• 대한기계학회논문집A
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• 제40권10호
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• pp.865-871
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• 2016

조직 공학에서는 전통적인 인공지지체 제작 방식인 가스 발포, 염 침출, 스폰지 복제 그리고 동결주조 법 등이 이용되고 있다. 하지만 다양한 공극 형태 및 크기를 가지고 있어서 세포 상호 작용 효과 및 충분한 기계적 특성에 한계가 있다. 그러나 열 용해 적층 법은 조직공학에서 폴리머 재료를 이용하여 다양한 3차원 인공지지체를 제작할 수 있는 가장 적절한 기술이다. 따라서 본 연구에서는 PCL 몰드를 제작하고 실리카와 알긴산 나트륨 염을 포함하는 세라믹 슬러리를 제조하여 몰드에 주입시켰으며, 1일 동안 자연 건조를 시켰다. 제작된 3차원 슬러리 몰드는 PCL 몰드의 제거 및 슬러리를 경화시키기 위해 $100^{\circ}C$의 오븐에서 2시간 열처리 되었고, 열처리 후에 $1100^{\circ}C$에서 소결되었다. 제작된 인공지지체는 주사전자현미경을 통해 관찰되었고, 압축 시험을 통해 알긴산 나트륨 염의 혼합량에 따른 인공지지체의 기계적 특성은 평가되었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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• pp.50-53
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• 2003

CMP (chemical mechanical polishing) process remained to solve several problems in deep sub-micron integrated circuit manufacturing process. especially consumables (polishing pad, backing film, slurry, pad conditioner), one of the most important components in the CMP system is the slurry. Among the composition of slurries (buffer solution, bulk solution, abrasive particle, oxidizer, inhibitor, suspension, antifoaming agent, dispersion agent), the abrasive particles are important in determining polish rate and planarization ability of a CMP process. However, the cost of abrasives is still very high. So, in order to reduce the high COO (cost of ownership) and COC (cost of consumables) in this paper, we have collected the silica abrasive powders by filtering after subsequent CMP process for the purpose of abrasive particle recycling. And then, we have studied the possibility of recycle of reused silica abrasive through the analysis of particle size and hardness. Also, we annealed the collected abrasive powders to promote the mechanical strength of reduced abrasion force. Finally, we compared the CMP characteristics between self-developed KOH-based silica abrasive slurry and original slurry. As our experimental results, we obtained the comparable removal rate and good planarity with commercial products. Consequently, we can expect the saving of high cost slurry.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2006년도 추계학술발표대회 및 제11회 신소재 심포지엄
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• pp.15.2-15.2
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• 2006

• 한국전기전자재료학회논문지
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• 제17권12호
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• pp.1296-1300
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• 2004

SnO$_2$ is one of the most suitable gas sensor materials. The microstructure and surface morphology of films must be controlled because the electrical and optical properties of SnO$_2$ films depend on these characteristics. The effects of chemical mechanical polishing(CMP) on the variation of morphology of SnO$_2$ films prepared by RF sputtering system were investigated. The commercially developed ceria-based oxide slurry, silica-based oxide slurry, and alumina-based tungsten slurry were used as CMP slurry. Non-uniformities of all slurries met stability standards of less than 5 %. Silica slurry had the highest removal rate among three different slurries, sufficient thin film topographies and suitable root mean square(RMS) values.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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• pp.335-338
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• 2003

Chemical mechanical polishing (CMP) process has been widely used to planarize dielectric layers, which can be applied to the integrated circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of in the defect-free inter-layer dielectrics (ILD). Especially, defects such as micro-scratch lead to severe circuit failure which affect yield. CMP slurries can contain particles exceeding $1\;{\mu}m$ in size, which could cause micro-scratch on the wafer surface. In this paper, we have studied aging effect the of CMP sin as a function of particle size. We prepared and compared the self-developed silica slurry by adding of abrasives before and after annealing. As our preliminary experiment results, we could be obtained the relatively stable slurry characteristics comparable to original silica slurry in the slurry aging effect.

• Geomechanics and Engineering
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• 제8권1호
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• pp.113-132
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• 2015

In this study, lime (L), silica fume (SF), and lime-silica fume (L-SF) mix have been used for stabilizing and considering their effects on the soft clay soil. The improvement technique adopted in this study includes improving the behaviour, of a square footing over soft clay through grouting the clay with a slurry of lime-silica fume before and after installation of the footing. A grey-colored densified silica fume is used. Three percentages are used for lime (2%, 4% and 6%) and three percentages are used for silica fume (2.5%, 5%, 10%) and the optimum percentage of silica fume is mixed with the percentages of lime. Several tests are made to investigate the soil behaviour after adding the limeand silica fume. For grouting the soft clay underneath and around the footing, a 60 ml needle was used as a liquid tank of the lime-silica fume mix. Slurried silica fume typically contains 40 to 60% silica fume by mass. Four categories were studied to stabilize soft clay before and after footing construction and for each category, the effectiveness of grouting was investigated; the effect of injection hole spacing and depth of grout was investigated too. It was found that when the soft clay underneath or around a footing is injected by a slurry of lime-silica fume, an increase in the bearing capacity in the range of (6.58-88)% is obtained. The footing bearing capacity increases with increase of depth of grouting holes around the footing area due to increase in L-SF grout. The grouting near the footing to a distance of 0.5 B is more effective than grouting at a distance of 1.0 B due to shape of shear failure of soft clay around the footing.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 A
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• pp.601-602
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• 2006

Chemical mechanical polishing (CMP) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, the cost of ownership and cost of consumables are relatively high because of expensive slurry. In this paper, we studied the mixed abrasive slurry(MAS). In order to save the costs of slurry, the original silica slurry was diluted by de-ionized water (DIW). And then, $ZrO_2$,$CeO_2$, and $MnO_2$ abrasives were added in the diluted slurry in order to promote the mechanical force of diluted slurry. We have also investigate the possibility of mixed abrasive slurry for the oxide CMP application.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 D
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• pp.2233-2234
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• 2006

Chemical mechanical polishing (CMP) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, the cost of ownership and cost of consumables are relatively high because of expensive slurry. In this paper, we studied the mixed abrasive slurry(MAS). In order to save the costs of slurry, the original silica slurry was diluted by de-ionized water (DIW). And then, $ZrO_2$, $CeO_2$,and $MnO_2$ abrasives were added in the diluted slurry in order to promote the mechanical force of diluted slurry. We have also investigate the possibility of mixed abrasive slurry for the oxide CMP application.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 D
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• pp.2235-2236
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• 2006

Chemical mechanical polishing (CMP) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, the cost of ownership and cost of consumables are relatively high because of expensive slurry. In this paper, we studied the mixed abrasive slurry(MAS). In order to save the costs of slurry, the original silica slurry was diluted by de-ionized water (DIW). And then, $ZrO_2$, $CeO_2$,and $MnO_2$ abrasives were added in the diluted slurry in order to promote the mechanical force of diluted slurry. We have also investigate the possibility of mixed abrasive slurry for the oxide CMP application.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 B
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• pp.1267-1268
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• 2006

Chemical mechanical polishing (CMP) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, the cost of ownership and cost of consumables are relatively high because of expensive slurry. In this paper, we studied the mixed abrasive slurry (MAS). In order to save the costs of slurry, the original silica slurry was diluted by do-ionized water (DIW). And then, $ZrO_2,CeO_2$, and $MnO_2$ abrasives were added in the diluted slurry in order to promote the mechanical force of diluted slurry. We have also investigate the possibility of mixed abrasive slurry for the oxide CMP application.