Fabrication Process and Characterization of High Thermal Conductivity-Low CTE SiCp/Al Metal Matrix Composites for Electronic Packaging Applications (전자패키징용 고열전도도-저열팽창계수 SiCp/Al 금속복합재료의 제조공정 및 특성평가)
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- Proceedings of the Korean Society For Composite Materials Conference
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- 2000.04a
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- pp.190-194
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- 2000