• Journal of Sensor Science and Technology
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• v.31 no.4
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• pp.228-237
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• 2022

Two-dimensional (2D) nanomaterials have demonstrated the potential to replace silicon and compound semiconductors that are conventionally used in photodetectors. These materials are ultrathin and have superior electrical and optoelectronic properties as well as mechanical flexibility. Consequently, they are particularly advantageous for fabricating high-performance photodetectors that can be used for wearable device applications and Internet of Things technology. Although prototype photodetectors based on single microflakes of 2D materials have demonstrated excellent photoresponsivity across the entire optical spectrum, their practical applications are limited due to the difficulties in scaling up the synthesis process while maintaining the optoelectronic performance. In this review, we discuss facile methods to mass-produce 2D material-based photodetectors based on the exfoliation of van der Waals crystals into nanosheet dispersions. We first introduce the liquid-phase exfoliation process, which has been widely investigated for the scalable fabrication of photodetectors. Solution processing techniques to assemble 2D nanosheets into thin films and the optoelectronic performance of the fabricated devices are also presented. We conclude by discussing the limitations associated with liquid-phase exfoliation and the recent advances made due to the development of the electrochemical exfoliation process with molecular intercalants.

• Current Optics and Photonics
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• v.6 no.4
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• pp.367-374
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• 2022

A photodetector based on a reduced graphene oxide (RGO)/n-Si heterojunction with high responsivity, detectivity and fast response speed is presented. Here, we put forward a simple vacuum filtration method to prepare RGO film and transfer it onto an n-Si substrate to form an RGO/n-Si heterojunction. The experimental results show that the heterojunction has good rectification characteristics, and the response and recovery time are less than 0.31 s and 0.25 s, respectively. Under 470 nm light conditions at -2 V applied voltage, the responsivity and detectivity of the device are 65 mA/W and 4.02 × 10¹⁰ cmHz^1/2W^-1, respectively. The simple preparation process and good performance of the RGO/n-Si heterojunction make it a promising material for photoelectric detection, especially in the near-ultraviolet band.

• Journal of Sensor Science and Technology
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• v.4 no.1
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• pp.3-8
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• 1995

n-ITO/p-PSL heterojunction photodetector have been fabricated on the Si wafer by using ITO(indium tin oxide) and PSL(porous silicon layer). They were anodized selectively by using silicon nitride and Ni-Cr/Au and were passivated by using ITO as well as being isolated by using mesa structure. With white light from 0 to 3000 Lux, the photocurrent varied linearly with incident light intensity. The reverse characteristics of fabricated devices were very stable up to a bias voltage of -40V and dark current density was about $40nA/mm^{2}$. When the device was exposed by Xe lamp whose wavelength range from 400nm to 1100nm, the maximum photo responsivity was about 0.6A/W between 600 and 700nm. Variation of the characteristics of fabricated devices after 5 weeks was negligible.

• The Journal of the Korea institute of electronic communication sciences
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• v.9 no.5
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• pp.555-560
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• 2014

In order to improve spectrum sensitivity of photodiode for detection of the laser wavelength at 850 nm ~ 1000 nm of near-infrared band, this study has produced silicon-based photodiode whose area is $5000{\mu}m{\times}2000{\mu}m$, and the thickness is $280{\mu}m$. It was packed by the TO-5 type. The electrical properties of the dark currents have valued of approximately 0.1 nA for 5 V reverse bias, while the capacitance showed 32.5 pF at frequency range of 1 kHz and about 32.4 pF at the range of 200 kHz for 0 V. In addition, the rising time of output signal was as fast response as 20.92 ns for 10V. For the optical properties, the best spectrum sensitivity was 0.57 A/W for 890 nm, while it was relatively excellent value of 0.37 A/W for 1,000 nm. Over all, there were good spectrum sensitivity for this diode over the range of 870 ~ 920 nm.

• Journal of Sensor Science and Technology
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• v.14 no.2
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• pp.96-100
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• 2005

The planar Schottky diodes were fabricated and modeled to probe the device applicability of the cracked GaN epitaxial layer on a (111) silicon substrate. On the unintentionally n-doped GaN grown on silicon, we deposited Ti/Al/Ni/Au as the ohmic metal and Pt as the Schottky metal. The ohmic contact achieved a minimum contact resistivity of $5.51{\times}10.5{\Omega}{\cdot}cm^{2}$ after annealing in an $N_{2}$ ambient at $700^{\circ}C$ for 30 sec. The fabricated Schottky diode exhibited the barrier height of 0.7 eV and the ideality factor was 2.4, which are significantly lower than those parameters of crack free one. But in photoresponse measurement, the diode showed the peak responsivity of 0.097 A/W at 300 nm, the cutoff at 360 nm, and UV/visible rejection ratio of about $10^{2}$. The SPICE(Simulation Program with Integrated Circuit Emphasis) simulation with a proposed model, which was composed with one Pt/GaN diode and three parasitic diodes, showed good agreement with the experiment.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.269-269
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• 2016

최근, 플렉서블 광전자소자 제작 기술의 눈부신 발전으로, 기존의 평면형 이미지 센서가 가지고 있는 여러가지 한계를 극복하기 위해 곡면형 이미지 센서 제작에 대한 다양한 연구가 진행되고 있다. 리소그래피, 물질 성장, 도포, 에칭 등의 대부분의 반도체 공정은 평면 기판에 기반한 공정 방법으로 곡면 구조의 이미지 센서를 제작하기에는 많은 어려움이 있다. 본 연구에서는 곡면형 이미지 센서의 제작을 위해 곡면 구조 위에서의 직접적인 공정 대신 평면 기판에서 단결정 실리콘을 이용해 전사 인쇄가 가능하고 수축이 가능한 초박막 구조의 이미지 센서를 제작한 후 이를 떼어내는 방식을 이용하였다. 이온 주입 및 건식 식각 공정을 통해 평면 SOI (Silicon on Insulator) 기판 위에 단일 광다이오드 배열 형태의 소자를 제작한 후 수 차례의 폴리이미드 층 도포 및 스퍼터링을 통한 금속 배선 공정을 통해 초박막 형태의 광 검출기를 완성한다. 이후 습식 식각 및 폴리디메틸실록산(PDMS) 스탬프를 이용한 전사 인쇄 공정을 통해 기판으로부터 디바이스를 분리하여 변형 가능한 형태의 이미지 센서를 얻을 수 있다. 이러한 박막형 이미지 센서는 유연한 재질로 인해 수축 및 팽창, 구부림과 같은 구조적 변형이 가능하게 되어 겹눈 구조 카메라, 튜너블 카메라 등과 같이 기존 방식의 반도체 공정으로는 구현할 수 없었던 다양한 이미징 시스템 개발에 적용될 수 있을 것으로 기대된다.

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.75-75
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• 2015

Strong interactions between electromagnetic radiation and electrons at metallic interfaces or in metallic nanostructures lead to resonant oscillations called surface plasmon resonance with fascinating properties: light confinement in subwavelength dimensions and enhancement of optical near fields, just to name a few [1,2]. By utilizing the properties enabled by geometry dependent localization of surface plasmons, metal photonics or plasmonics offers a promise of enabling novel photonic components and systems for integrated photonics or sensing applications [3-5]. The versatility of the nanoplasmonic platform is described in this talk on three folds: our findings on an enhanced ultracompact photodetector based on nanoridge plasmonics for photonic integrated circuit applications [3], a colorimetric sensing of miRNA based on a nanoplasmonic core-satellite assembly for label-free and on-chip sensing applications [4], and a controlled fabrication of plasmonic nanostructures on a flexible substrate based on a transfer printing process for ultra-sensitive and noise free flexible bio-sensing applications [5]. For integrated photonics, nanoplasmonics offers interesting opportunities providing the material and dimensional compatibility with ultra-small silicon electronics and the integrative functionality using hybrid photonic and electronic nanostructures. For sensing applications, remarkable changes in scattering colors stemming from a plasmonic coupling effect of gold nanoplasmonic particles have been utilized to demonstrate a detection of microRNAs at the femtomolar level with selectivity. As top-down or bottom-up fabrication of such nanoscale structures is limited to more conventional substrates, we have approached the controlled fabrication of highly ordered nanostructures using a transfer printing of pre-functionalized nanodisks on flexible substrates for more enabling applications of nanoplasmonics.

• Journal of the Semiconductor & Display Technology
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• v.22 no.3
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• pp.101-105
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• 2023

Organic photo Diodes (OPDi) give multiple advantages in the growing interest of the flexible optoelectronic devices. Organic semiconductors are freeform as they can deposit on any substrate, so it could be flexible. But the inorganic material photodiodes (PDs) are usually fabricated on silicon wafers which are solid. So, normally PDs are inflexible. By those reasons, we decided to make the vacuum deposited small molecule OPDi. We have investigated the OPDi's J-V characteristic by changing the thickness of p-type layer of OPDi. This device consists of indium-tin-oxide (ITO) / 2,3:6,7-dibenzanthracene (pentacene) / buckminsterfullerene (C60) / aluminum (Al). Its J-V characteristics were measured in the probe station(4156C) that can give dark condition while measuring. And for the luminance characteristics, the photocurrent was measured with the bright halogen lamp and a probe station.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.18 no.6
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• pp.1407-1412
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• 2014

In order to improve spectrum sensitivity of photodiode for detection of the laser at 850 nm ~ 1000 nm of near-infrared wavelength band, this study has produced silicon-based fast film PIN photodiode and analyzed electrical and optical properties. The manufactured device is packaged in TO-18 type. The electrical properties of the dark currents both Anode 1 and Anode 2 have valued of approximately 0.055 nA for 5 V reverse bias, while the capacitance showed 19.5 pF at frequency range of 1 kHz and about 19.8 pF at the range of 200 kHz for 0 V. In addition, the rising time of output signal was verified to have fast response time of about 30 ns for 10 V. For the optical properties, the best spectrum sensitivity was 0.66 A/W for 880 nm, while it was relatively excellent value of 0.45 A/W for 1,000 nm.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.268-268
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• 2016

Chemical sensors have attracted much attention due to their various applications such as agriculture product, cosmetic and pharmaceutical components and clinical control. A conventional chemical and biological sensor is consists of fluorescent dye, optical light sources, and photodetector to quantify the extent of concentration. Such complicated system leads to rising cost and slow response time. Until now, the most contemporary thin film transistors (TFTs) are used in the field of flat panel display technology for switching device. Some papers have reported that an interesting alternative to flat panel display technology is chemical sensor technology. Recent advances in chemical detection study for using TFTs, benefits from overwhelming progress made in organic thin film transistors (OTFTs) electronic, have been studied alternative to current optical detection system. However numerous problems still remain especially the long-term stability and lack of reliability. On the other hand, the utilization of metal oxide transistor technology in chemical sensors is substantially promising owing to many advantages such as outstanding electrical performance, flexible device, and transparency. The top-gate structure transistor indicated long-term atmosphere stability and reliability because insulator layer is deposited on the top of semiconductor layer, as an effective mechanical and chemical protection. We report on the fabrication of InGaZnO TFTs with silver nanowire as the top gate electrode for the aim of chemical materials detection by monitoring change of electrical properties. We demonstrated that the improved sensitivity characteristics are related to the employment of a unique combination of nano materials. The silver nanowire top-gate InGaZnO TFTs used in this study features the following advantages: i) high sensitivity, ii) long-term stability in atmosphere and buffer solution iii) no necessary additional electrode and iv) simple fabrication process by spray.