• 제목/요약/키워드: SiO gas

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Highly Ordered TiO2 nanotubes on pattered Si substrate for sensor applications

  • Kim, Do-Hong;Shim, Young-Seok;Moon, Hi-Gyu;Yoon, Seok-Jin;Ju, Byeong-Kwon;Jang, Ho-Won
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.66-66
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    • 2011
  • Anodic titanium dioxide (TiO2) nanotubes are very attractive materials for gas sensors due to its large surface to volume ratios. The most widely known method for fabrication of TiO2 nanotubes is anodic oxidation of metallic Ti foil. Since the remaining Ti substrate is a metallic conductor, TiO2 nanotube arrays on Ti are not appropriate for gas sensor applications. Detachment of the TiO2 nanotube arrays from the Ti Substrate or the formation of electrodes onto the TiO2 nanotube arrays have been used to demonstrate gas sensors based on TiO2 nanotubes. But the sensitivity was much lower than those of TiO2 gas sensors based on conventional TiO2 nanoparticle films. In this study, Ti thin films were deposited onto a SiO2/Si substrate by electron beam evaporation. Samples were anodized in ethylene glycol solution and ammonium fluoride (NH4F) with 0.1wt%, 0.2wt%, 0.3wt% and potentials ranging from 30 to 60V respectively. After anodization, the samples were annealed at $600^{\circ}C$ in air for 1 hours, leading to porous TiO2 films with TiO2 nanotubes. With changing temperature and CO concentration, gas sensor performance of the TiO2 nanotube gas sensors were measured, demonstrating the potential advantages of the porous TiO2 films for gas sensor applications. The details on the fabrication and gas sensing performance of TiO2 nanotube sensors will be presented.

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Characteristics of SiOx thin films deposited by atmospheric pressure chemical vapor deposition using a double discharge system

  • Park, Jae-Beom;Gil, El-Ri;Yeom, Geun-Yeong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.261-262
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    • 2011
  • 본 연구는 HMDS/$O_2$/He/Ar의 gas mixture를 이용하여 remote-type의 DBD source를 통한 APPECVD를 통한 SiOx 양질의 무기막 증착 공정을 개발하였다. 이때 기판에 바이어스를 인가 하거나 혹은 접지를 하여 대기압 플라즈마의 환경 내에서도 바이어스 효과를 확인할 수 있도록 double discharge system을 구축하였다. 그리고 이 double discharge system의 다양한 특성과 기존의 전형적인 DBD와 비교 하였을 때 어떠한 차이점을 가지는지에 대해서도 관찰하였다. 그리하여 전형적인 DBD system과 double discharge를 통해 증착된 SiOx 무기막의 특성을 역시 비교 관찰하였다. Gas mixture 중 HMDS의 유량이 증가함에 따라, 그리고 $O_2$ gas의 유량이 감소함에 따라 SiOx 무기막의 증착률은 감소하였다. 그러나, SiOx 무기막 내의 불순물들, 예를 들어, carbon 혹은 hydrogen 계열의 chemical bond에 대한 정성적인 양은 HMDS 의 유량이 증가하거나 혹은 $O_2$ gas의 양이 감소함에 따라 오히려 증가함을 관찰할 수 있었다. 그리고 기판에 바이어스를 인가하는 double discharge system을 사용하였을 경우, 같은 HMDS, $O_2$ gas 유량을 사용한 전형적인 DBD type의 증착 공정 보다 더 높은 공정 효율을 나타냄과 동시에 더 낮은 불순물 함량을 가짐을 알 수 있었다. 이러한 double discharge system을 통해 증착된 양질의 SiOx 무기막이 증착 되었음을 FT-IR을 통한 막질 분석을 통해 확인 할 수 있었다. 이러한 double discharge system의 증착 공정에 대한 긍정적인 효과들은 atmospheric discharge의 효율 향상에 따른 gas dissociation efficiency 증가와 이를 통한 HMDS 분해 및 산소와의 recombination 효율의 증가에 따른 결과로 사료된다.

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The Fabrication of an Applicative Device for Trench Width and Depth Using Inductively Coupled Plasma and the Bulk Silicon Etching Process

  • Woo, Jong-Chang;Choi, Chang-Auck;Kim, Chang-Il
    • Transactions on Electrical and Electronic Materials
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    • v.15 no.1
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    • pp.49-54
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    • 2014
  • In this study, we carried out an investigation of the etch characteristics of silicon (Si) film, and the selectivity of Si to $SiO_2$ in $SF_6/O_2$ plasma. The etch rate of the Si film was decreased on adding $O_2$ gas, and the selectivity of Si to $SiO_2$ was increased, on adding $O_2$ gas to the $SF_6$ plasma. The optical condition of the Si film with this work was 1,350 nm/min, at a gas mixing ratio of $SF_6/O_2$ (=130:30 sccm). At the same time, the etch rate was measured as functions of the various etching parameters. The X-ray photoelectron spectroscopy analysis showed the efficient destruction of oxide bonds by ion bombardment, as well as the accumulation of high volatile reaction products on the etched surface. Field emission auger electron spectroscopy analysis was used to examine the efficiency of the ion-stimulated desorption of the reaction products.

The Influence of Sintering Atmosphere on the Reduction Behaviour of Refractory Bricks and the Basic Properties of $UO_{2}$ Pellet

  • Lee, Seung-Jae;Kim, Kyu-Tae;Chung, Bum-Jin
    • The Korean Journal of Ceramics
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    • v.4 no.4
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    • pp.279-285
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    • 1998
  • The $UO_2$ pellets are usually sintered under hydrogen gas atmosphere. Hydrogen gas may cause unexpected early failure of the refractory bricks in the sintering furnace. In this work, nitrogen was mixed with hydrogen to investigate the effect of nitrogen gas on a failure machanism of the refractory bricks and on the microstructure of the $UO_2$ pellet. The hydrogen-nitrogen mixed gas experiments show that the larger nitrogen the mixed gas contains, the less the refractory materials are reduced by hydrogen. The weight loss measurements at $1400^{\circ}C$ for fire clay and chamotte refractories containing high content of $SiO_2$ indicate that the weight loss rate for the mixed gas is about half of that for the hydrogen gas. Based on the thermochemical analyses, it is proposed that the weight loss is caused by hydrogen-induced reduction of free $SiO_2$ and/or $SiO_2$ bonded to $Al_2O_3$ in the fire clay and chamotte refractories. However, the retardation of the hydrogen-induced $SiO_2$ reduction rate under the mixed gas atmosphere may be due to the reduction of the surface reaction rate between hydrogen gas and refractory materials in proportion to volume fraction of nitrogen gas in the mixed gas. On the other hand, the mixed gas experiments show that the test data for $UO_2$ pellet still meet the related specification values, even if there exists a slight difference in the pellet microstructural parameters between the cases of the mixed gas and the hydrogen gas.

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Effect of Ambient Gas to Growth of SiO2 Nanowires by Vapor Evaporation Method (기상휘발법에 의한 이산화규소 나노와이어의 성장에 미치는 가스의 영향)

  • Rho Dae-Ho;Kim Jae-Soo;Byun Dong-Jin;Lee Jae-Hoon;Yang Jae-Woong;Kim Na-Ri
    • Korean Journal of Materials Research
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    • v.15 no.5
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    • pp.323-333
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    • 2005
  • Effects of gases to growth of $SiO_2$ nanowires were characterized. $N_2$, Ar, and $O_2$ gas's effect were determined. $SiO_2$ nanowires growth scheme was varied by kind and flow rates of gases because of amounts of $O_2$. Flow rates of gases and kind of substrates affected nanowires' diameters, lengths and morphologies of grown nano wires. With increasing flow rates of gases, nanowire's diameter increased because of additional VS and SLS reactions. By TEM characterization, We knows that, grown $SiO_2$ nanowires on Si substrate showed two shell structures. These shapes of nanowires were formed by reaction of additional SLS growth. Grown $SiO_2$ nanowires showed blue luminescence by PL characterization These Blue luminescence was due to quantum confinement effect and oxygen vacancies in the nanowires.

Studies for Improvement in SiO2 Film Property for Thin Film Transistor (박막트랜지스터 응용을 위한 SiO2 박막 특성 연구)

  • Seo, Chang-Ki;Shim, Myung-Suk;Yi, Junsin
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.17 no.6
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    • pp.580-585
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    • 2004
  • Silicon dioxide (SiO$_2$) is widely used as a gate dielectric material for thin film transistors (TFT) and semiconductor devices. In this paper, SiO$_2$ films were grown by APCVD(Atmospheric Pressure chemical vapor deposition) at the high temperature. Experimental investigations were carried out as a function of $O_2$ gas flow ratios from 0 to 200 1pm. This article presents the SiO$_2$ gate dielectric studies in terms of deposition rate, refrative index, FT-IR, C-V for the gate dielectric layer of thin film transistor applications. We also study defect passivation technique for improvement interface or surface properties in thin films. Our passivation technique is Forming Gas Annealing treatment. FGA acts passivation of interface and surface impurity or defects in SiO$_2$ film. We used RTP system for FGA and gained results that reduced surface fixed charge and trap density of midgap value.

Synthesis and Sinteirng of $MoSi_2$ by SHS Process (SHS법에 의한 고온발열체용 $MoSi_2$의 합성 및 소결)

  • 이승재;장윤식;김인술;박홍채;오기동
    • Journal of the Korean Ceramic Society
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    • v.32 no.9
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    • pp.1085-1091
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    • 1995
  • Molybdenum disilicide (MoSi2) was synthesized from Mo, MoO3, Si and Al powders by self-propagating high temperature synthesis (SHS). The effect of processing parameters such as Mo/MoO3 molar ratio, Ar gas pressure in the reactor and pressing pressure of compacts in synthesis of MoSi2 were investigated. h-MoSi2 was transformed into t-MoSi2 with increasing the Mo/MoO3 mole ratio, and only t-MoSi2 phase was identified above 3.5 : 1 (molar ratio). The synthesized phases did not change with the variation of Ar gas pressure and pressing pressure of compacts. It was found that the combustion temperature was above 2,50$0^{\circ}C$. The products were separated into MoSi2 (s) and $\alpha$-Al2O3 by the difference of their specific grativities. Bending strength, hardness and density of sintered specimen exhibited 82 MPa, 5.368 GPa and 5.43 g/㎤, respectively.

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Effect of Alumina Content on the Hot Corrosion of SiC by NaCl and Na2SO4 (NaCl과 Na$_2$SO$_4$에 의한 SiC 고온 부식에 미치는 Alumina 첨가량의 영향)

  • 이수영;고재웅;김해두
    • Journal of the Korean Ceramic Society
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    • v.28 no.8
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    • pp.626-634
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    • 1991
  • The specimens for the corrosion test were made by hot-pressing of SiC power with 2 wt% Nl2O3 and 10wt% Al2O3 additions at 200$0^{\circ}C$ and 205$0^{\circ}C$. The specimens were corroded in 37 mole% NaCl and 63 mole% Na2SO4 salt mixture at 100$0^{\circ}C$ up to 60 min. SiO2 layer was formed on SiC and then this oxide layer was dissolved by Na2O ion in the salt mixture. The rate of corrosion of the specimen containing 10 wt% Al2O3 was slower than that of the specimen containing 2 wt% Al2O3. This is due to the presence of continuous grain boundary phase in the specimen containing 10 wt% Al2O3. The oxidation of SiC produced gas bubbles at the SiC-SiO2 interface. The rate of corrosion follows a linear rate law up to 50 min. and then was accelerated. This acceleration is due to the disruption oxide layer by the gas evolution at SiC-SiO2 interface. Pitting corrosion has found at open pores and grain boundaries.

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Effect of Post-Metallization Anneal (PMA) on Interface Trap Density of Si-$SiO_2$ (금속후 어닐링 방법이 Si-$SiO_2$ 계면 전하 농도에 미치는 영향)

  • Jung, Jong-Wan
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.11a
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    • pp.157-158
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    • 2007
  • Effects of post-metallization anneal (PMA) on interface trap characteristics of Si-$SiO_2$ are studied. The conventional PMA method utilizes forming gas anneal, where 10% hydrogen in nitrogen atmosphere is used. A new PMA method utilizes hydrogen rich PECVD- silicon nitride $(SiN_x)$ film as a hydrogen diffusion source and a out-diffusion blocking layer. It can be shown through charge pumping current measurement that the new PMA is indeed effective to decrease Si-$SiO_2$ interface trap density.

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The Influence of Support on Gas Mask Cobalt Catalysts for Low Temperature CO Oxidation (방독마스크용 코발트 촉매의 저온 일산화탄소 산화반응에서 지지체의 영향)

  • Kim, Deog-Ki;Kim, Bok-Ie;Shin, Chae-Ho;Shin, Chang-Sub
    • Journal of the Korean Society of Safety
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    • v.21 no.2 s.74
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    • pp.35-45
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    • 2006
  • Cobalt catalysts for gas mask loaded on various supports such as $Al_{2}O_{3},\;TiO_{2}$, AC(activated carbon) and $SiO_{2}$ were used to examine influences of calcination temperatures and reaction temperatures for CO oxidation. $Co(NO_{3})_2{\cdot}6H_{2}O$ was used as cobalt precursor and the catalysts were prepared by incipient wetness impregnation. The catalysts were characterized using XRD, TGA/DTA, TEM, $N_{2}$ sorption, and XPS. For the catalytic activity, support was in the order of ${\gamma}-Al_{2}O_{3}>TiO_{2}>SiO_{2}>AC\;and\;Al_{2}O_{3}$. The catalytic activity at lower temperature than $80^{\circ}C$ showed that with the increase of reaction temperature, cobalt catalysts on ${\gamma}-Al_{2}O_{3},\;TiO_{2},\;AC\$ has the negative activation energy but that of $SiO_{2}$ was positive.