• Fire Science and Engineering
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• v.10 no.2
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• pp.28-39
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• 1996

A recently developed electro-thermal simulation methodology is used to analyze the behavior of a PWM(Pulse-Width-Modulated) voltage source inverter which uses IGBT(Insulated Gate Bipolar Transistor) as the switching devices. In the electro-thermal network simulation methdology, the simulator solves for the temperature distribution within the power semiconductor devices(IGBT electro-thermal model), control logic circuitry, the IGBT gate drivers, the thermal network component models for the power silicon chips, package, and heat sinks as well as the current and voltage within the electrical network. The thermal network describes the flow of heat form the chip surface through the package and heat sink and thus determines the evolution of the chip surface temperature used by the power semiconductor device models. The thermal component model for the device silicon chip, packages, and heat sink are developed by discretizing the nonlinear heat diffusion equation and are represented in component from so that the thermal component models for various package and heat sink can be readily connected to on another to form the thermal network.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.119-123
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• 2001

In this paper, a new structure and fabrication method for the wafer level package(WLP) is presented. A packaged VLSI chip is encapsulated by a parylene(which is a low k material) layer as a dielectric layer and is molded by SUB photo-epoxy with dielectric constant of 3.0 at 100 MHz. The electrical parameters (R, L, C) of package traces are extracted by using the Maxwell 3-D simulator. Based on HSPICE simulation results, the proposed wafer level package can operate for frequencies up to 20GHz.

• Proceedings of the IEEK Conference
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• 2001.06b
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• pp.133-136
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• 2001

A new package design method to reduce resonance effect due to an IC package is represented. Frequency-variant circuit model of the power/ground plane was developed to accurately reflect the resonance. The circuit model is benchmarked with a full wave simulation, thereby verifying its accuracy. Then it was shown that the proposed technique can efficiently reduce the resonance due to the IC package.

• Proceedings of the IEEK Conference
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• 1999.06a
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• pp.389-392
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• 1999

It is essential to estimate an effective inductance in a ground plane of muliti-layer IC package system in order to determine the simultaneous switching noise of the package. A new method to estimate the effective ground inductance in multi-layer IC package is presented. With the estimated ground plane inductance values, maximum switching noise variations according to the number of simultaneously switching drivers are investigated by developing a new SSN model. These results are verified by performing HSPICE simulation with the 0.35${\mu}{\textrm}{m}$ CMOS technology.

• Proceedings of the Korean Nuclear Society Conference
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• 1995.10a
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• pp.423-428
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• 1995

Simulation models have been developed to predict the overall behavior of the CANDU plant systems during normal operational transients. For real time simulation purpose, simplified thermal hydraulic models are applied with appropriate system control logics, which include primary heat transport system solver with its component models and secondary side system models. The secondary side models are mainly used to provide boundary conditions for primary system calculation and to accomodate plant power control logics. Also, for the effective use of simulation package, hardware oriented basic simulation network has been established with appropriate graphic display system. Through validation with typical plant power maneuvering cases using proven plant performance analysis computer code, the present simulation package shows reasonable capability in the prediction of the dynamic behavior of plant variables during operational transients of CANDU plant, which means that this simulation tool can be utilized as a basic framework for full scope simulation network through further improvements.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.43-48
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• 2022

In this study, simulation method was developed to improve the accuracy of the warpage simulation based on the equivalent anisotropic viscoelastic model. First, a package with copper traces and bumps was modeled to implement anisotropic viscoelastic behavior. Then, equivalent anisotropic viscoelastic properties and thermal expansion coefficient for the bump region were derived through the representative volume element model. A thermal cycle of 0 to 125 degrees was applied to the package based on the derived mechanical properties, and the warpage according to the thermal cycle was simulated. To verify the simulation results, the actual package was manufactured, and the warpage with respect to the thermal cycle was measured through shadow moiré interferometer. As a result, by applying the equivalent anisotropic viscoelastic model, it was possible to calculate the warpage of the package within 5 ㎛ error and predict the shape of the warpage.

• Proceedings of the KIEE Conference
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• 2002.07c
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• pp.1972-1975
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• 2002

In this paper, we have proposed low temperature co-fired ceramic (LTCC) based packaging for RF MEMS devices. The packaging structure is designed and evaluated with 3D full field simulation. 50 ${\Omega}$ matched coplanar waveguide(CPW) transmission line is employed as the test vehicle to evaluate the performances of the proposed package structure. The line is encapsulated with the LTCC packaging lid and connected to the via feed line. To reduce the insertion loss due to the packaging lid, the cavity with via post is formed in the packaging lid. The performances of the package structure is simulated with the different cavity depth and via-to-via length. Simulation results show that the proposed package structure has reflection loss better than 20 dB and insertion loss lower than 0.1 dB from DC to 30 GHz with the cavity depth and via-to-via length of 300 ${\mu}m$ and 350 ${\mu}m$, respectively. To realize the designed package structure, the cavity patterning is tested using the sandblast of LTCC.

• Nuclear Engineering and Technology
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• v.52 no.7
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• pp.1557-1564
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• 2020

In this paper, 3D model-based interactive gamma ray shielding package (MIGSHIELD) is developed in virtual reality platform for windows operating system. In MIGSHIELD, the computational methodology is based on point kernel algorithm (PK), several key parameters of PK are obtained using new technique and new methods. MIGSHIELD has interactive capability with virtual world. The main features made in the MIGSHIELD are (i) handling of physical information from virtual world, (ii) handling of arbitrary shapes radioactive source, (iii) calculating the mean free path of gamma ray, (iv) providing interactive function between PK and virtual world, (v) making better use of PK for virtual simulation, (vi) plug and play. The developed package will be of immense use for calculations involving radiation dose assessment in nuclear safety and contributing to fast radiation simulation for virtual nuclear facilities.

• The Journal of the Acoustical Society of Korea
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• v.38 no.2
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• pp.200-206
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• 2019

In this paper, the characteristics of receiving voltage sensitivity about acoustic package in towed array sonar is analyzed through the numerical simulation and design of experiments. Simulation results show that the variation of receiving voltage sensitivity is caused by the structural resonance mode shape on baseline acoustic package. The effect of design parameters of the acoustic package are analyzed through the design of experiments to reduce the deviation of receiving voltage sensitivity. A change of hydrophone shield can thickness (t) is the greatest effect on the deviation of receiving voltage sensitivity. As a result of water tank test, the acoustic package derived from the design of experiments has reduced deviation of receiving voltage sensitivity.

• The Journal of the Korea institute of electronic communication sciences
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• v.9 no.8
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• pp.883-888
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• 2014

Simulation is now using in various area as an effective decision analysis tool in complex environment of today. But, There is a focus to the simulation model development and execution better than result analysis. This article will emphasis to the importance of result analysis apart from model development in simulation, and will use R package for profit optimization simulation. R has a various function in statistic analysis and data manipulation, graphic display. So this research can show the value of R as a tool for simulation.