the size and crystalline quality of the individual nanofibers is required for improving the glucose-sensing abilities of the nanofibers.

• 한국재료학회지
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• 제9권8호
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• pp.798-803
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• 1999

본 연구는 SAPO-34 결정골격에 도입된 Fe(III)의 메탄올 전환성능에 미치는 영향에 중점을 두었다. 신속결정화법에 의해 높은 결정화도, 좁은 입자 분포도를 갖는 결정(FeAPSO-34; Si/Fe=40,20,5)들이 얻어졌으며, SRD와 SEM의 결과로부터, 골격에 도입된 Fe양이 증가할수록 결정화도는 감소하고, 그 입자크기도 아울러 감소함이 관찰되었다. 한편, 이들의 산성도는 골격에 도입된 Fe양이 증가할수록 감소하였고, 그 결과 메탄올 전환에 있어서 에틸렌의 선택성이 향상되는 결과를 가져왔다.

• Journal of electromagnetic engineering and science
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• 제11권2호
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• pp.83-90
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• 2011

In this paper, we present the design method for a low-pass type inverter, which can effectively suppress the spurious response associated with band-pass filters. The inverter has a length of ${\lambda}/4$ and employs not only a stepped-impedance configuration but also asymmetrical and bending structures in order to improve frequency selectivity and compactness. The inverter is applied as an impedance/admittance inverter to the ultra-wideband (UWB) band-pass filter. The UWB band-pass filter configuration is based on a stub band-pass filter consisting of quarter-wavelength impedance inverters and shunt short-circuited stubs ${\lambda}/4$ in length. The asymmetrical stepped-impedance low-pass type inverter improves not only the spurious responses, but also the return loss characteristics associated with a UWB band-pass filter, while a compact size is maintained. The UWB band-pass filter using the proposed inverters is fabricated and tested. The measured results show excellent attenuation characteristics at out-band frequencies, which exceed 18 dB up to 39 GHz. The insertion loss within the pass-band (from 3.1 to 10.6 GHz) is below 1.7 dB, the return loss is below 10 dB, and the group delay is below 1 ns.

• 한국세라믹학회지
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• 제50권6호
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• pp.451-453
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• 2013

Porous ceramic membranes consisting of $Ce_{1-x}Y_xO_{2-{\delta}}$ were developed for hydrogen permeation tests. Various amounts (x = 0, 0.05, 0.1, 0.2) of yttrium were doped to ceria to study the effect of yttrium doping on ceria membranes on various properties, including hydrogen permeability. $Ce_{1-x}Y_xO_{2-{\delta}}$ powder was synthesized by the sol-gel method. These membranes were fabricated by pressing and sintering at $1300^{\circ}C$ for 6 h. As the amount of yttrium increased, the grain size of the membrane decreased. Hydrogen permeability was improved as the yttrium content increased. Selective permeability of hydrogen compared to CO is explained by electric conductivity. As the temperature rose, both the hydrogen perm-selectivity and electric conductivity on $Ce_{0.8}Y_{0.2}O_{1.9}$ improved.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.112-112
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• 2008

최근 Ruthenium (Ru) 은 높은 화학적 안정성, 누설전류에 대한 높은 저항성, 저유전체와의 높은 안정성 등과 같은 특성으로 인해 금속층-유전막-금속층 캐패시터의 하부전극으로 각광받고 있다. 또한 Cu와의 우수한 Adhesion 특성으로 인해 Cu 배선에서의 Cu 확산 방지막으로도 주목받고 있다. 그러나 이렇게 형성된 Ru 하부전극의 각 캐패시터간의 분리와 평탄화를 위해서는 CMP 공정이 도입이 필요하다. 이러한 CMP 공정에 공급되는 Slurry 에는 부식액, pH 적정제, 연마입자 등이 첨가되는데 이때 연마입자가 응집하여 Slurry의 분산 안전성 저하에 영향을 줄수 있다. 이로 인해 응집된 Slurry는 Scratch와 Delamination 과 같은 표면 결함을 유발할 수 있으며, Slurry의 저장 안정성을 저하시켜 Slurry의 물리적 화학적 특성을 변화시킬 수 있다. 그리하여 본 연구에서는 Ru CMP Slurry에서의 Surfactant와 같은 분산 안정제에 따른 Surface tension, Zeta potential, Particle size, Sedimentation의 분석을 통해 Slurry 안정성에 대한 영향을 살펴보았다. 그 결과 pH9 조건의 31ppm Dispersant 농도에서 50%이상의 Sedimentation 상승효과를 얻을 수 있었다. 또한 선택된 Surfactant가 첨가된 Ru CMP Slurry를 제조하여 Ru wafer의 Static etch rate, Passivation film thickness 와 Wettability를 비교해 보았다. 그리고 CMP 공정을 실시하여 Ru의 Removal rate와 TEOS에대한 Selectivity를 측정해 보았다.

• 한국대기환경학회지
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• 제32권2호
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• pp.176-183
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• 2016

Activated carbon fibers (ACFs) for $CO_2$ adsorption were prepared from polyacrylonitrile (PAN) fiber through the systematic processes such as oxidation, activation and amination with the focus on the formation of nitration functional groups. Textural analysis of test samples revealed the decrease of specific surface area and pore volume by chemical activation including amination. The ratio of micropores to the total volume was 0.85 to 0.91, which was high enough with the pore size of 1.57 to 1.77 nm. Nitrogen compounds such as imine, pyridine and pyrrole presenting favorable interforces to $CO_2$ molecules were formed throughout the whole preparation steps. The aminated ACF adsorbent showed the enhanced adsorption capacity, 0.40 mmol/g for low-level $CO_2$ flow (3000 ppm) at room temperature. Selectivity of $CO_2$ against dry air ($O_2$ & $N_2$) also increased from 1.00 to 4.66 by amination.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1997년도 추계학술대회 논문집
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• pp.473-476
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• 1997

Focused Ar ion laser beam can be utilized to fabricate microstructures on silicon substrate as well as other materials(e.g. such as ceramic). The laser using in this study is an argon ion laser with maximum power of 6 W, wavelength of 514 nm. This laser beam is focused by objectives with a high numerical aperture, a long working distance. We have achieved line width about 1 ${\mu}{\textrm}{m}$ with high scan speed. The resolution for Si machining is determined by the selectivity of the chemical reaction rather than the laser spot size. In this study, we have obtained the maximum etch rate of 434.7 ${\mu}{\textrm}{m}$/sec with high aspect ratio. The characteristics of etched groove was investigated by scanning electron microscope(SEM) and auger electron spectroscopy(AES). It is assumed that the technique using arson ion laser is applicab1e to fabricate microstructures.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.50-50
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• 2007

최근 DRAM 소자 내에서 Ruthenium (Ru) 은 높은 화학적 안정성, 누설전류에 대한 높은 저항성, 고유전체와의 높은 안정성등과 같은 특성으로 인해 금속층-유전막(insulator)-금속층 캐패시터에 대한 하부전극으로 각광받고 있다. 일반적으로 Ru은 화학적으로 매우 안정하여 습식 식각으로 제거하기 어려우며, 이로인해 건식 식각을 이용하여 Ru을 제거하는 것이 널리 통용되고 있다. 하지만 칵 캐패시터의 분리를 위해 Ru을 건식 식각할 경우, 유독한 $Ru0_4$ 가스가 발생할 수 있으며 Ru 하부전극의 탈균일한 표면과 몰드 산화막의 손실을 유발할 수 있다. 이로인해 각 캐패시터간의 분리와 평탄화를 위해 CMP 공정이 도입되게 되었다. 이러한 CMP 공정에 공급되는 슬러리에는 부식액, pH 적정제, 연마입자등이 첨가되는데 이때 연마입자가 응집하여 슬러리의 분산 안정성 저하에 영향을 줄 수 있다. 그리하여 본 연구에서는 Ru CMP Slurry에서의 surfactant와 같은 첨가제에 따른 zeta potential, particle size, sedimentation의 분석을 통해 slurry 안정성에 대란 영향을 살펴보았다. 또한 선택된 surfactant가 첨가된 Ru CMP Slurry를 제조하여 Ru의 removal rate와 TEOS에 대한 selectivity를 측정해 보았다.