• JSTS:Journal of Semiconductor Technology and Science
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• 제14권1호
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• pp.8-22
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• 2014

In the past few decades, CMOS logic technologies and devices have been successfully developed with the steady miniaturization of the feature size. At the sub-30-nm CMOS technology nodes, one of the main hurdles for continuously and successfully scaling down CMOS devices is the parametric failure caused by random variations such as line edge roughness (LER), random dopant fluctuation (RDF), and work-function variation (WFV). The characteristics of each random variation source and its effect on advanced device structures such as multigate and ultra-thin-body devices (vs. conventional planar bulk MOSFET) are discussed in detail. Further, suggested are suppression methods for the LER-, RDF-, and WFV-induced threshold voltage (VTH) variations in advanced CMOS logic technologies including the double-patterning and double-etching (2P2E) technique and in advanced device structures including the fully depleted silicon-on-insulator (FD-SOI) MOSFET and FinFET/tri-gate MOSFET at the sub-30-nm nodes. The segmented-channel MOSFET (SegFET) and junctionless transistor (JLT) that can suppress the random variations and the SegFET-/JLT-based static random access memory (SRAM) cell that enhance the read and write margins at a time, though generally with a trade-off between the read and the write margins, are introduced.

• Bulletin of the Korean Chemical Society
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• 제33권12호
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• pp.4161-4164
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• 2012

Density functional MO calculations for the methylsilole anion of $[C_4H_4SiMe]^-$ and methylgermole anion of $[C_4H_4SiMe]^-$ at the B3LYP (full)/6-311+$G^*$ level (GAUSSIAN 94) were carried out and characterized by frequency analysis. The ground state structure for the methylsilole anion and methylgermole anion is that the methyl group is pyramidalized with highly localized structure. The difference between the calculated $C_{\alpha}-C_{\beta}$ and $C_{\beta}-C_{\beta}$ distances are 9.4 and 11.5 pm, respectively. The E-Me vector forms an angle of $67.9^{\circ}$ and $78.2^{\circ}$ with the $C_4E$ plane, respectively. The optimized structures of the saddle point state for the methylsilole anion and methylgermole anion have been also found as a planar with highly delocalized structure. The optimized $C_{\alpha}-C_{\beta}$ and $C_{\beta}-C_{\beta}$ distances are nearly equal for both cases. The methyl group is located in the plane of $C_4E$ ring and the angle between the E-Me vector and the $C_4E$ plane for the methylsilole anion and methylgermole anion is $2.0^{\circ}$ and $2.3^{\circ}$, respectively. The energy difference between the ground state structure and the transition state structure is only 5.1 kcal $mol^{-1}$ for the methylsilole anion. However, the energy difference of the methylgermole anion is 14.9 kcal $mol^{-1}$, which is much higher than that for the corresponding methylsilole monoanion by 9.8 kcal $mol^{-1}$. Based on MO calculations, we suggest that the head-to-tail dimer compound, 4, result from [2+2] cycloaddition of silicon-carbon double bond character in the highly delocalized transition state of 1. However, the inversion barrier for the methylgermole anion is too high to dimerize.

• 한국세라믹학회지
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• 제37권1호
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• pp.21-25
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• 2000

Gas pressure sintered silicon nitride based composites with 5 wt% $\beta$-Si3N4 whiskers were prepared, and the variations depending on sintering additives and sintering temperature were studied. Sintering additives were 6 wt% Y2O3-1 wt% MgO(6Y1M), 6 wt%Y2O3-1 wt% Al2O3(6Y1A), 6 wt% Y2O3-1 wt% SiO2(6Y1S), and whiskers were unidirectionally oriented by a modified tape casting technique. Samples were fully densified by gas pressure sintering at 2148 K and 2273 K. As the sintering temperature increased, the size of large elongated grains was increased. Three point flexural strength of 6Y1M and 6Y1M samples was higher than that of 6Y1S sample, and the strength decreased as the sintering temperature increased. The indentation crack length became shorter for the sample sintered at higher temperature, and the difference between the cracks length parallel to and normal to the direction of whisker alignment was decreased. In case of cracks 45$^{\circ}$off the whisker alignment direction, the crack length anisotropy disappeared.

• Advances in Energy Research
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• 제1권2호
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• pp.97-106
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• 2013

This study designs and tests a photovoltaic system with distributed maximum power point tracking (DMPPT) methodology using a field programmable gate array (FPGA) controller. Each solar panel in the distributed PV system is equipped with a newly designed DC/DC converter and the panel's voltage output is regulated by a FPGA controller using PI control. Power from each solar panel on the system is optimized by another controller where the quadratic maximization MPPT algorithm is used to ensure the panel's output power is always maximized. Experiments are carried out at atmospheric insolation with partial shading conditions using 4 amorphous silicon thin film solar panels of 2 different grades fabricated by Chi-Mei Energy. It is found that distributed MPPT requires only 100ms to find the maximum power point of the system. Compared with the traditional centralized PV (CPV) system, the distributed PV (DPV) system harvests more than 4% of solar energy in atmospheric weather condition, and 22% in average under 19% partial shading of one solar panel in the system. Test results for a 1.84 kW rated system composed by 8 poly-Si PV panels using another DC/DC converter design also confirm that the proposed system can be easily implemented into a larger PV power system. Additionally, the use of NI sbRIO-9642 FPGA-based controller is capable of controlling over 16 sets of PV modules, and a number of controllers can cooperate via the network if needed.

• 한국IT서비스학회지
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• 제14권3호
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• pp.183-196
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• 2015

The concept of energy-efficient networking has begun to spread in the past few years, gaining increasing popularity. A common opinion among networking researchers is that the sole introduction of low consumption silicon technologies may not be enough to effectively curb energy requirements. Thus, for disruptively boosting the network energy efficiency, these hardware enhancements must be integrated with ad-hoc mechanisms that explicitly manage energy saving, by exploiting network-specific features. The IEEE 802.3az Energy Efficient Ethernet (EEE) standard is one of such efforts. EEE introduces a low power mode for the most common Ethernet physical layer standards and is expected to provide large energy savings. However, it has been shown that EEE may not achieve good energy efficiency because mode transition overheads can be significant, leading to almost full energy consumption even at low utilization levels. Coalescing techniques such as packet coalescing and interrupt coalescing were proposed to improve energy efficiency of EEE, but their implementations typically adopt a simple policy that employs a few fixed values for coalescing parameters, thus it is difficult to achieve optimal energy efficiency. The paper proposes adaptive interrupt coalescing (AIC) that adopts an optimal policy that could not only improve energy efficiency but support performance. AIC has been implemented at the sender side with the Intel 82579 network interface card (NIC) and e1000e Linux device driver. The experiments were performed at 100 M bps transfer rate and show that energy efficiency of AIC is improved in most cases despite performance consideration and in the best case can be improved up to 37% compared to that of conventional interrupt coalescing techniques.

• 한국산학기술학회:학술대회논문집
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• 한국산학기술학회 2004년도 추계학술대회
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• pp.99-102
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• 2004

Display process has adopted RCA clean, being applied to large area and coped with environmental issue for last ten years. However, the approaching concept of ozonized, hydrogenised, or electrolyzed water cleaning technologies is within RCA clean paradigm. In this work, only electrolyzed anode water was applied to clean particles and organics as well as metals based on Pourbaix concept, and as a test vehicle, MgO particles were introduced to prove the new concept. The electrolyzed anode water is very oxidative with high oxidation reduction potential(ORP) and low in pH of more than 900mV and 3.1, respectively. MgO particles were immerged in the anode water and its weight losses due to dissolution were measured with time. Weight losses were in the ranges of 100 to 500 micrograms in 250m1 anode waters depending on their ORP and pH. Therefore it was concluded that the cleaning radicals in the anode water was at least in the range of 1 to 5E20 ea per 250 ml anode water equivalent to IE18 ea/cm3. Hence it can be assumed that the anode water be applied to display cleaning since 1E10 to IE15 ea/cm3 ranges of contaminants are being treated. In addition, it was observed that anode water does not develop micro-roughness on hydrophobic surface while it does on the native silicon oxide.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 C
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• pp.1621-1622
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• 2006

This paper presents the effect of driving waveform for piezoelectric bend mode inkjet printhead with optimized mechanical design. Experimental and theoretical studies on the applied driving waveform versus jetting characteristic s were performed. The inkjet head has been designed to maximize the droplet velocity, minimize voltage response of the actuator and optimize the firing frequency to eject ink droplet. The head design was carried out by using mechanical simulation. The printhead has been fabricated with Si(100) and SOI wafers by MEMS process and silicon direct bonding method. To investigate how performance of the piezoelectric ceramic actuator influences on droplet diameter and droplet velocity, the method of stroboscopy was used. Also we observed the movement characteristics of PZT actuator with LDV(Laser Doppler Vibrometer) system, oscilloscope and dynamic signal analyzer. Missing nozzles caused by bubbles in chamber were monitored by their resonance frequency. Using the water based ink of viscosity of 4.8 cps and surface tension of 0.025N/m, it is possible to eject stable droplets up to 20kHz, 4.4m/s and above 8pL at the different applied driving waveforms.

• 센서학회지
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• 제15권4호
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• pp.277-283
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• 2006

We presented that fabrication process and characteristics of 3 axes flexible tactile sensor available for normal and shear force fabricated using Si micromachining and packaging technologies. The fabrication processes for 3 axes flexible tactile sensor were classified in the fabrication of sensor chips and their packaging on the flexible PCB. The variation rate of resistance was about 2.1 %/N and 0.5 %/N in applying normal and shear force, respectively. The flexibility of fabricated 3 axes flexible tactile sensor array was good enough to place on the finger-tip.

• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 2010년도 춘계학술대회
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• pp.788-791
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• 2010

본 논문에서는 인쇄공정기술로써 ETRI $0.8{\mu}m$ CMOS 공정을 사용하여 수동형 인쇄 RFID 태그칩용 64bit ROM을 설계하였다. 먼저 태그 칩의 제작단가를 줄이기 위하여 기존 실리콘 기반의 복잡한 리소그래피 공정을 사용하지 않고 게이트 단자인 폴리 층을 프린팅 기법 중 하나인 임프린트 공정을 사용하여 구현하였다. 그리고 �弼壅� ROM 셀 회로는 기존 ROM 셀 회로의 NMOS 트랜지스터대신에 CMOS 트랜스미션 게이트를 사용함으로써 별도의 BL 프리차지 회로와 BL 감지 증폭기가 필요 없이 출력 버퍼만으로 데이터를 읽어낼 수 있도록 하였다. $0.8{\mu}m$ CMOS 공정을 이용하여 설계된 8 행 ${\times}$ 8 열의 어레이를 갖는 64b ROM의 동작전류는 $9.86{\mu}A$이며 레이아웃 면적은 $311.66{\times}490.59{\mu}m^2$이다.

• 한국산학기술학회논문지
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• 제3권2호
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• pp.74-79
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• 2002

80년대 반도체 산업의 급격한 성장으로 오늘날 반도체 산업은 반도체소자의 초고집접화, 웨이퍼의 대구경화로 발전이 거듭났으며, 소자의 성능과 생산 수율의 향상을 위하여 실리콘 웨이퍼의 세정하는 기술 및 연구를 계속 진행하고 있다. 기존의 반도체 세정은 과다한 화학약품의 사용으로 비 환경친화적이며, 이에 본 연구에서는 기존의 세정방법을 대체하기 위한 방법으로 환경친화적인 전리수를 이용한 반도체 세정법을 하였다. 이때 실리콘 웨이퍼 표면의 원자적 상태의 변화가 발생하여 다양한 방법으로 확인할 수 있다. 본 연구에 서는 이러한 분석을 하기 위하여 기존세정의 화학약품과 전리수로 세정한 웨이퍼의 표면을 비교하였으며, 또한 온도 및 시간별 표면상태변화를 분석하였다. 특히 접촉각 변하에 중점을 두어 변화를 관찰하였으며, 음극수의 경우 17.28°, 양극수의 경우 34.1°의 낮은 접촉각을 얻을 수 있었다.