• New & Renewable Energy
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• v.16 no.4
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• pp.76-82
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• 2020

Soiling on the surface of a PV module reduces the amount of light reaching the solar cells, decreasing power performance. The performance of the PV module is generally restored after contaminants on the module surface are washed away by rain, but it accumulates at the bottom of the module owing to the thickness of the module frame, causing an output mismatch on the PV module. Since PV modules are usually installed horizontally or vertically outdoors, soiling can occur at the bottom of the PV module, depending on the installation direction due to external environmental factors. This paper is analyzed the output characteristics of a PV module considering its installation direction and the soiling area. The soiling was simulated to use transparent films with 5% transmittance, and the transmission film was attached to the bottom part of the PV module horizontally and vertically. When the soiling area was 33% of the string at the bottom of the PV module, the power output decreased similarly regardless of installation direction. However, when the soiling area was 66% of the string at the bottom of the PV module, it was confirmed that the output performance decreased sharply when installed vertically rather than horizontally.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.37 no.4
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• pp.400-406
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• 2024

Next-generation wide-bandgap semiconductors such as SiC, GaN, and Ga2O3 are being considered as potential replacements for current silicon-based power devices due to their high mobility, larger size, and production of high-quality wafers at a moderate cost. In this study, we investigate the gradual modulation of chemical composition in multi-stacked metal oxide semiconductor thin films to enhance the performance and bias stability of thin-film transistors (TFTs). It demonstrates that adjusting the Ga ratio in the indium gallium oxide (IGO) semiconductor allows for precise control over the threshold voltage and enhances device stability. Moreover, employing multiple deposition techniques addresses the inherent limitations of solution-processed amorphous oxide semiconductor TFTs by mitigating porosity induced by solvent evaporation. It is anticipated that solution-processed indium gallium oxide (IGO) semiconductors, with a Ga ratio exceeding 50%, can be utilized in the production of oxide semiconductors with wide band gaps. These materials hold promise for power electronic applications necessitating high voltage and current capabilities.

• Journal of the Korean Society of Radiology
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• v.5 no.5
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• pp.283-287
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• 2011

In this study, fine $Gd_2O_2S$:Tb powder was synthesized by using a low temperature solution-combustion method for a high-resolution digital x-ray imaging detector. From the fabricated phosphor power, the fine scintillator films was fabricated by particle sedimentation method and was investigated the luminescent property. From the experimental results of relative light output as a function of terbium concentration, the highest luminescent efficiency has at 5 wt% Tb concentration, and luminescent intensity decreased rapidly according to quenching effect about higher Tb concentration. Also, the relative light output of $270{\mu}m$-$Gd_2O_2S$:Tb film has 2945 pC/$cm^2$/mR. And light intensity was saturated at higher film thickness. Finally, to evaluate an image acquisition performance of fabricated phosphor, images were obtained by using commercial CMOS sensor and measured the MTF, NPS, and DQE. DQE(0 lp/mm) of fine phosphor film has 37%. But, DQE improvement of fine phosphor film is possible by resolving problem of film fabrication process and has a significant potential in the application of digital radiation imaging system later.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.23-23
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• 2009

GaN-based nitride semiconductors have attracted considerable attention in high-brightness light-emitting-diodes (LEDs) and laser diodes (LDs) covering from green to ultraviolet spectral range. LED and LD heterostructures are usually grown on (0001)-$Al_2O_3$. The large lattice mismatch between $Al_2O_3$ substrates and the GaN layers leads to a high density of defects(dislocations and stacking faults). Moreover, Ga and N atoms are arranged along the polar [0001] crystallographic direction, which leads to spontaneous polarization. In addition, in the InGaN/GaN MQWs heterostructures, stress applied along the same axis can also give rise to piezoelectric polarization. The total polarization, which is the sum of spontaneous and piezoelectric polarizations, is aligned along the [0001] direction of the wurtzite heterostructures. The change in the total polarization across the heterolayers results in high interface charge densities and spatial separation of the electron and hole wave functions, redshifting the photoluminescence peak and decreasing the peak intensity. The effect of polarization charges in the GaN-based heterostructures can be eliminated by growing along the non-polar [$11\bar{2}0$] (a-axis) or [$1\bar{1}00$] (m-axis) orientation instead of thecommonly used polar [0001] (c-axis). For non-polar GaN growth on non-polar substrates, the GaN films have high density of planar defects (basal stacking fault BSFs, prismatic stacking fault PSFs), because the SFs are formed on the basal plane (c-plane) due to their low formation energy. A significant reduction in defect density was recently achieved by applying blocking layer such as SiN, AlN, and AlGaN in non-polar GaN. In this work, we were performed systematic studies of the defects in the nonpolar GaN by conventional and high-resolution transmission electron microscopy.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.5-5
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• 2009

Thin-film-transistors (TFTs) that can be prepared at low temperatures have attracted much attention because of the great potential for transparent and flexible electronics. One of the mainstreams in this field is the use of organic semiconductors such as pentacene. But device performance of the organic TFTs is still limited due to low field-effect mobility and rapid degradation after exposing to air. Alternative approach is the use of amorphous oxide semiconductors as a channel. Amorphous oxide semiconductors (AOSs) based TFTs showed the fast technological development, because AOS films can be fabricated at room temperature and exhibit the possibility in application like flexible display, electronic paper, and larges solar cells. Among the various AOSs, a-IGZO has lots of advantages because it has high channel mobility, uniform surface roughness and good transparency. [1] The high mobility is attributed to the overlap of spherical s-orbital of the heavy post-transition metal cations. This study demonstrated the effect of the variation in channel thickness from 30nm to 200nm on the TFT device performance. When the thickness was increased, turn-on voltage and subthreshold swing was decreased. The a-IGZO channels and source/drain metals were deposited with shadow mask. The a-IGZO channel layer was deposited on $SiO_2$/p-Si substrates by RF magnetron sputtering, where RF power is 150W. And working pressure is 3m Torr, at $O_2/Ar$ (2/28 sccm) atmosphere. The electrodes were formed with electron-beam evaporated Ti (30 nm) and Au (70 nm) bilayer. Finally, Al (150nm) as a gate metal was thermal-evaporated. TFT devices were heat-treated in a furnace at 250 $^{\circ}C$ and nitrogen atmosphere for 1hour. The electrical properties of the TFTs were measured using a probe-station. The TFT with channel thickness of 150nm exhibits a good subthreshold swing (SS) of 0.72 V/decade and on-off ratio of $1{\times}10^8$. The field effect mobility and threshold voltage were evaluated as 7.2 and 8 V, respectively.

• Journal of the Korean Society of Radiology
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• v.3 no.2
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• pp.11-16
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• 2009

Mercury Iodide as good sensitivity at radiation and has an easy peculiarity that operates at low voltage for other photoconductors(a-Se, a-Si, Ge, etc) Based on this characteristic, we studied about an efficiency of the digital x-ray detector in acccordance with the thickness of photoconductor. To solve the problem that is difficult to make a large area film using PVD(Physical Vapor Deposition)method, we used a PIB(Particle In Binder)method. To make a binder paste, we used a PVB(Polyvinylbutyral) as a binder and a DGME(Diethylene Glycol Monobutyl Ether), DGMEA(Diethylene Glycol Monobutyl Ether Acetate) as a solvent. Using this binder paste, we made a polycrystal mercury iodide film that has an each thickness. To evaluate the electrical properties of this films, we measured a darkcurrent, sensitivity and SNR(Signal to Noise Ratio). Mercury iodide film of the 200um thickness has good electrical properties as a result of the measurement. From this result there is a good chance that replace the existing a-Se(Amnorphous seleinum; a-se) with the mercury iodide.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.62-62
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• 2008

As micro-system move toward higher speed and miniaturization, requirements for embedding the passive components into printed circuit boards (PCBs) grow consistently. They should be fabricated in smaller size with maintaining and even improving the overall performance. Miniaturization potential steps from the replacement of surface-mount components and the subsequent reduction of the required wiring-board real estate. Among the embedded passive components, capacitors are most widely studied because they are the major components in terms of size and number. Embedding of passive components such as capacitors into polymer-based PCB is becoming an important strategy for electronics miniaturization, device reliability, and manufacturing cost reduction Now days, the dielectric films deposited directly on the polymer substrate are also studied widely. The processing temperature below $200^{\circ}C$ is required for polymer substrates. For a low temperature deposition, bismuth-based pyrochlore materials are known as promising candidate for capacitor $B_2Mg_{2/3}Nb_{4/3}O_7$ ($B_2MN$) multi layers were deposited on Pt/$TiO_2/SiO_2$/Si substrates by radio frequency magnetron sputtering system at room temperature. The physical and structural properties of them are investigated by SEM, AFM, TEM, XPS. The dielectric properties of MIM structured capacitors were evaluated by impedance analyzer (Agilent HP4194A). The leakage current characteristics of MIM structured capacitor were measured by semiconductor parameter analysis (Agilent HP4145B). 200 nm-thick $B_2MN$ muti layer were deposited at room temperature had capacitance density about $1{\mu}F/cm^2$ at 100kHz, dissipation factor of < 1% and dielectric constant of > 100 at 100kHz.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.493-496
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• 2005

비정질 실리콘 (a-Si)의 수소화를 통해 활성화 수소가 비정질 실리콘내의 댕글링본드 (dangling bond) 와 결합 하므로 에너지밴드의 국재준위(localized state)를 감소시켜 불순물 도핑이 가능하게 되므로 a-Si 이 전자소자로서 이용 가능하게 되었다. 이에 착안하여 본 연구에서는 경사($0^{\circ}$, $45^{\circ}$, $80^{\circ}$) 증착을 통해 비정질 칼코게나이드($a-As_{40}Ge_{10}Se_{15}S_{35}$) 박막을 제작하고 그 박막을 수소화처리 (15~20atm at $150\sim190^{\circ}C$)하여 처리 전 후의 surface morphology 변화 및 광학적 특성 변화를 고찰하였다. $a-As_{40}Ge_{10}Se_{15}S_{35}$ 박막의 SEM 측정을 통해 $40^{\circ}$와 $80^{\circ}$ 경사 증착된 $a-As_{40}Ge_{10}Se_{15}S_{35}$ 박막에서 각각 18.8nm 와 160nm의 transition layer와 박막의 기둥(columnar)구조가 형성됨을 관찰하였다. 특히, $80^{\circ}$ 증착박막의 경우 수소처리전 columnar구조는 약 $65\sim70^{\circ}$의 기둥 각을 가지고 형성되었고 수소화 처리를 통해 기둥구조가 붕괴 되었다. $70^{\circ}$ 경사 증착된 $a-As_{40}Ge_{10}Se_{15}S_{35}$ 박막은 $0^{\circ}$에 따른 박막 보다 흡수단 부근에서 약 20%의 투과도 증가와 광 에너지 갭 ($E_{op}$)의 증가를 관찰 할 수 있었다. $80^{\circ}$경사 증착된 수소처리 박막에서 흡수단 부근의 투과도가 약 10%증가 되었고, 광 에너지 갭은 약 0.07eV 증가 하였고, PL intensity는 흡수단 부근에서 증가한 것을 확인 할 수 있었다. 이러한 변화들은 경사 증착된 $a-As_{40}Ge_{10}Se_{15}S_{35}$ 박막 내의 상대적으로 원자 밀도가 큰 기둥(columnar)구조가 생성되고, 이 원자 밀도가 높은 기둥구조의 댕글링본드와 주입된 수소가 흡착하여 에너지대의 국재준위를 감소시키기 때문으로 판단된다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.363-363
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• 2008

The development of dry etching process for sapphire wafer with plasma has been key issues for the opto-electric devices. The challenges are increasing control and obtaining low plasma induced-damage because an unwanted scattering of radiation is caused by the spatial disorder of pattern and variation of surface roughness. The plasma-induced damages during plasma etching process can be classified as impurity contamination of residual etch products or bonding disruption in lattice due to charged particle bombardment. Therefor, fine pattern technology with low damaged etching process and high etch rate are urgently needed. Until now, there are a lot of reports on the etching of sapphire wafer with using $Cl_2$/Ar, $BCl_3$/Ar, HBr/Ar and so on [1]. However, the etch behavior of sapphire wafer have investigated with variation of only one parameter while other parameters are fixed. In this study, we investigated the effect of pressure and other parameters on the etch rate and the selectivity. We selected $BCl_3$ as an etch ant because $BCl_3$ plasmas are widely used in etching process of oxide materials. In plasma, the $BCl_3$ molecule can be dissociated into B radical, $B^+$ ion, Cl radical and $Cl^+$ ion. However, the $BCl_3$ molecule can be dissociated into B radical or $B^+$ ion easier than Cl radical or $Cl^+$ ion. First, we evaluated the etch behaviors of sapphire wafer in $BCl_3$/additive gases (Ar, $N_2,Cl_2$) gases. The behavior of etch rate of sapphire substrate was monitored as a function of additive gas ratio to $BCl_3$ based plasma, total flow rate, r.f. power, d.c. bias under different pressures of 5 mTorr, 10 mTorr, 20 mTorr and 30 mTorr. The etch rates of sapphire wafer, $SiO_2$ and PR were measured with using alpha step surface profiler. In order to understand the changes of radicals, volume density of Cl, B radical and BCl molecule were investigated with optical emission spectroscopy (OES). The chemical states of $Al_2O_3$ thin films were studied with energy dispersive X-ray (EDX) and depth profile anlysis of auger electron spectroscopy (AES). The enhancement of sapphire substrate can be explained by the reactive ion etching mechanism with the competition of the formation of volatile $AlCl_3$, $Al_2Cl_6$ or $BOCl_3$ and the sputter effect by energetic ions.

• Journal of the Korean Society of Radiology
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• v.6 no.1
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• pp.73-77
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• 2012

Recently, Interest to the photoconductor, which is used to flat form X-ray detector such as a-Se, $HgI_2$, PbO, CdTe, $PbI_2$ etc. is increasing. In this study, the film layer by using the photoconductive material with particle sedimentation was fabricated and evaluated. The quantization efficiency of the continuous X-ray with the 70 kVp energy bandwidth was analyzed by using the Monte Carlo simulation. With the results, the thickness of film with 64 % quantization efficiency was 180 ${\mu}m$ which is similar to the efficiency of 500 ${\mu}m$ a-Se film. And $HIg_2$ film has the high quantization efficiency of 74 % on 240 ${\mu}m$ thickness. The electrical characteristics of the 239 ${\mu}m$ $Hgl_2$ films produced by particle sedimentation were shown as very low dark current(under 10 $pA/mm^2$), and high sensitivity(19.8 mC/mR-sec) with 1 $V/{\mu}m$ input voltage. The SNR, which is influence to the contrast of X-ray image, was shown highly as 3,125 in low driving voltage on 0.8 $V/{\mu}m$. With the results of this study, the development of the low-cost, high-performance image detector with film could be possible by replacing the film produced by particle sedimentation instead to a-Se detector.