• Title/Summary/Keyword: Size Inspection

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Visual Inspection of Tube Internal

  • Choi, Young-Soo;Cho, Jai-Wan;Kim, Chang-Hoi;Seo, Yong-Chil;Kim, Seung-Ho
    • 제어로봇시스템학회:학술대회논문집
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    • 2003.10a
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    • pp.789-792
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    • 2003
  • Pipe inspection has a great importance to ensure safety for the nuclear power plant. In this paper, we designed visual inspection module for the tube internal, which diameter is 15${\sim}$20mm. And we made inspection module which consisted of CCD camera and light. And the relation between image and real world coordinate is established. Image processing is performed to calculate mapping parameter and analyze the size of defect. For the calculation of mapping parameter, experiment is performed using grid type test pattern. Acquired image is processed to extract image coordinate. Edge detection, thresholding, median filtering and morphology filtering is applied to extract grid pattern. Extracted image coordinate is used to calculate image to real world mapping. Lens distortion was considered and corrected to get exact data. Coordinate transformation data is provided for the users to recognize easily. Experiment was performed using grid type test pattern, we extracted lens distortion parameter and real coordinate of defect point. Radial distortion of lens was corrected but tangential distortion was not considered. As continuum to this study, the tangential distortion of lens is considered and improvement of analy zing technique for the tube internal be explored continuously.

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Inspection method of BGA Ball Using 5-step Ring Illumination (5층 링 조명에 의한 BGA 볼의 검사 방법)

  • Kim, Jong Hyeong;Nguyen, Chanh D.Tr.
    • Journal of Institute of Control, Robotics and Systems
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    • v.21 no.12
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    • pp.1115-1121
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    • 2015
  • Fast inspection of solder ball bumps in ball grid array (BGA) is an important issue in the flip chip bonding technology. Particularly, semiconductor industry has required faster and more accurate inspection of micron-size solder bumps in flip chip bonding, as the density of balls increase dramatically. In this paper, we describe an inspection approach of BGA balls by using 5-step ring illumination device and normalized cross-correlation (NCC) method. The images of BGA ball by the illumination device show unique and distinguishable characteristic contours by their 3-D shapes, which are called as "iso-slope contours". Template images of reference ball samples can be produced artificially by the hybrid reflectance model and 3D data of balls. NCC values between test and template samples are very robust and reliable under well-structured condition. The 200 samples on real wafer are tested and show good practical feasibility of the proposed method.

Automatic Inspection for LCD Panel Defect (LCD(Liquid Crystal Display) Panel의 결점 검사)

  • Lee Y.J.;Lee J.H.;Ko K.W.;Cho S.Y.;Lee J.H.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.946-949
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    • 2005
  • This paper deals with the algorithm development that inspects defects such as Bright Defect Dots, Dark Defect Dots, and Line Defect caused by the process of LCD(Liquid Crystal Display). While most of LCD production process is automated, the inspection of LCD panel and its appearance depends on manual process. So, the quality of the inspection is affected by the condition of worker. Especially, the more LCD size increases, the more the worker feels fatigued, which causes the probability of miss judgement. So, the automated inspection is required to manage the consistent quality of the product and reduce the production costs. In this paper, to solve these problems, we developed the imaging processing algorithm to inspect the defects in captured image of LCD. Experimental results reveal that we can recognize various types of defect of LCD with good accuracy and high speed.

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Wavelet Transform Based Defect Detection for PCB Inspection Machines (PCB 검사기를 위한 웨이블릿 변환 기반의 결함 검출 방법)

  • Youn, Seung-Geun;Kim, Young-Gyu;Park, Tae-Hyung
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.66 no.10
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    • pp.1508-1515
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    • 2017
  • This paper proposes the defect detection method for automatic inspection machines in printed circuit boards (PCBs) manufacturing system. The defects of PCB such as open, short, pin hole and scratch can be detected by comparing the standard image and the target image. The standard image is obtained from CAD file such as ODB++ format, and the target image is obtained by arranging, filtering and binarization of captured PCB image. Since the PCB size is too large and image resolution is too high, the image processing requires a lot of memory and computational time. The wavelet transform is applied to compress the standard and target images, which results in reducing the memory and computational time. To increase the inspection accuracy, we utilize the he HH-domain as well as LL-domain of the transformed images. Experimental results are finally presented to show the performance improvement of the proposed method.

Development of Wireless Diagnostic System for Substation Equipments Using SMS Mode of Mobile Communication Network (이동통신망의 SMS방식을 이용한 변전기기 무선진단 시스템 개발)

  • Kim, Jin-Cheol;Kim, Ji-Ho;Yun, Man-Sik;Song, Ho-Jun;Lee, Hyang-Beom
    • Proceedings of the KIEE Conference
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    • 2003.07a
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    • pp.259-261
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    • 2003
  • This paper suggests wireless diagnosis and monitoring system using SMS mode of mobile communication network for distribution transformer which could prevent electrical accident in the near future. Data are acquired by measuring the temperature of insulator oil in the distribution transformer and load current. Data acquisition of sensor using mobile communication network carried out filtering of sensor's output to optimize the size of send data Merit of this inspection method is that management, control and monitoring some transformers can be carried out using only one server. This inspection method will be the way of inspection to be worth spotlight in the near future because it is able to solve easily with the minimum facility inspection about state of transformer which is operating, to wide coverage about machine's wrong operation in other field.

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Automate Capsule Inspection System using Computer Vision (컴퓨터 시각장치를 이용한 자동 캡슐 검사장치)

  • 강현철;이병래;김용규
    • Journal of the Korean Institute of Telematics and Electronics B
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    • v.32B no.11
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    • pp.1445-1454
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    • 1995
  • In this study, we have developed a prototype of the automatic defects detection system for capsule inspection using the computer vision techniques. The subjects for inspection are empty hard capsules of various sizes which are made of gelatine. To inspect both sides of a capsule, 2-stage recognition is performed. Features we have used are various lengths of a capsule, area, linearity, symmetricity, head curvature and so on. Decision making is performed based on average value which is computed from 20 good capsules in training and permission bounds in factories. Most of time-consuming process for feature extraction is computed by hardware to meet the inspection speed of more than 20 capsules/sec. The main logic for control and arithmetic computation is implemented using EPLD for the sake of easy change of design and reduction in time for developement. As a result of experiment, defects on size or contour of binary images are detected over 95%. Because of dead zone in imaging system, detection ratio of defects on surface, such as bad joint, chip, speck, etc, is lower than the former case. In this case, detection ratio is 50-85%. Defects such as collet pinch and mashed cap/body seldom appear in binary image, and detection ratio is very low. So we have to process the gray-level image directly in partial region.

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A Study on the Size Distribution and Chemical Composition of total Suspended Particulates at Industrial Region (공단지역에서 대기중 총 부유분진의 입자크기 분포와 화학적 성분에 관한 분석과 연구)

  • Park, Heung-Jae;Lee, Seong-Uk;Park, Won-U
    • Journal of Environmental Science International
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    • v.2 no.3
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    • pp.201-206
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    • 1993
  • The concentration of Total Suspended Particulates(T.S.P), size distribution of suspended particulates, and soluble anions of T.S.P in atmosphere of industrial region in Busan were investigated. T.S.P was measured by High-Volume Air Sampler and particle size distribution was measured by Anderson Air Sampler. We analyzed the chemical component of the T.S.P by ion Chromatography and measure4 the shape and size of T.S.P by Scanning Electron Micrography The small size of T.S.P mainly exist in industrial region, but the large size of T.S.P mainly exist in residentail area.

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A Study on the Influence of Behavior of Underground Cavern to Cavern Size and Joint Orientation (공동 규모와 절리 방향성이 지하공동의 거동에 미치는 영향에 대한 연구)

  • Kim, Sang-Hwan;Shin, Beom-Seok
    • Journal of the Korea institute for structural maintenance and inspection
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    • v.14 no.1
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    • pp.84-92
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    • 2010
  • This paper presents the influence of the underground structure (such as cavern and tunnels) behavior according to the rock joint orientation and underground cavern size. In order to perform this research, numerical and experimental studies are carried out. Stress aspect was assessed by quantitative according two kind of factor. In the experimental study, the laboratory model tests are performed in the several ground conditions with different underground cavern size. The results obtained from the model tests are also verified and evaluated using the numerical analysis. Due to the underground cavern, it is found from this study that the stresses developed in archcrown, side wall of underground are increased with increasing the underground cavern size. It is also investigated that the rock joint direction is one of main influence factor as risk factor, to maintain the underground cavern stability. It may be expected that this research will provide the very useful information to evaluate the underground cavern stability.

Design and Performance Evaluation of Shear Wave Phased Array Ultrasonic Transducer (횡파 위상배열 초음파 탐촉자 설계 및 성능 평가)

  • Yoon, Byung-Sik;Lee, Hee-Jong;Braconnier, Dominique
    • Journal of the Korean Society for Nondestructive Testing
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    • v.32 no.2
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    • pp.185-191
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    • 2012
  • Typically, a wedge is involved to generate effectively high inspection angle in pipe weld inspection using phased array ultrasonic technique. But the usage of this wedge for weld or access limited area can cause coverage limitation for the examination volume because of the wedge front length. Therefore, the shear wave phased array probe which can generate high inspection angle without wedge is essentially necessary. In this paper, the shear wave phased array ultrasonic probe which can generate high inspection angle designed by modeling and manufactured from the modelling result. And this shear wave probe tested whether it can detect and sizing for EDM test block that contains various depth. As results, the experimental results show that the designed shear wave phased array probe can detect and size with reliable accuracy. Therefore if this phased array probe apply in field inspection, it is expected that it show more reliable inspection result for plant structure having access limitation.

Development and Characterization of the Electromagnetic Acoustic Transducer for Tubes (튜브탐상용 EMAT 제작 및 특성조사)

  • Ahn, Bong-Young;Lee, Se-Kyung
    • Journal of the Korean Society for Nondestructive Testing
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    • v.5 no.2
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    • pp.42-48
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    • 1986
  • Electromagnetic - Acoustic Transducers for the inspection of tubes were developed using permanent magnets and induction coils. The propagation velocity of ultrasonic waves in a tude wall was measured by the transducers. The position of a flaw in a tube and the relative size of flaws with different size were measured.

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