• Title/Summary/Keyword: Silicon thin

Search Result 1,698, Processing Time 0.028 seconds

Hydrophobicity and Nanotribological Properties of Silicon Channels coated by Diamond-like Carbon Films

  • Pham, Duc Cuong;Na, Kyung-Hwan;Pham, Van Hung;Yoon, Eui-Sung
    • KSTLE International Journal
    • /
    • v.10 no.1_2
    • /
    • pp.1-5
    • /
    • 2009
  • This paper reports an investigation on nanotribological properties of silicon nanochannels coated by a diamond-like carbon (DLC) film. The nanochannels were fabricated on Si (100) wafers by using photolithography and reactive ion etching (RIE) techniques. The channeled surfaces (Si channels) were then further modified by coating thin DLC film. Water contact angle of the modified and unmodified Si surfaces was examined by an anglemeter using the sessile-drop method. Nanotribological properties, namely friction and adhesion forces, of the Si channels coated with DLC (DLC-coated Si channels) were investigated in comparison with those of the flat Si, DLC-coated flat Si (flat DLC), and Si channels, using an atomic force microscope (AFM). Results showed that the DLC-coated Si channels greatly increased hydrophobicity of silicon surfaces. The DLC coating and Si channels themselves individually reduced adhesion and friction forces of the flat Si. Further, the DLC-coated Si channels exhibited the lowest values of these forces, owing to the combined effect of reduced contact area through the channeling and low surface energy of the DLC. This combined modification could prove a promising method for tribological applications at small scales.

Modelling of ZMR process for fabrication of SOI (SOI소자 제죠를 위한 ZMR공정의 모델링)

  • 왕종회;김도현
    • Journal of the Korean Crystal Growth and Crystal Technology
    • /
    • v.5 no.2
    • /
    • pp.100-108
    • /
    • 1995
  • Heat transfer plays a critical role in determining interface location and shape in ZMR process, which is used for the fabrication of silicon - on - insulator structure. In this work, the two - dimensional pseudo - steady - state ZMR model has been developed that can simulate the heat transfer process during ZMR process. It contains the radiation, convection and conduction heat transfer and determines the interface shapes. Numerical solutions from the model include flow field in the molten zone, temperature field in the full SOl structure and the location of solid/liquid interface in the silicon thin film and silicon substrate. We examined the effects of the various system parameters on the temperature profiles and the interface shape.

  • PDF

Joining of Silicon Nitride to Carbon Steel using an Active Metal Alloys (활성 납재를 이용한 질화규소/탄소강 접합)

  • Choe, Yeong-Min;Jeong, Byeong-Hun;Lee, Jae-Do
    • Korean Journal of Materials Research
    • /
    • v.9 no.2
    • /
    • pp.199-204
    • /
    • 1999
  • As the engine design change to get high efficiency and performance of commercial diesel engine, surface wear of the cam follower becomes an important issues as applied load increasing at the contact face between cam follower and cam. Purpose of this study is the developing of the ceramic cam follower made of silicon nitride ceramic which is more wear resistant than the cast iron and sintered cam follower. Ceramic cam follower was made by direct brazing of thin ceramic disk to steel can follower body using active bracing alloy. Effect of joining condition on the interfacial phases and joining strength wer examined at bvarious joining temperatures, times, and cooling rates. Crowning resulted from the difference of thermal expansion coefficient after direct brazing without using any stress-relieving inter layer was measured. Interfacial phases are mainly titanium silicide and titanium nitride which are the products between active metal(Ti) in brazing alloy and silicon nitiride. Maximum joining strength of the ceramic metal joint, measured by DBS method, was 334MPa. Crowning(R) of the prototype ceramic cam follower was 1595mm. As machining for crowning is not necessary, production cost can be reduced.

  • PDF

Structural, Optical properties of layer thickness dependence for silicon quantum dots in SiC matrix superlattice (실리콘 양자점 초격자 박막의 두께에 따른 구조적, 광학적 특성 분석)

  • Kim, Hyun-Jong;Moon, Ji-Hyun;Park, Sang-Hyun;Cho, Jun-Sik;Yoon, Kyung-Hoon;Song, Jin-Soo;O, Byung-Sung;Lee, Jeong-Chul
    • 한국신재생에너지학회:학술대회논문집
    • /
    • 2009.11a
    • /
    • pp.398-398
    • /
    • 2009
  • 텐덤 구조의 양자점 태양전지에서 양자점의 크기에 따라 에너지 밴드갭이 달라 넓은 대역의 태양광을 이용할 수 있다. 이러한 양자점의 크기는 증착 두께의 제어로 조절이 가능하다. Si과 C target을 이용한 RF Co-sputtering 법으로 각각 증착시간을 다르게 하여, SiC/$Si_{1-x}C_x$(x~0.20)인 실리콘 양자점 초격자 박막을 제조하고, $1000^{\circ}C$에서 20분간 질소 분위기에서 열처리를 하였다. Grazing incident X-ray diffraction(GIXRD)를 통해서 Si(111)과 $\beta$-SiC (111)이 생성되었음을 확인하였고, High resolution transmission electron microscopy(HRTEM) 사진으로 양자점의 크기와 분포 밀도를 확인할 수 있었다. Photoluminescence(PL)에서 1.4, 1.5, 1.7, 1.9eV의 Peak이 확인되었다.

  • PDF

The Effects of the Drive-in Process Parameters on the Residual Stress Profile of the $p^+$ Silicon Thin Film (후확산 공정 조건이 $p^+$ 실리콘 박막의 잔류 응력 분포에 미치는 영향)

  • Jeong, Ok-Chan;Park, Tae-Gyu;Yang, Sang-Sik
    • The Transactions of the Korean Institute of Electrical Engineers C
    • /
    • v.48 no.9
    • /
    • pp.665-671
    • /
    • 1999
  • The paper represents the effects of the drive-in process parameters on the residual stress profile of the $p^+$ silicon film. Since the residual stress profile is notuniform along the direction normal to the surface, the residual stress is assumed to be a polynomial function of the depth. All the coefficients of the polynomial can be determined by measuring of the thicknesses and the deflections of cantilevers and the deflection of a rotating beam with a surface profiler meter and a microscope. As the drive-in temperature or the drive-in time increases, the boron concentration decreases and the magnitude of the average residual tensile stress decreases. Then, near the surface of the $p^+$ film the residual tensile stress is transformed into the residual compressive stress and its magnitude increases.

  • PDF

Electrical Properties of Alcohol Vapor Sensors Based on Porous Silicon

  • Park, Kwang-Youl;Kang, Kyung-Suk;Kim, Seong-Jeen;Lee, Sang-Hoon;Park, Bok-Gil;Sung, Man-Young
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.16 no.12S
    • /
    • pp.1232-1236
    • /
    • 2003
  • In this work, we fabricated a gas-sensing device based on porous silicon(PS), and its C-V properties were investigated for sensing alcohol vapor. The structure of the sensor consists of thin Au/oxidized PS/PS/P-Si/Al, where the p-Si is etched anisotropically to be prepared into a membrane-shape. We used alcohol gases vaporized from different alcohol (or ethanol) solutions mixed with pure water at 36$^{\circ}C$, similarly with an alcohol breath measurement to check drunk driving. As the result, I-V curves showed typical tunneling property, and C-V curves were shaped like those of a MIS (metal-insulator-semiconductor) capacitor, where the capacitance in accumulation was increased with alcohol vapor concentration.

A Study on the Fabrication of LCVD System and Characteristics of Silicon Nitride Thin Film Deposited by the System (LCVD법을 이용한 박막성장장치의 제작 및 그 장치를 이용하여 제작한 Silicon Nitride 박막의 특성 연구)

  • 유동선;김일곤;이호섭;정광호
    • Journal of the Korean Vacuum Society
    • /
    • v.2 no.3
    • /
    • pp.368-373
    • /
    • 1993
  • LCVD법에 의한 박막성장장치를 제작하였다. 제작한 CO2 레이저는 CO2 : N2 : He이 1 : 1 : 8로 혼합된 가스를 사용하였으며 최대 출력은 60W였고 혼합가스의 유량이 20l/min, 방전전류 40mAdlfEo 50W의 비교적 안정된 출력을 얻을 수 있었다. 반응실의 기초 진공은 1$\times$10-6torr였으며 레이저를 기판에 수직 혹은 수평으로 조사할 수 있도록 설계하였다. 제작된 장치로 SiH4 및 NH3를 재료로 하여 실리콘 및 quartz 기판위에 silicon nitride 박막을 증착하였다. 박막 생장시 가스를 흘리는 방식보다 가스를 채워놓고 하는 방식이 낮은 레이저 출력하에서 균일한 박막을 얻는데 효율적이라는 것을 발견하였다. 출력 55W의 레이저를 실리콘 기판에 5분간 조사하였을 때 최대 두께1.5$mu extrm{m}$의 박막을 얻었으며 quartz 기판위에는 출력 4W, 조사시간 6분에서 두께가 약 1$\mu\textrm{m}$인 비교적 균질의 박막을 얻을 수 있었다. FT-IR 및 XPS 분석 결과 SiH4와 NH3의 혼합비가 1 : 12일 때 비교적 nitride화가 잘 된 박막이 얻어졌음을 알았다.

  • PDF

Etching-Bonding-Thin film deposition Process for MEMS-IR SENSOR Application (MEMS-IR SENSOR용 식각-접합-박막증착 기반공정)

  • Park, Yun-Kwon;Joo, Byeong-Kwon;Park, Heung-Woo;Park, Jung-Ho;Yom, S.S.;Suh, Sang-Hee;Oh, Myung-Hwan;Kim, Chul-Ju
    • Proceedings of the KIEE Conference
    • /
    • 1998.07g
    • /
    • pp.2501-2503
    • /
    • 1998
  • In this paper, the silicon-nitride membrane structure for IR sensor was fabricated through the etching and the direct bonding. The PTO layer as a IR detection layer was deposited on the membrane and its characteristics were measured. The attack of PTO layer during the etching of silicon wafer as well as the thermal isolation of the IR detection layer can be solved through the method of bonding/etching of silicon wafer. Because the PTO layer of c-axial orientation raised thermal polarization without polling, the more integration capability can be achieved. The surface roughness of the membrane was measured by AFM, the micro voids and the non-contacted area were inspected by IR detector, and the bonding interface was observed by SEM. The polarization characteristics and the dielectric characteristics of the PTO layer were measured, too.

  • PDF

Through Silicon Stack (TSS) Assembly for Wide IO Memory to Logic Devices Integration and Its Signal Integrity Challenges

  • Shin, Jaemin;Kim, Dong Wook
    • The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
    • /
    • v.24 no.2
    • /
    • pp.51-57
    • /
    • 2013
  • The current expanding mobile markets incessantly demands small form factor, low power consumption and high aggregate throughput for silicon-level integration such as memory to logic system. One of emerging solution for meeting this high market demand is 3D through silicon stacking (TSS) technology. Main challenges to bring 3D TSS technology to the volume production level are establishing a cost effective supply chain and building a reliable manufacturing processes. In addition, this technology inherently help increase number of IOs and shorten interconnect length. With those benefits, however, potential signal and power integrity risks are also elevated; increase in PDN inductance, channel loss on substrate, crosstalk and parasitic capacitance. This paper will report recent progress of wide IO memory to high count TSV logic device assembly development work. 28 nm node TSV test vehicles were fabricated by the foundry and assembled. Successful integration of memory wide IO chip with less than a millimeter package thickness form factor was achieved. For this successful integration, we discussed potential signal and power integrity challenges. This report demonstrated functional wide IO memory to 28 nm logic device assembly using 3D package architecture with such a thin form factor.

Nondestructive Measurement on Electrical Characteristics of Amorphous Silicon by Using the Laser Beam (레이저 빔을 이용한 비정질실리콘 전기적 특성의 비파괴 측정)

  • 박남천
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2000.11a
    • /
    • pp.36-39
    • /
    • 2000
  • A small electrical potential difference which appears on any solid body when subjected to illumination by a modulated light beam generated by laser is called photocharge voltage(PCV)[1,2]. This voltage is proportional to the induced change in the surface electrical charge and is capacitatively measured on various materials such as conductors, semiconductors, ceramics, dielectrics and biological objects. The amplitude of the detected signal depends on the type of material under investigation, and on the surface properties of the sample. In photocharge voltage spectroscopy measurements[3], the sample is illuminated by both a steady state monochromatic bias light and the pulsed laser. The monochromatic light is used to created a variation in the steady state population of trap levels in the surface and space charge region of semiconductor samples which does result in a change in the measured voltage. Using this technique the spatial variation of PCV can be utilized to evaluate the surface conditions of the sample and the variation of the PCV due to the monochromatic bias light are utilized to characterize the surface states. A qualitative analysis of the proposed measurement is present along with experimental results performed on amorphous silicon samples. The deposition temperature was varied in order to obtain samples with different structural, optical and electronic properties and measurements are related to the defect density in amorphous thin film.

  • PDF