• Bulletin of the Korean Chemical Society
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• 제29권5호
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• pp.1038-1042
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• 2008

Mono and multilayer TiO2(Fe, $PEG_{600}$) films were deposited by the dip-coating on $SiO_2$/glass substrate using sol-gel method. In an attempt to improve the antibacterial properties of doped $TiO_2$ films, the influence of the iron oxides and polyethilenglycol ($PEG_{600}$) on the morphological, optical, surface chemical composition and biological properties of nanostructured layers was studied. Complementary measurements were performed including Spectroscopic Ellipsometry (SE), Scanning Electron Microscopy (SEM) coupled with the fractal analysis, X-Ray Photoelectron Spectroscopy (XPS) and antibacterial tests. It was found that different concentrations of Fe and $PEG_{600}$ added to coating solution strongly influence the porosity and morphology at nanometric scale related to fractal behaviour and the elemental and chemical states of the surfaces as well. The thermal treatment under oxidative atmosphere leads to films densification and oxides phase stabilization. The antibacterial activity of coatings against Escherichia Coli bacteria was examined by specific antibacterial tests.

• 한국재료학회지
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• 제22권10호
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• pp.552-561
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• 2012

Diamond-like carbon (DLC) films have been widely used in many industrial applications because of their outstanding mechanical and chemical properties like hardness, wear resistance, lubricous property, chemical stability, and uniformity of deposition. Also, DLC films coated on paper, polymer, and metal substrates have been extensively used. In this work, in order to improve the printing quality and plate wear of polymer printing plates, different deposition conditions were used for depositing DLC on the polymer printing plates using the Pulsed DC PECVD method. The deposition temperature of the DLC films was under $100^{\circ}C$, in order to prevent the deformation of the polymer plates. The properties of each DLC coating on the polymer concave printing plate were analyzed by measuring properties such as the roughness, surface morphology, chemical bonding, hardness, plate wear resistance, contact angle, and printing quality of DLC films. From the results of the analysis of the properties of each of the different DLC deposition conditions, the deposition conditions of DLC + F and DLC + Si + F were found to have been successful at improving the printing quality and plate wear of polymer printing plates because the properties were improved compared to those of polymer concave printing plates.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.377-377
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• 2012

Microprocessor technology now relies on copper for most of its electrical interconnections. Because of the high diffusivity of copper, Atomic layer deposition (ALD) $TaN_x$ is used as a diffusion barrier to prevent copper diffusion into the Si or $SiO_2$. Another problem with copper is that it has weak adhesion to most materials. Strong adhesion to copper is an essential characteristic for the new barrier layer because copper films prepared by electroplating peel off easily in the damascene process. Thus adhesion-enhancing layer of cobalt is placed between the $TaN_x$ and the copper. Because, cobalt has strong adhesion to the copper layer and possible seedless electro-plating of copper. Until now, metal film has generally been deposited by physical vapor deposition. However, one draw-back of this method is poor step coverage in applications of ultralarge-scale integration metallization technology. Metal organic chemical vapor deposition (MOCVD) is a good approach to address this problem. In addition, the MOCVD method has several advantages, such as conformal coverage, uniform deposition over large substrate areas and less substrate damage. For this reasons, cobalt films have been studied using MOCVD and various metal-organic precursors. In this study, we used $C_{12}H_{10}O_6(Co)_2$ (dicobalt hexacarbonyl tert-butylacetylene, CCTBA) as a cobalt precursor because of its high vapor pressure and volatility, a liquid state and its excellent thermal stability under normal conditions. Furthermore, the cobalt film was also deposited at various $H_2/NH_3$ gas ratio(1, 1:1,2,6,8) producing pure cobalt thin films with excellent conformality. Compared to MOCVD cobalt using $H_2$ gas as a reactant, the cobalt thin film deposited by MOCVD using $H_2$ with $NH_3$ showed a low roughness, a low resistivity, and a low carbon impurity. It was found that Co/$TaN_x$ film can achieve a low resistivity of $90{\mu}{\Omega}-cm$, a low root-mean-square roughness of 0.97 nm at a growth temperature of $150^{\circ}C$ and a low carbon impurity of 4~6% carbon concentration.

• 한국재료학회지
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• 제18권4호
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• pp.169-174
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• 2008

The structural and electrical properties of amorphous $BaSm_2Ti_4O_{12}$ (BSmT) films on a $TiN/SiO_2/Si$ substrate deposited using a RF magnetron sputtering method were investigated. The deposition of BSmT films was carried out at $300^{\circ}C$ in a mixed oxygen and argon ($O_2$ : Ar = 1 : 4) atmosphere with a total pressure of 8.0 mTorr. In particular, a 45 nm-thick amorphous BSmT film exhibited a high capacitance density and low dissipation factor of $7.60\;fF/{\mu}m2$ and 1.3%, respectively, with a dielectric constant of 38 at 100 kHz. Its capacitance showed very little change, even in GHz ranges from 1.0 GHz to 6.0 GHz. The quality factor of the BSmT film was as high as 67 at 6 GHz. The leakage current density of the BSmT film was also very low, at approximately $5.11\;nA/cm^2$ at 2 V; its conduction mechanism was explained by the the Poole-Frenkel emission. The quadratic voltage coefficient of capacitance of the BSmT film was approximately $698\;ppm/V^2$, which is higher than the required value (<$100\;ppm/V^2$) for RF application. This could be reduced by improving the process condition. The temperature coefficient of capacitance of the film was low at nearly $296\;ppm/^{\circ}C$ at 100 kHz. Therefore, amorphous BSmT grown on a TiN substrate is a viable candidate material for a metal-insulator-metal capacitor.

• 한국전기전자재료학회논문지
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• 제27권12호
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• pp.825-830
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• 2014

$[(Co_{1-x}Cu_x)_{0.2}(Ni_{0.3}Mn_{0.7})_{0.8}]_3O_4$ ($0{\leq}x{\leq}1$) thin films prepared by metal organic decomposition process were fabricated on SiN/Si substrate for infrared sensor application. Their structural and electrical properties were investigated with variation of Cu dopant. The $[(Co_{1-x}Cu_x)_{0.2}(Ni_{0.3}Mn_{0.7})_{0.8}]_3O_4$ (CCNMO) film annealed at $500^{\circ}C$ exhibited a dense microstructure and a homogeneous crystal structure with a cubic spinel phase. Their crystallinity was further enhanced with increasing doped Cu amount. The 120 nm-thick CCNMO (x=0.6) thin film had a low resistivity of $53{\Omega}{\cdot}cm$ at room temperature while the Co-free film (x=1) showed a significantly decreased resistivity of $5.9{\Omega}{\cdot}cm$. Furthermore, the negative temperature coefficient of resistance (NTCR) characteristics were lower than $-2%/^{\circ}C$ for all the specimens with $x{\geq}0.6$. These results imply that the CCNMO ($x{\geq}0.6$) thin films are a good candidate material for infrared sensor application.

• 한국자기학회지
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• 제13권2호
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• pp.64-69
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• 2003

Si 기판 위에 $\alpha$-Fe$_2$O$_3$을 하지층으로 하는 Ba-ferrite 박막을 pulsed laser deposition system으로 제조하여 결정학적 및 자기적 성질을 X선 회절, SEM, Mossbauer 분광법 및 VSM을 사용하여 연구하였다. $\alpha$-Fe$_2$O$_3$박막은 Si 기판위에 PLD를 이용하여 기판온도 400 $^{\circ}C$, 산소압력 0.1 Torr로 5분간 증착 하였고 그 위에 두께를 달리하여 Ba-ferrite 박막을 제조하였다. Ba-ferrite 결정은 가늘고 긴 모양의 결정립들로 형성되었으며 두께에 따라 그 모양과 상태가 변화하였다. Mossbauer 분광법으로부터 Ba-ferrite 결정내의 Fe 원자의 스핀 방향은 두께가 얇을수록 하지층의 영향으로 기판에 수직으로 정렬하려는 경향을 보이고 있음을 확인하였다. 자기이력곡선의 각형비 역시 두께가 얇을수록 더 크며 이러한 특성은 수평에 비하여 수직의 경우가 더 강하게 나타났다. 보자력 역시 같은 경향을 보이나 포화자화의 값은 수평의 경우에 더 큰 값을 나타내었다. 결정구조는 Magnetoplumbite로서 두께가 작아질수록 결정상수 $\alpha$는 감소하고 c는 증가하는 경향을 보였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.183-184
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• 2013

Two main MBE growth techniques have been used: plasma-assisted MBE (PA-MBE), which utilizes a rf plasma to supply active nitrogen, and ammonia MBE, in which nitrogen is supplied by pyrolysis of NH3 on the sample surface during growth. PA-MBE is typically performed under metal-rich growth conditions, which results in the formation of gallium droplets on the sample surface and a narrow range of conditions for optimal growth. In contrast, high-quality GaN films can be grown by ammonia MBE under an excess nitrogen flux, which in principle should result in improved device uniformity due to the elimination of droplets and wider range of stable growth conditions. A drawback of ammonia MBE, on the other hand, is a serious memory effect of NH3 condensed on the cryo-panels and the vicinity of heaters, which ruins the control of critical growth stages, i.e. the native oxide desorption and the surface reconstruction, and the accurate control of V/III ratio, especially in the initial stage of seed layer growth. In this paper, we demonstrate that the reliable and reproducible growth of GaN on Si (110) substrates is successfully achieved by combining two MBE growth technologies using rf plasma and ammonia and setting a proper growth protocol. Samples were grown in a MBE system equipped with both a nitrogen rf plasma source (SVT) and an ammonia source. The ammonia gas purity was ＞99.9999% and further purified by using a getter filter. The custom-made injector designed to focus the ammonia flux onto the substrate was used for the gas delivery, while aluminum and gallium were provided via conventional effusion cells. The growth sequence to minimize the residual ammonia and subsequent memory effects is the following: (1) Native oxides are desorbed at $750^{\circ}C$ (Fig. (a) for [$1^-10$] and [001] azimuth) (2) 40 nm thick AlN is first grown using nitrogen rf plasma source at $900^{\circ}C$ nder the optimized condition to maintain the layer by layer growth of AlN buffer layer and slightly Al-rich condition. (Fig. (b)) (3) After switching to ammonia source, GaN growth is initiated with different V/III ratio and temperature conditions. A streaky RHEED pattern with an appearance of a weak ($2{\times}2$) reconstruction characteristic of Ga-polarity is observed all along the growth of subsequent GaN layer under optimized conditions. (Fig. (c)) The structural properties as well as dislocation densities as a function of growth conditions have been investigated using symmetrical and asymmetrical x-ray rocking curves. The electrical characteristics as a function of buffer and GaN layer growth conditions as well as the growth sequence will be also discussed. Figure: (a) RHEED pattern after oxide desorption (b) after 40 nm thick AlN growth using nitrogen rf plasma source and (c) after 600 nm thick GaN growth using ammonia source for (upper) [110] and (lower) [001] azimuth.

• 한국결정성장학회지
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• 제18권5호
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• pp.217-224
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• 2008

수평 전기로에서 $ZnIn_2Se_4$ 단결정을 합성하여 HWE(Hot Wall Epitaxy)방법으로 $ZnIn_2Se_4$ 단결정 박막을 반절연성 GaAs(100) 기판에 성장시켰다. $ZnIn_2Se_4$ 단결정 박막의 성장 조건을 증발원의 온도 $630^{\circ}C$, 기판의 온도 $400^{\circ}C$였고 성장 속도는 0.5 $\mu m/hr$였다. $ZnIn_2Se_4$ 단결정 박막의 결정성의 조사에서 10K에서 광발광(photoluminescence) 스펙트럼이 682.7nm ($1.816{\underline{1}}eV$)에서 exciton emission 스펙트럼이 가장 강하게 나타났으며, 또한 이중결정 X-선 요통곡선(DCRC)의 반폭치(FWHM)도 128 arcsec로 가장 작아 최적 성장 조건임을 알 수 있었다. Hall 효과는 van der Pauw 방법에 의해 측정되었으며, 온도에 의존하는 운반자 농노와 이동도는 293 K에서 각각 $9.41\times10^{16}/cm^{-3}$, $292cm^2/V{\cdot}s$였다. $ZnIn_2Se_4$/SI(Semi-Insulated) GaAs(100) 단결정 박막의 광흡수와 광전류 spectra를 293 K에서 10K까지 측정하였다. 광흡수 스펙트럼으로부터 band gap $E_g(T)$는 varshni공식에 따라 계산한 결과 $E_g(T)=1.8622\;eV-(5.23\times10^{-4}eV/K)T^2/(T+775.5K)$ 이었으며 광전류 스펙트럼으로부터 Hamilton matrix(Hopfield quasicubic mode)법으로 계산한 결과 crystal field splitting energy ${\Delta}cr$값이 182.7meV이며 spin-orbit energy ${\Delta} so$값은 42.6meV임을 확인하였다. 10 K일 때 광전류 봉우리들은 n= 1, 27일때 $A_{1}-$, $B_{1}-$와 $C_{27}-exciton$ 봉우리임을 알았다.

• 한국결정성장학회지
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• 제21권3호
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• pp.99-104
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• 2011

단결정 성장을 위한 $MgGa_2Se_4$ 다결정은 수평 전기로에서 합성하였으며, 결정구조는 rhombohedral이고 격자상수 $a_0$는 3.953 ${\AA}$, $c_0$는 38.890 ${\AA}$였다. $MgGa_2Se_4$ 단결정박막은 HWE(Hot Wall Epitaxy) 방법으로 반절연성 GaAs(100)기판에 성장시켰다. 단결정박막의 성장 조건은 증발원의 온도 $610^{\circ}C$, 기판의 온도 $400^{\circ}C$에서 진행되었으며 성장 속도는 0.5 ${\mu}m/h$였다. 단결정박막의 결정성은 이중 결정 x-선 회절곡선의 반폭치와 X-선 회절무늬의 ${\omega}-2{\theta}$로부터 구하여 최적 성장 조건을 알 수 있었다. Hall 효과는 van der Pauw 방법에 의해 측정되었으며, 온도에 의존하는 운반자 농도와 이동도는 293 K에서 각각 $6.21{\times}10^{18}/cm^3$, 248 $cm^2/v{\cdot}s$였다. $MgGa_2Se_4$/SI(Semi-Insulated) GaAs(100) 단결정 박막의 광흡수 스펙트럼을 10 K에서 293 K까지 측정하였다. 광흡수 스펙트럼으로부터 구한 에너지 갭 $E_g(T)$는 varshni 공식 $E_g(T)=E_g(0)=({\alpha}T^2/T+{\beta})$을 잘 만족함을 알 수 있었다. 여기서 $E_g(0)=2.34\;eV$, ${\alpha}=8.81{\times}10^{-4}\;eV/K$, ${\beta}=251\;K$였다.

• 한국재료학회지
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• 제4권6호
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• pp.715-722
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• 1994

"Smart window"에 코팅재료로 쓰이는 thermochromic $Vo_{2}$박막을 전자빔 증착 방법으로 유리 기판위에 증착시켜 $0^{\circ}C$-$90^{\circ}C$ 온도범위에서 가시광 및 근적외선의 투과율을 spectrophotometer로 측정하였다. $300^{\circ}C$의 기판온도와 $400^{\circ}C$ 어닐링 온도가 $VO_{2}$ 박막이 결정화되기 때문인 것으로 확인되었다. 또한, $VO_{2}$박막을 알곤중에서 어닐링하면 500nm이하의 파장에서는 그 투과율이 상당히 낮아지는 것으로 나타났다. W가 5a/0첨가된 $V_{0.95}W_{0.05}O_{2}$박막은 약 $0^{\circ}C$의 천이돈도를 나타내었고 Sn이 0.5a/o $V_{0.995}W_{0.005}O_{2}$박막의 경우에는 $300^{\circ}C$의 기판온도에서 증착한 후 $450^{\circ}C$/5시간 동안 알곤가스 중에서 어닐링하였을때 뚜렷한 thermochromism을 나타내었으며 이 박막의 천이온도는 실용가능한 온도인 약 $25^{\circ}C$로 발견되었으며 약간의 이력곡선이 나타났다.력곡선이 나타났다.