• 제목/요약/키워드: Silicon Wet Etching

검색결과 138건 처리시간 0.036초

광 포획 태양전지 모듈 커버용 유리기판 기술 현황 (Current status of light trapping in module cover glass for PV module)

  • 박형식;정재성;신명훈;김선보;이준신
    • Current Photovoltaic Research
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    • 제4권3호
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    • pp.119-123
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    • 2016
  • We discussed various cover glass substrates available for photovoltaic (PV) modules, and investigated the fabrication methods of light trapping structures for the efficiency enhancement of PV modules: wet and dry etching or laser and direct patternings. We also introduced the analysis of haze at etched glass surfaces as a function of wavelength and also presented a anti-reflection coating technology for PV module.

Piezo-electrically Actuated Micro Corner Cube Retroreflector (CCR) for Free-space Optical Communication Applications

  • Lee, Duk-Hyun;Park, Jae-Y.
    • Journal of Electrical Engineering and Technology
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    • 제5권2호
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    • pp.337-341
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    • 2010
  • In this paper, an extremely low voltage operated micro corner cube retroreflector (CCR) was fabricated for free-space optical communication applications by using bulk silicon micromachining technologies. The CCR was comprised of an orthogonal vertical mirror and a horizontal actuated mirror. For low voltage operation, the horizontal actuated mirror was designed with two PZT cantilever actuators, torsional bars, hinges, and a mirror plate with a size of $400{\mu}m{\times}400{\mu}m$. In particular, the torsional bars and hinges were carefully simulated and designed to secure the flatness of the mirror plate by using a finite element method (FEM) simulator. The measured tilting angle was approximately $2^{\circ}$ at the applied voltage of 5 V. An orthogonal vertical mirror with an extremely smooth surface texture was fabricated using KOH wet etching and a double-SOI (silicon-on-insulator) wafer with a (110) silicon wafer. The fabricated orthogonal vertical mirror was comprised of four pairs of two mutually orthogonal flat mirrors with $400{\mu}m4 (length) $\times400{\mu}m$ (height) $\times30{\mu}m$ (thickness). The cross angles and surface roughness of the orthogonal vertical mirror were orthogonal, almost $90^{\circ}$ and 3.523 nm rms, respectively. The proposed CCR was completed by combining the orthogonal vertical and horizontal actuated mirrors. Data transmission and modulation at a frequency of 10 Hz was successfully demonstrated using the fabricated CCR at a distance of approximately 50 cm.

불산-오존-희석 암모니아수 세정에 의한 실리콘 웨이퍼 표면의 미세입자 제거 (Particle Removal on Silicon Wafer Surface by Ozone-HF-NH4OH Sequence)

  • 이건호;배소익
    • Korean Chemical Engineering Research
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    • 제45권2호
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    • pp.203-207
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    • 2007
  • 불산과 오존 세정 시 실리콘 웨이퍼 표면의 미세입자를 효과적으로 제거할 수 있는 세정 방법에 대하여 연구하였다. 불산의 농도가 0.3 vol% 이상이 되어야 미세입자가 제거 되었으며, 초음파가 인가된 오존수를 사용 시 제거 효율은 증가되었다. 오존과 불산 세정 단계 이후에 추가로 극미량의(0.01 vol%) 희석 암모니아수 세정을 하면 미세입자가 99%이상 제거됨을 확인하였다. 이는 암모니아수에 의한 웨이퍼 표면의 미세 에칭 효과와 알칼리 영역에서의 재흡착 방지 효과가 동시에 작용함에 기인된다고 보인다. 한편, 불산-오존-희석 암모니아수 세정은 통상의 SC-1 세정과 비교할 때 표면 미세 거칠기가 개선되는 경향을 보였다. 불산-오존-희석 암모니아수 세정은 상온에서도 미세입자를 효과적으로 제거할 수 있는 세정 방법으로, 고온 공정 및 과다한 화학액을 사용하는 기존 습식세정의 대안으로서 기대된다.

마이크로웨이브로 증폭된 습식 에칭에 의한 표면 개질 마이카의 제조와 특성 (Preparation and Characterization of Surface Modified Mica by Microwave-enhanced Wet Etching)

  • 전상훈;권순상;김덕희;심민경;최영진;한상훈
    • 대한화장품학회지
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    • 제34권4호
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    • pp.269-274
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    • 2008
  • 본 연구를 통해 반도체 산업에서 유래된 마이크로웨이브 증폭 에칭기술(MEE)을 이용하여, 마이카의 표면 구조를 변화시키고 오일 흡유량을 조절할 수 있었다. 마이크로웨이브 에너지가 마이카에 조사되면, 마이카 표면이 몇 분 이내에 에칭이 된다. 에칭의 결과로 마이카의 오일 흡유량이 증가되고, 마이카 $SiO_2$층의 표면 변화에 의해 백색도가 증가한다. 추가적으로, 땀을 흡수한 이후에도 높은 백색도가 유지된다. 마이카의 표면구조의 변화는 불산에 슬러리화된 마이카에 마이크로웨이브 조사를 통해서 이루어졌다. 에칭의 정도는 산의 농도, 조사 시간, 조사 에너지의 양, 슬러리의 농도에 의해 조절되었다. 에칭된 마이카의 표면 구조는 '달' 표면 모양과 유사하게 보인다. 표면적과 거칠기 등의 특성은 Brunauer-Emmett-Teller (BET), atomic force microscopy (AFM), scanning electron microscopy (SEM), Spectrophotometer, goniophometer로 측정되었다.

나노 구조의 패턴을 갖는 n-type GaN 기판을 이용한 380 nm UV-LED의 광 추출 효율 개선 (Improvement in Light Extraction Efficiency of 380 nm UV-LED Using Nano-patterned n-type Gan Substrate)

  • 백광선;조민성;이영곤;;송영호;김승환;김재관;전성란;이준기
    • 한국재료학회지
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    • 제21권5호
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    • pp.273-276
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    • 2011
  • Ultraviolet (UV) light emitting diodes (LEDs) were grown on a patterned n-type GaN substrate (PNS) with 200 nm silicon-di-oxide (SiO2) nano pattern diameter to improve the light output efficiency of the diodes. Wet etched self assembled indium tin oxide (ITO) nano clusters serve as a dry etching mask for converting the SiO2 layer grown on the n-GaN template into SiO2 nano patterns by inductively coupled plasma etching. PNS is obtained by n-GaN regrowth on the SiO2 nano patterns and UV-LEDs were fabricated using PNS as a template. Two UV-LEDs, a reference LED without PNS and a 200 nm PNS UV-LEDs were fabricated. Scanning Electron microscopy (SEM), Transmission Electron Microscopy (TEM), X-Ray Diffraction (XRD), Photoluminescence (PL) and Light output intensity- Input current- Voltage (L-I-V) characteristics were used to evaluate the ITO-$SiO_2$ nanopattern surface morphology, threading dislocation propagation, PNS crystalline property, PNS optical property and UVLED device performance respectively. The light out put intensity was enhanced by 1.6times@100mA for the LED grown on PNS compared to the reference LED with out PNS.

Fabrication of a robust, transparent, and superhydrophobic soda-lime glass

  • Rahmawan, Yudi;Kwak, Moon-Kyu;Moon, Myoung-Woon;Lee, Kwang-Ryeol;Suh, Kahp-Yang
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2009년도 제38회 동계학술대회 초록집
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    • pp.86-86
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    • 2010
  • Micro- and nanoscale texturing and control of surface energy have been considered for superhydrophobicity on polymer and silicon. However these surfaces have been reported to be difficult to meet the robustness and transparency requirements for further applications, from self cleaning windows to biochip technology. Here we provided a novel method to fabricate a nearly superhydrophobic soda-lime glass using two-step method. The first step involved wet etching process to fabricate micro-sale patterns on soda-lime glass. The second step involved application of $SiO_x$-incorporated DLC to generate high intrinsic contact angle on the surface using chemical vapor deposition (CVD) process. To investigate the effect of surface roughness, we used both positive and negative micro-scale patterns on soda-limeglass, which is relatively hard for surface texturing in comparison to quartz or Pyrex glasses due to the presence of impurities, but cheaper. For all samples we tested the static wetting angle and transparency before and after 100 cycles of wear test using woolen steel. The surface morphology is observed using optical and scanning electron microscope (SEM). The results shows that negative patterns had a greater wear resistance while the hydrophobicity was best achieved using positive patterns having static contact angle up to 140 deg. with about 80% transparency. The overall experiment shows that positive patterns at etching time of 1 min shows the optimum transparency and hydrophobicity. The optimization of micro-scale pattern to achieve a robust, transparent, superhydrophobic soda-lime glass will be further investigated in the future works.

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다중 채널 전극의 제작 및 특성 평가 (Fabrication and Characterization of Multi-Channel Electrode Array (MEA))

  • 성락선;권광민;박정호
    • 대한전기학회논문지:시스템및제어부문D
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    • 제51권9호
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    • pp.423-430
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    • 2002
  • The fabrication and experimentation of multi-channel electrodes which enable detecting and recording of multi-site neuronal signals have been investigated. A multi-channel electrode array was fabricated by depositing 2000${\AA}$ thick Au layer on the 1000${\AA}$ thick Ti adhesion layer on a glass wafer. The metal paths were patterned by wet etching and passivated by depositing a PECVD silicon nitride insulation layer to prevent signals from intermixing or cross-talking. After placing a thin slice of rat cerebellar granule cell in the culture ring located in central portion of the multi-channel electrode plate, a neuronal signal from an electrode which is in contact with the cerebellar granule cell has been detected. It was found that the electrode impedance ranges 200㏀∼1㏁ and the impedance is not changed by cleaning with nitric acid. Also, the impedance is inversely proportion to the exposed electrode area and the cross-talk is negligible when the electrode spacing is bigger than 600$\mu\textrm{m}$. The amplitude and frequency of the measured action potential were 38㎷ and 2㎑, which are typical values. From the experimental results, the fabricated multi-channel electrode array proved to be suitable for multi-site neuronal signal detection for the analysis of a complicated cell network.

메탈 인쇄용 압전 헤드 제작 프로세스 연구 (Studies of Printing Head Fabrication Process For Mano Metal Printing System)

  • 유영석;김영재;심원철;박창성;정재우;오용수
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2006년도 제37회 하계학술대회 논문집 C
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    • pp.1623-1624
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    • 2006
  • It is a paper for design, manufacture and estimation of industry inkjet head. Simulations for Actuator, Ink flow and Ejection are executed for securing design ability. Relations between droplet and properties of ink are explained closely through simulation for nozzle. Actually, two silicon plates are made by dry and wet etching and directly bonded. PZT materials is attached on the bended ink flow part and cut to $540{\mu}m$ interval by dicing saw. Actuator was seen variation within 10% between simulation and actual head. Through the ejection estimation, it is shown that stabilized driving voltages change according to viscosity and surface tension of metal ink. Using the metal ink of viscosity of 4.8 cps and surface tension of 0.025 N/m, it is possible to eject the stable droplets with 5m/s, 20 pl, 5 kHz.

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Fabrication of sub-micron sized organic field effect transistors

  • 박성찬;허정환;김규태;하정숙
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2009년도 제38회 동계학술대회 초록집
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    • pp.84-84
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    • 2010
  • In this study, we report on the novel lithographic patterning method to fabricate organic-semiconductor devices based on photo and e-beam lithography with well-known silicon technology. The method is applied to fabricate pentacene-based organic field effect transistors. Owing to their solubility, sub-micron sized patterning of P3HT and PEDOT has been well established via micromolding in capillaries (MIMIC) and inkjet printing techniques. Since the thermally deposited pentacene cannot be dissolved in solvents, other approach was done to fabricate pentacene FETs with a very short channel length (~30nm), or in-plane orientation of pentacene molecules by using nanometer-scale periodic groove patterns as an alignment layer for high-performance pentacene devices. Here, we introduce the atomic layer deposition of $Al_2O_3$ film on pentacene as a passivation layer. $Al_2O_3$ passivation layer on OTFTs has some advantages in preventing the penetration of water and oxygen and obtaining the long-term stability of electrical properties. AZ5214 and ma N-2402 were used as a photo and e-beam resist, respectively. A few micrometer sized lithography patterns were transferred by wet and dry etching processes. Finally, we fabricated sub-micron sized pentacene FETs and measured their electrical characteristics.

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탐침과 시편의 위치를 역전시킨 주사 탐침 현미경용 다이아몬드 탐침의 제작 및 평가 (Design, Fabrication and Evaluation of Diamond Tip Chips for Reverse Tip Sample Scanning Probe Microscope Applications)

  • 김수길;;김진혁
    • 한국재료학회지
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    • 제34권2호
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    • pp.105-110
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    • 2024
  • Scanning probe microscopy (SPM) has become an indispensable tool in efforts to develop the next generation of nanoelectronic devices, given its achievable nanometer spatial resolution and highly versatile ability to measure a variety of properties. Recently a new scanning probe microscope was developed to overcome the tip degradation problem of the classic SPM. The main advantage of this new method, called Reverse tip sample (RTS) SPM, is that a single tip can be replaced by a chip containing hundreds to thousands of tips. Generally for use in RTS SPM, pyramid-shaped diamond tips are made by molding on a silicon substrate. Combining RTS SPM with Scanning spreading resistance microscopy (SSRM) using the diamond tip offers the potential to perform 3D profiling of semiconductor materials. However, damage frequently occurs to the completed tips because of the complex manufacturing process. In this work, we design, fabricate, and evaluate an RTS tip chip prototype to simplify the complex manufacturing process, prevent tip damage, and shorten manufacturing time.